EQM08-5KC-G5PQ737-T0
（QK-SB210-PE0427-A）
(1/8)
1. Scope
This document shall cover the specifications of the ceramic resonator applied for clock oscillator of a
microcomputer.
2. Kyocera's Type Name
PRQC8.00CR1010V00L
3. Customer's Type Name
-
4. Electrical Characteristics
Table 1 Product Specification
Items
Oscillating Frequency
Initial Frequency Tolerance
Resonant Impedance
Temperature Characteristics
on Oscillating Frequency
(Temperature Drift)
Standard Test IC
Withstanding Voltage
Max. Input Signal Voltage
Insulation Resistance
Operating Temperature
Range
Storage Temperature
Range
Aging for 3 Years
on Oscillating Frequency
Specifications
8.00 MHz
0.10 %
500
max.
0.02 %
（
0 to + 70 °C
）
MC74HCU04 (Freescale)
100V D.C. 10 seconds max
15 Vp-p
100 M
min (at 10V D.C.)
0 to + 70 °C
0 to + 70 °C
0.03%
at 25°C from initial value
4-1. Measurement Condition
The reference temperature shall be 25 ± 2 °C. The measurement shall be performed in the
temperature range from 15 °C to 35 °C unless otherwise the result is doubtful.
4-2. Measurement Circuit
Oscillating frequency shall be measured using the Kyocera standard test circuit shown in Fig 1.
EQM08-5KC-G5PQ737-T0
（QK-SB210-PE0427-A）
(3/8)
6. Part Numbering Guide
PRQC 8.00 C R 10 10 V 00L
A
B
C D E F
G
H
7. Environmental Characteristics
Table 2 Enviromental Characteristics
A. Series (MHz Band SMD Ceramic Resonator)
B. Oscillating Frequency (eg. 8.00 MHz)
C. Type
D. Packing (Tape & Reel 3000 pcs/Reel)
E. Initial Frequency Tolerance
F. Bult-in Capacitor (10pF: Standard)
G. Operating Temp. Range
H. Unique Code
Items
7-1. Humidity
7-2. High
Temperature
7-3. Low
Temperature
7-4. Temperature
Cycle
7-5. Mechanical
Shock
7-6. Vibration
Conditions
After leaving in a chamber at 90 to 95 % R.H. and 60 2°C for 1000 +12/-0 hours
and then left at room temperature for 1 hour the resonator shall meet the
specifications shown in Table 3.
After leaving in a chamber at 85 2°C for 1000 +12/-0 hours and then left at room
temperature for 1 hour, the resonator shall meet the specifications shown in Table
3.
After leaving in a chamber at
–40
3°C for 1000 +12/-0 hours and then left at room
temperature for 1 hour, the resonator shall meet the specifications shown in Table
3.
After leaving in a chamber at
–40
3 °C for 30 minutes, then the resonator is left at
85 2°C for 30 minutes. This procedure is one cycle. After leaving in 1000 cycles,
and then left at room temperature for 1 hour, the resonator shall meet the
specifications shown in Table 3.
After applying the acceleration at 29430m/sec
2
{3000G} in each of X, Y and Z axis
(each 3 time), the resonator shall meet the specifications in Table 3.
After applying the vibration at amplitude 1.5 mm and 10 to 55 Hz of vibration
frequency in each of 3 mutually perpendicular directions for 1 hour, the resonator
shall meet the specifications shown in Table 3.
At first, being soaked in the Methanol (JIS K1501) solution containing Rosin (JIS
K5902) for 5 seconds and next being soaked in a bath of Pb/Sn solder at 235 5°C
for 4 0.5 seconds, then more than 95% the surface of the electrode terminal shall
be soldered.
At first, leaving at 150 to 180°C of pre-heat for 90 to 120 seconds, next left at peak
temperature 260+0/-5°C, over 230°C for 30 to 40seconds (2times). Finally leaving
at room temperature for 1 hour. The resonator shall meet the specifications shown
in Table 3.
1)Ultrasonic cleaning: The resonator is washed with iso-propyl alcohol at room
temperature with condition of 20KW/m
3
and 28kHz for 60sec.
No significant damage on the resonator shall occur and marking shall be safely
readable.
2)Soaking cleaning: The resonator is soaked in iso-propyl alcohol at room
temperature for 90sec. No significant damage on the resonator shall
occur and marking shall be safely readable.
After soldered on the board specified as below, then the load which cause 3 mm
bent to the board is applied, the resonator shall meet the specifications in Table 3
1.2
1.2
and cause no defect in the appearance.
50
20
7-7. Solderability
7-8. Reflow
Soldering
7-9. Cleaning
7-10. Bend
strength
R230
3.0
45
45
(Units: mm)
3 - 0.4
Material: Glass-epoxy
Thickness: 0.8mm / Size: L100mm x W40
Recommendable land pattern
Solder paste: 0.2mm Thickness
Fig.3 Bend Strength
1.9
∼
2.1
F
Embedded System
京公网安备 11010802033920号
EEWORLD
