M55342K08G825ET-W datasheet, PDF

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M55342K08G825ET-W: DescriptionFixed Resistor, Metal Glaze/thick Film, 0.8W, 825000ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2010, CHIP; CategoryPassive components The resistor; File Size102KB，1 Pages; ManufacturerState of the Art Inc.; Environmental Compliance

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M55342K08G825ET-W Overview

Fixed Resistor, Metal Glaze/thick Film, 0.8W, 825000ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2010, CHIP

M55342K08G825ET-W Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Objectid	1950951985
package instruction	CHIP
Reach Compliance Code	compliant
Country Of Origin	USA
ECCN code	EAR99
YTEOL	7.8
structure	Chip
JESD-609 code	e4
Installation features	SURFACE MOUNT
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-55 °C
Package height	0.64 mm
Package length	5.13 mm
Package shape	RECTANGULAR PACKAGE
Package form	SMT
Package width	2.38 mm
method of packing	WAFFLE PACK
Rated power dissipation(P)	0.8 W
Rated temperature	70 °C
Guideline	MIL-PRF-55342
resistance	825000 Ω
Resistor type	FIXED RESISTOR
size code	2010
surface mount	YES
technology	METAL GLAZE/THICK FILM
Temperature Coefficient	100 ppm/°C
Terminal surface	Gold (Au)
Terminal shape	WRAPAROUND
Tolerance	1%
Operating Voltage	150 V

M55342K08G825ET-W Preview

State of the Art, Inc.

Thick Film Chip Resistor

M55342/08 RM 2010

CURRENT NOISE

TEMPERATURE RISE (°C)

GLASS

PASSIVATION

WRAPAROUND

TERMINATIONS

RESISTOR

FILM

96% ALUMINA CHIP

PERFORMANCE

Resistance Range

Tolerances

Maximum Power

Maximum Voltage

- 22M

1%, 2%, 5%, 10%

800 mW

150 Volts

CHARACTERISTICS*

±100

±0.5%

±0.25%

±0.5%

±300

±0.5%

±0.25%

±0.5%

±2.0%

±1.0%

POWER DISSIPATION

fiber epoxy board

ceramic board

TESTS

TCR (-55 to +125

C) in ppm/

Thermal Shock

Low Temperature Operation

Short-time Overload

Resistance to Soldering Heat

Moisture Resistance

Life, 2,000 Hours

High Temperature Exposure

POWER DISSIPATION (WATTS)

LIFE TEST

POWER DERATING

*Maximum allowable change per MIL-PRF-55342,

typical change is 10% of these values.

PART NUMBERING

M55342 K 08 B 100D S - TR

PACKAGING CODE: TR = Tape & Reel W= Waffle Pack

PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% S: 0.001% T: Space Level C: Non - ER

RESISTANCE AND TOLERANCE CODE:

Three significant digits, with a letter indicating the

decimal location, the tolerance, and the value range.

D: 1%

E: 1% K

F: 1% M

G: 2%

H: 2% K

T: 2% M

J: 5%

K: 5% K

L: 5% M

M: 10%

N: 10% K

P: 10% M

TERMINATION MATERIALS:

B: Solderable wraparound C: Epoxy bondable palladium/silver wraparound U: Epoxy bondable platinum/gold wraparound

G: Gold wraparound

W: Gold wire bondable

SIZE CODE: /08 = RM2010

TEMPERATURE CHARACTERISTIC: K: ± 100ppm M: ± 300ppm

PERFORMANCE SPECIFICATION MIL-PRF-55342

MECHANICAL

INCHES

MILLIMETERS

.252

MINIMUM

RECOMMENDED

MOUNTING

PADS

(INCHES)

Length

Width

Thickness

Top Term

Bottom Term

Gap

Approx. Weight

.202 (.191 - .218)

.094 (.093 - .103)

.025 (.015 - .033)

.020 (.015 - .025)

.019 (.015 - .025)

.164 (.160 - .168)

.0323 grams

5.13

2.38

0.64

0.51

0.48

4.17

(4.85 - 5.54)

(2.36 - 2.62)

(0.38 - 0.84)

(0.38 - 0.64)

(4.06 - 4.27)

.100

.154

.049

State of the Art, Inc.

2470 Fox Hill Road, State College, PA 16803-1797

Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401

“Specifications subject to change without notice.”

www.resistor.com

04/09/08

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