Standard SRAM, 4KX4, 20ns, CMOS, CDFP24
| Parameter Name | Attribute value |
| Maker | Cypress Semiconductor |
| package instruction | DFP, |
| Reach Compliance Code | unknown |
| ECCN code | 3A001.A.2.C |
| Maximum access time | 20 ns |
| JESD-30 code | R-GDFP-F24 |
| JESD-609 code | e0 |
| memory density | 16384 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 4 |
| Number of functions | 1 |
| Number of terminals | 24 |
| word count | 4096 words |
| character code | 4000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 4KX4 |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DFP |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | TIN LEAD |
| Terminal form | FLAT |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| 5962-8979002KA | 5962-89790023X | 5962-8979002LX | 5962-8979002KX | |
|---|---|---|---|---|
| Description | Standard SRAM, 4KX4, 20ns, CMOS, CDFP24 | Standard SRAM, 4KX4, 20ns, CMOS, CQCC28, CERAMIC, LCC-28 | Standard SRAM, 4KX4, 20ns, CMOS, CDIP24, CERAMIC, DIP-24 | Standard SRAM, 4KX4, 20ns, CMOS, CDFP24, CERAMIC, FP-24 |
| package instruction | DFP, | QCCN, | DIP, | DFP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN code | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| Maximum access time | 20 ns | 20 ns | 20 ns | 20 ns |
| JESD-30 code | R-GDFP-F24 | S-CQCC-N28 | R-GDIP-T24 | R-GDFP-F24 |
| memory density | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 4 | 4 | 4 | 4 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 24 | 28 | 24 | 24 |
| word count | 4096 words | 4096 words | 4096 words | 4096 words |
| character code | 4000 | 4000 | 4000 | 4000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C |
| organize | 4KX4 | 4KX4 | 4KX4 | 4KX4 |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | DFP | QCCN | DIP | DFP |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | CHIP CARRIER | IN-LINE | FLATPACK |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | FLAT | NO LEAD | THROUGH-HOLE | FLAT |
| Terminal location | DUAL | QUAD | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | - |
| Parts packaging code | - | QLCC | DIP | DFP |
| Contacts | - | 28 | 24 | 24 |
| Filter level | - | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
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