DSC61XXB
Ultra-Small, Ultra-Low Power MEMS Oscillator
Features
• Wide Frequency Range: 3.5 kHz to 100 MHz
• Ultra-Low Power Consumption: 3 mA/1 µA
(Active/Standby)
• Ultra-Small Footprints
- 1.6 mm
1.2 mm
- 2.0 mm
1.6 mm
- 2.5 mm
2.0 mm
• Frequency Select Input Supports Two
Pre-Defined Frequencies
• High Stability: ±20 ppm, ±25 ppm, ±50 ppm
• Wide Temperature Range
- Automotive: –40°C to +125°C
- Ext. Industrial: –40°C to +105°C
- Industrial: –40°C to +85°C
- Ext. Commercial: –20° to +70°C
• Excellent Shock and Vibration Immunity
- Qualified to MIL-STD-883
• High Reliability
- 20x Better MTF Than Quartz Oscillators
• Supply Range of 1.71V to 3.63V
• Short Sample Lead Time: <2 weeks
• Lead Free & RoHS Compliant
• Automotive Version Available: DSA61xxB
General Description
The DSC61xxB family of MEMS oscillators combines
the industry leading low power consumption and
ultra-small packages with exceptional frequency
stability and jitter performance over temperature. The
single-output DSC61xxB MEMS oscillators are
excellent choices for use as clock references in small,
battery-powered devices such as wearable and
Internet of Things (IoT) devices in which small size, low
power consumption, and long-term reliability are
paramount.
The DSC61xxB family is available in ultra-small
1.6 mm x 1.2 mm,
2.0 mm x 1.6 mm,
and
2.5 mm x 2.0 mm packages. These packages are
“drop-in” replacements for standard 4-pin CMOS
quartz crystal oscillators. The Automotive Grade
AEC-Q100 qualified option is also available for this
device.
Package Types
DSC61
XX
B
2.5 mm x 2.0 mm VLGA
2.0 mm x 1.6 mm VFLGA
1.6 mm x 1.2 mm VFLGA
(Top View)
Applications
• Low Power/Portable Applications: IoT,
Embedded/Smart Devices
• Consumer: Home Healthcare, Fitness Devices,
Home Automation
• Industrial: Building/Factory Automation,
Surveillance Camera
• Automotive (Please Refer to the DSA61xx Family)
OE/STDBY/FS
1
4
VDD
GND
2
3
OUT
2019 Microchip Technology Inc.
DS20006155A-page 1
DSC61XXB
Block Diagram
DSC61
XX
B
DIGITAL
CONTROL
OE/STDBY/FS
PIN 1
SUPPLY
REGULATION
VDD
PIN 4
MEMS
RESONATOR
TEMP SENSOR
CONTROL &
COMPENSATION
PLL
VCO
OUTPUT
DIVIDER
DRIVER
OUTPUT
PIN 3
GND
PIN 2
DS20006155A-page 2
2019 Microchip Technology Inc.
DSC61XXB
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Supply Voltage .......................................................................................................................................... –0.3V to +4.0V
Input Voltage (V
IN
) ..............................................................................................................................–0.3V to V
DD
+0.3V
ESD Protection ............................................................................................................ 4 kV HBM, 400V MM, 2 kV CDM
ELECTRICAL CHARACTERISTICS
Electrical Characteristics:
Unless otherwise indicated, V
DD
= 1.8V –5% to 3.3V +10%, T
A
= –40°C to +125°C.
Parameters
Supply Voltage
Power Supply Ramp
Active Supply Current
Standby Supply Current
Output Duty Cycle
Frequency
Frequency Stability
Sym.
V
DD
t
PU
I
DD
I
STBY
SYM
f
0
∆f
Min.
1.71
0.1
—
—
—
45
0.0035
—
—
—
—
0.7 x V
DD
—
—
—
—
Typ.
—
—
3.0
1
1.5
—
—
—
—
—
—
—
—
—
—
300
Max.
3.63
100
—
—
—
55
100
±20
±25
±50
±5
±1
1.5
—
0.3 x V
DD
200 +
2 Periods
1
—
Units
V
ms
mA
µA
%
MHz
ppm
Note 1
Note 8
f
OUT
= 27 MHz, V
DD
= 1.8V, No
Load
V
DD
= 1.8/2.5V,
Note 2
V
DD
= 3.3V,
Note 2
—
—
All temp ranges,
Note 3
1st year @ 25°C
Per year after first year
From 90% V
DD
to valid clock
output, T = 25°C
Input Logic High,
Note 4
Input Logic Low,
Note 4
Note 5
Note 6
If configured,
Note 7
Conditions
Aging
Startup Time
Input Logic Levels
Output Disable Time
Output Enable Time
Enable Pull-up Resistor
Note 1:
2:
3:
4:
5:
6:
7:
8:
∆f
t
SU
V
IH
V
IL
t
DA
t
EN
—
ppm
ms
V
V
ns
µs
kΩ
Pin 4 V
DD
should be filtered with 0.1 µF capacitor.
Not including current through pull-up resistor on EN pin (if configured). Higher standby current seen at
>3.3V V
DD
.
Includes frequency variations due to initial tolerance, temp. and power supply voltage.
Input waveform must be monotonic with rise/fall time < 10 ms
Output Disable time takes up to two periods of the output waveform + 200 ns.
For parts configured with OE, not Standby.
Output is enabled if pad is floated or not connected.
Time to reach 90% of target V
DD
. Power ramp rise must be monotonic.
2019 Microchip Technology Inc.
DS20006155A-page 3
DSC61XXB
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics:
Unless otherwise indicated, V
DD
= 1.8V –5% to 3.3V +10%, T
A
= –40°C to +125°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Output Logic High, I = 3 mA,
Std. Drive
Output Logic High, I = 6 mA,
High Drive
Output Logic Low, I = –3 mA,
Std. Drive
Output Logic Low, I = –6 mA,
High Drive
DSC61x2
V
DD
= 1.8V
High Drive,
20% to 80%
C
L
= 15 pF V
DD
= 2.5V/3.3V
DSC61x1
V
DD
= 1.8V
Std Drive,
20% to 80%
C
L
= 10 pF V
DD
= 2.5V/3.3V
f
OUT
=
27 MHz
f
OUT
=
27 MHz
f
OUT
=
27 MHz
V
DD
= 1.8V
V
DD
= 2.5V/3.3V
V
DD
= 1.8V
V
DD
= 2.5V/3.3V
V
DD
= 1.8V
V
DD
= 2.5V/3.3V
V
OH
Output Logic Levels
V
OL
0.8 x V
DD
—
—
V
—
—
0.2 x V
DD
V
—
t
RX
/t
FX
Output Transition Time
Rise Time/Fall Time
t
RY
/t
FY
—
Period Jitter, RMS
Cycle-to-Cycle Jitter
(Peak)
Period Jitter
(Peak-to-Peak)
Note 1:
2:
3:
4:
5:
6:
7:
8:
J
PER
J
Cy–Cy
J
PP
—
—
—
—
—
—
—
—
1
0.5
1.2
0.6
8.5
7
50
35
70
60
1.5
1.0
2.0
1.2
—
—
70
60
—
—
ns
ns
ns
ns
ps
RMS
ps
ps
Pin 4 V
DD
should be filtered with 0.1 µF capacitor.
Not including current through pull-up resistor on EN pin (if configured). Higher standby current seen at
>3.3V V
DD
.
Includes frequency variations due to initial tolerance, temp. and power supply voltage.
Input waveform must be monotonic with rise/fall time < 10 ms
Output Disable time takes up to two periods of the output waveform + 200 ns.
For parts configured with OE, not Standby.
Output is enabled if pad is floated or not connected.
Time to reach 90% of target V
DD
. Power ramp rise must be monotonic.
DS20006155A-page 4
2019 Microchip Technology Inc.
DSC61XXB
TEMPERATURE SPECIFICATIONS (Note
1)
Parameters
Temperature Ranges
Junction Operating Temperature
Storage Ambient Temperature Range
Soldering Temperature
Note 1:
T
J
T
A
T
S
–40
–55
—
—
—
+260
+150
+150
—
°C
°C
°C
—
—
40 sec. max.
Sym.
Min.
Typ.
Max.
Units
Conditions
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., T
A
, T
J
,
θ
JA
). Exceeding the max-
imum allowable power dissipation will cause the device operating junction temperature to exceed the max-
imum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability.
2019 Microchip Technology Inc.
DS20006155A-page 5
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