2198241-3 datasheet, PDF - EEWORLD Datasheet

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2198241-3: DescriptionSFP+ Enhanced 1x4, Networking Heatsink; CategoryThe connector; File Size924KB，2 Pages; ManufacturerTE Connectivity; Websitehttp://www.te.com; Environmental Compliance

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2198241-3 Overview

SFP+ Enhanced 1x4, Networking Heatsink

2198241-3 Parametric

Parameter Name	Attribute value
Dimensions	SFP+
cage type	Linkage
Radiator included	yes
Connector System	cable to board
Sealable	yes
Connectors and terminals terminate to	A printed circuit board
Port matrix configuration	1 x 4
Number of ports	4
Data rate (max) (Gb/s)	16
Radiator type	Pin
Radiator height category	short
Radiator height	9.1 mm [ .358 in ]
PCB Termination Methods	Through hole - solderless connection
PCB installation method	Through hole solderless connection
Connector mounting type	board mounting
cage material	nickel silver
PCB thickness (recommended)	1.5 mm [ .059 in ]
tail length	2.05 mm [ .081 in ]
Working group temperature range	-55 – 105 °C [ -67 – 221 °F ]
Suitable for pluggable I/O products	SFP+ SMT connector
Pluggable I/O Applications	SFP+ enhanced
Circuit Application	Signal
Compatible radiators	yes
Encapsulation method	Packaging, boxes and pallets
EMI containment feature types	Elastomeric sealing ring
Light pipe included	no

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8

THIS DRAWING IS UNPUBLISHED.

RELEASED FOR PUBLICATION

BY -

7

20

6

1

5

4

3

LOC

2

DIST

1

REVISIONS

P

LTR

DESCRIPTION

DATE

DWN

APVD

C

COPYRIGHT

20

MATERIAL:

CAGE ASSEMBLY: 0.25mm THICK NICKEL SILVER ALLOY

GASKET RETENTION PLATE: STAINLESS STEEL

EMI GASKET: PLATED FILLED SILICONE

HEATSINK CLIP: STAINLESS STEEL

HEATSINK: ALUMINUM

FINISIH:

HEATSINK: ELECTROLESS NICKEL

HEATSINK CLIP: PASSIVATE

PADS AND VIAS CHASSIS GROUND.

DATUM AND BASIC DIMENSION ESTABLISHED BY CUSTOMER.

MATES WITH SFP MSA COMPLIANT TRANSCEIVERS.

INTERPRETATION OF DATUM REFERENCE FRAME IN ACCORDANCE WITH

SECT 4.4.1.1 OF ASME Y14.5M-1994.

REFERENCE APPLICATION SPEC. 114-13120, HOLE A, FOR RECOMMENDED DRILL HOLE

DIAMETER AND PLATING THICKNESS.

REFERENCE APPLICATION SPEC. 114-13120, HOLE B, FOR RECOMMENDED DRILL HOLE

DIAMETER AND PLATING THICKNESS.

HOLE PATTERN REPEATS FOR EACH PORT. SPACING BETWEEN PORTS IS 14.25mm.

10

GP

00

A

A1

A2

RELEASED PER ECO-12-013192

RELEASED PER ECO-13-014600

REVISED PER ECR-17-016799

09OCT2012

20SEP2013

01DEC2017

BMM

PP

IT

MRS

SH

2

3

MINIMUM PC BOARD THICKNESS:

SINGLE SIDED: 1.5mm

D

2198241-1,2,3,4

FINISHED ASSEMBLY WITH

PIN TYPE HEAT SINK

4

11. CERTAIN MATING TRANCEIVERS MAY REQUIRE ADDITIONAL PCB

THICKNESS THAT WOULD NEED TO BE DETERMINED BY THE CUSTOMER.

12. PRODUCT COMPLIES WITH SPECIFICATION SFF-8433 IMPROVED

PLUGGABLE FORM FACTOR FOR SFP+ GANGED CAGES.

13

5.

6.

7

8

9

D

DIMENSION APPLIES PRIOR TO INSERTION OF SFP MODULE.

2198241-5,6,7,8

FINISHED ASSEMBLY WITH

FIN TYPE HEAT SINK

( 49.2 )

4X 14 0.13

PORT OPENING

A MAX

13

C

( 9.7 )

4X 8.95 0.15

PORT OPENING

C

( 2.05 ) TYP

3X

21.375

14.25

( 57.25 )

MEASURED ACROSS CAGE SIDES

( 59.5 )

38.9

0.3

GUIDE PINS

B

2X 10.4

( 1.5 ) MIN

10

PCB THICKNESS

+0.10

-0.14

TOP OF PCB

TO INSIDE OF

BEZEL CUT-OUT

0.23

8X R 0.3

MAX

2X 58.2

( 35.4 )

2198241

MOUNTED ON PC BOARD

SHOWN THRU RECOMMENDED BEZEL

FIN TYPE

PIN TYPE

22.5

18.1

15.5

13.2

22.5

18.1

15.5

13.2

A MAX

20OCT2011

NETWORKING, SHORT

SAN

PCI

NETWORKING, TALL

2198241-8

2198241-7

2198241-6

2198241-5

2198241-4

2198241-3

2198241-2

2198241-1

PART

NUMBER

A

RECOMMENDED BEZEL CUT-OUT

SINGLE SIDED APPLICATIONS

SCALE

3:1

PIN TYPE

HEAT SINK

THIS DRAWING IS A CONTROLLED DOCUMENT.

DIMENSIONS:

TOLERANCES UNLESS

OTHERWISE SPECIFIED:

DWN

CHK

NETWORKING, SHORT

SAN

PCI

APPLICATION

NETWORKING, TALL

B. MATTHEWS

M. SCHMITT

108-2364

TE Connectivity

NAME

mm

APVD

MATERIAL

0 PLC

1 PLC

2 PLC

3 PLC

4 PLC

ANGLES

FINISH

0.1

PRODUCT SPEC

APPLICATION SPEC

SFP+ ENHANCED 1X4 CAGE ASSEMBLY,

PRESS FIT, EMI GASKET WITH HEATSINK

-

SIZE

CAGE CODE

DRAWING NO

1 $ 0'

WEIGHT

114-13120

1

4805 (3/11)

2

-

Customer Drawing

A1

00779

RESTRICTED TO

2198241

SCALE

6:1

SHEET

1

OF

2

REV

-

A2

2198241-3 Related Products

	2198241-3	2198241-4
Description	SFP+ Enhanced 1x4, Networking Heatsink	SFP+ Enhanced 1x4, Networking Heatsink
Dimensions	SFP+	SFP+
cage type	Linkage	Linkage
Radiator included	yes	yes
Connector System	cable to board	cable to board
Sealable	yes	yes
Connectors and terminals terminate to	A printed circuit board	A printed circuit board
Port matrix configuration	1 x 4	1 x 4
Number of ports	4	4
Data rate (max) (Gb/s)	16	16
Radiator type	Pin	Pin
Radiator height category	short	long
Radiator height	9.1 mm [ .358 in ]	13.5 mm [ .531 in ]
PCB Termination Methods	Through hole - solderless connection	Through hole - solderless connection
PCB installation method	Through hole solderless connection	Through hole solderless connection
Connector mounting type	board mounting	board mounting
cage material	nickel silver	nickel silver
PCB thickness (recommended)	1.5 mm [ .059 in ]	1.5 mm [ .059 in ]
tail length	2.05 mm [ .081 in ]	2.05 mm [ .081 in ]
Working group temperature range	-55 – 105 °C [ -67 – 221 °F ]	-55 – 105 °C [ -67 – 221 °F ]
Suitable for pluggable I/O products	SFP+ SMT connector	SFP+ SMT connector
Pluggable I/O Applications	SFP+ enhanced	SFP+ enhanced
Circuit Application	Signal	Signal
Compatible radiators	yes	yes
Encapsulation method	Packaging, boxes and pallets	Packaging, boxes and pallets
EMI containment feature types	Elastomeric sealing ring	Elastomeric sealing ring
Light pipe included	no	no

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