Part No. 96-080M80 - QFP to PGA Adapter
for EIAJ 80 Position, .0315 [.80] Pitch
FEATURES:
• Convert surface mount QFP packages to a 13 x 13 PGA
footprint.
• Reduce costs by using less expensive QFP packages to
replace PGA footprints in existing designs.
• Pins are mechanically fastened and soldered to board
using Aries’ patented process, creating a reliable electri-
cal connection and rugged contact.
• Consult factory for panelized form or for mounting of con-
signed chips.
SPECIFICATIONS:
• Adapter body is black FR-4 with 1 ounce minimum
Copper traces.
• Pads are bare Copper protected with Entek
®
by Enthone
or immersion white tin to eliminate coplanarity concerns
and solder bridges associated with hot air solder leveling.
• Pins are Brass Alloy 360 1/2 hard per UNS C36000
ASTM-B16-85.
• Pin plating is 200µ [5.08µm] min. 93/7 Tin/Lead per MIL-
P-81728 over 100µ [2.54µm] min. Nickel per QQ-N-290.
• Operating temperature=221°F [105°C].
MOUNTING CONSIDERATIONS:
• Suggested PCB hole size=.028 ± .003 [.71 ± .08] dia.
• Will plug into standard PGA sockets.
Note: Aries specializes in custom design and production. In addition to the
standard products shown on this page, special materials, platings, sizes, and
configurations can be furnished, depending on quantities. Aries reserves the
right to change product specifications without notice.
ORDERING INFORMATION
Specify Part No.
96-080M80
-or-
96-080M80-P
for panelized form
when ordering
Specify Part Number
80-PGM13070-30
for wire wrap PGA socket
A
LL
DIMENSIONS
:
INCHES
[
MILLIMETERS
]
Row-to-row:
Pin-to-pin:
All others:
Tolerances:
± .003 [± .08]
± .003 [± .08] non-cumulative
± .005 [.13] unless otherwise specified
X-RAY VIEW TOP SIDE
QFP PAD ASSIGNMENT
TOP (QFP) SIDE
http://www.arieselec.com • info@arieselec.com
REV. E
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NORTH AMERICA
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TEL: (908) 996-6841
FAX: (908) 996-3891
UK/IRELAND/GB
TEL: +44 870 240 0249
FAX: +44 1653 600493
uking@arieselec.com
EUROPE/MAINLAND/HOLLAND
TEL: +31 78 615 94 65
FAX: +31 78 615 43 11
18018
europe@arieselec.com