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XQFM10312000C

Description
RES,SMT,THIN FILM,1.2K OHMS,100WV,.2% +/-TOL,-25,25PPM TC,0202 CASE
CategoryPassive components    The resistor   
File Size83KB,3 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Download Datasheet Parametric View All

XQFM10312000C Overview

RES,SMT,THIN FILM,1.2K OHMS,100WV,.2% +/-TOL,-25,25PPM TC,0202 CASE

XQFM10312000C Parametric

Parameter NameAttribute value
Objectid1220574521
package instructionSMT, 0202
Reach Compliance Codeunknown
Country Of OriginUSA
ECCN codeEAR99
YTEOL8.5
structureChip
Manufacturer's serial numberQFM
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package height0.254 mm
Package length0.5 mm
Package formSMT
Package width0.5 mm
method of packingTray
Rated power dissipation(P)0.025 W
GuidelineMIL-STD-883
resistance1200 Ω
Resistor typeFIXED RESISTOR
seriesQFM
size code0202
technologyTHIN FILM
Temperature Coefficient25 ppm/°C
Tolerance0.2%
Operating Voltage100 V
QFM
Vishay Electro-Films
Thin Film, Top-Contact Resistor
CHIP
RESISTORS
FEATURES
Product may not
be to scale
Wire bondable
Small size, 0.020 inches square
Resistance range: 1.0
Ω
to 1 MΩ
DC power rating: 25 mW
The QFM series tantulum nitride on quartz single-value
resistor chips offer a small size, wide ohmic value range and
excellent frequency response.
The QFMs tantalum nitride resistor material offers excellent
resistance to high moisture environments.
The QFMs are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology. The QFMs are 100 % electrically tested and
visually inspected to MIL-STD-883.
Quartz substrate: < 0.1 pF shunt capacitance
Resistor material: Tantalum nitride, self passivating
Moisture resistant
APPLICATIONS
The QFM top-contact resistor chips are designed to handle substantial power loads in many types of hybrid packages. They are
ideally suited for this purpose because of their small size.
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES
Tightest Standard Tolerance Available
1 % 0.5 %
0.1 %
± 25 ppm/°C
± 50 ppm/°C
± 100 ppm/°C
± 250 ppm/°C
PROCESS CODE
CLASS H*
103
101
102
100
Aluminum terminations
CLASS K*
107
105
106
104
1
Ω
10
Ω
30
Ω
100
Ω
200 kΩ 430 kΩ 620 kΩ 1 MΩ
*MIL-PRF-38534 inspection criteria
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Noise, MIL-STD-202, Method 308
100
Ω
- 250 kΩ
< 100
Ω
or > 251 kΩ
Moisture Resistance, MIL-STD-202, Method 106
Stability, 1000 h, + 125 °C, 125 mW
Operating Temperature Range
Thermal Shock, MIL-STD-202,
Method 107, Test Condition F
High Temperature Exposure, + 150 °C, 100 h
Dielectric Voltage Breakdown
Insulation Resistance
Operating Voltage
DC Power Rating at + 70 °C (Derated to Zero at + 175 °C)
5 x Rated Power Short-Time Overload, + 25 °C, 5 s
www.vishay.com
48
For technical questions, contact: efi@vishay.com
- 35 dB typ.
- 20 dB typ.
± 0.5 % max.
ΔR/R
± (0.25 % + 0.01
Ω)
max.
ΔR/R
- 55 °C to + 125 °C
± 0.25 % max.
ΔR/R
± 0.5 % max.
ΔR/R
200 V
10
12
min.
100 V max.
25 mW
± 0.25 % max.
ΔR/R
Document Number: 61078
Revision: 14-Mar-08
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