5962-9325101MEX datasheet, PDF

5962-9325101MEX: DescriptionANALOG MULTIPLIER OR DIVIDER, 30MHz BAND WIDTH, CDIP16, FRIT SEALED, CERDIP-16; CategoryAnalog mixed-signal IC The signal circuit; File Size456KB，13 Pages; ManufacturerIntersil ( Renesas ); Websitehttp://www.intersil.com/cda/home/

Download Datasheet Parametric View All

5962-9325101MEX Overview

ANALOG MULTIPLIER OR DIVIDER, 30MHz BAND WIDTH, CDIP16, FRIT SEALED, CERDIP-16

Parameter Name	Attribute value
Objectid	2081045377
Parts packaging code	DIP
package instruction	DIP,
Contacts	16
Reach Compliance Code	unknown
ECCN code	EAR99
Analog Integrated Circuits - Other Types	ANALOG MULTIPLIER OR DIVIDER
Nominal bandwidth	30 MHz
JESD-30 code	R-GDIP-T16
length	19.05 mm
Maximum negative supply voltage (Vsup)	-15 V
Negative supply voltage minimum (Vsup)	-8 V
Nominal Negative Supply Voltage (Vsup)	-15 V
Maximum negative input voltage	-5 V
Number of functions	1
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Maximum positive input voltage	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	5.08 mm
Maximum supply voltage (Vsup)	15 V
Minimum supply voltage (Vsup)	8 V
Nominal supply voltage (Vsup)	15 V
surface mount	NO
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm

TI Power Supply Reference Design for Intel Core i3, i5, i7: This reference design is designed to power Intel Core i3, i5, i7...; fxw451 Analogue and Mixed Signal

Analysis of the schematic diagram of infrared diode sensing circuit: 1. Circuit Function Overview 　　The infrared diode sensing circuit can realize that when the hand is close to the infrared transmitting tube and the infrared receiving tube, the buzzer sounds and the L...; Aguilera Analogue and Mixed Signal

What does the flower pad in Allegro mean?: [align=left][size=14px]The flower pad, also called the heat dissipation pad, Thermal Pad, is a way to connect the inner layer of a multilayer board to other layers through vias. Sometimes the connecti...; wstt PCB Design

Challenges of Ultrafast IV Test Systems: Waveform generation [ 1] . Standard pulse generators and arbitrary waveform generators are designed to generate waveforms at fixed cycle intervals rather than the Log ( time ) numbers required for mos...; Jack_ma Test/Measurement

F407 porting MicroPython: Preparation: 1. Download rt_thread source code 2. Download ENV tool: 3. Hardware F407 4. Open the BSP/stm32f4xx-HAL folder under the rt_thread source code path and open it with the ENV tool 5. In RT-T...; 加勒比海盗 NXP MCU

[TI's first low-power design competition] FR5969 is in hand, experience + prepare devices: Maylove is a good person. He gave me a board and I tried it. It's very good. Ti's CCS is getting better and better. I believe there are many engineers developing and maintaining it. It is getting bett...; lyzhangxiang Microcontroller MCU

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components