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IS61LPS25636A-200TQLI

Description
Cache SRAM, 256KX36, 3.1ns, CMOS, PQFP100, LEAD FREE, TQFP-100
Categorystorage    storage   
File Size1010KB,35 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
Environmental Compliance  
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IS61LPS25636A-200TQLI Overview

Cache SRAM, 256KX36, 3.1ns, CMOS, PQFP100, LEAD FREE, TQFP-100

IS61LPS25636A-200TQLI Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeQFP
package instructionLQFP, QFP100,.63X.87
Contacts100
Reach Compliance Codecompli
ECCN code3A991.B.2.A
Factory Lead Time10 weeks
Maximum access time3.1 ns
Other featuresPIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)200 MHz
I/O typeCOMMON
JESD-30 codeR-PQFP-G100
JESD-609 codee3
length20 mm
memory density9437184 bi
Memory IC TypeCACHE SRAM
memory width36
Humidity sensitivity level3
Number of functions1
Number of terminals100
word count262144 words
character code256000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256KX36
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Encapsulate equivalent codeQFP100,.63X.87
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply2.5/3.3,3.3 V
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum standby current0.105 A
Minimum standby current3.14 V
Maximum slew rate0.275 mA
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn) - annealed
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperature10
width14 mm
Base Number Matches1
IS61LPS51218A, IS61LPS25636A, IS61LPS25632A, IS64LPS25636A,
IS61VPS51218A, IS61VPS25636A
256K x 36, 256K x 32, 512K x 18
9 Mb SYNCHRONOUS PIPELINED,
SINgLE CYCLE DESELECT STATIC RAM
FEATURES
• Internal self-timed write cycle
• Individual Byte Write Control and Global Write
• Clock controlled, registered address, data and
control
• Burst sequence control using MODE input
• Three chip enable option for simple depth ex-
pansion and address pipelining
• Common data inputs and data outputs
• Auto Power-down during deselect
• Single cycle deselect
• Snooze MODE for reduced-power standby
• JTAG Boundary Scan for BGA package
• Power Supply
LPS: V
dd
3.3V + 5%,
V
ddq
3.3V/2.5V + 5%
VPS: V
dd
2.5V + 5%,
V
ddq
2.5V + 5%
• JEDEC 100-Pin QFP, 119-ball BGA, and 165-
ball BGA packages
• Lead-free available
JUNE
2015
IS64LPS25636A and IS61LPS/VPS51218A are high-
speed, low-power synchronous static RAMs
designed
to provide burstable,
high-performance
memory for com-
munication and networking applications. The IS61LPS/
VPS25636A and IS64LPS25636A are organized as
262,144 words by 36 bits. The IS61LPS25632A
is
organized as 262,144 words by 32 bits. The IS61LPS/
VPS51218A is organized as 524,288 words by 18 bits.
Fabricated with
ISSI
's advanced CMOS technology,
the device integrates a 2-bit burst counter, high-speed
SRAM core, and high-drive capability outputs into a single
monolithic circuit. All synchronous inputs pass through
registers controlled by a positive-edge-triggered single
clock input.
Write cycles are internally self-timed and are initiated by
the rising edge of the clock input. Write cycles can be
one to four bytes wide as controlled by the write control
inputs.
Separate byte enables allow individual bytes to be written.
The byte write operation is performed by using the byte
write enable (BWE) input combined with one or more
individual byte write signals (BWx).
In addition, Global
Write (GW)
is available for writing all bytes at one time,
regardless of the byte write controls.
Bursts can be initiated with either ADSP
(Address Status
Processor) or ADSC
(Address Status Cache Controller)
input pins. Subsequent burst addresses can be gener-
ated internally and controlled by the
ADV
(burst address
advance) input pin.
The mode pin is used to select the burst sequence or-
der, Linear burst is achieved when this pin is tied LOW.
Interleave burst is achieved when this pin is tied HIGH
or left floating.
DESCRIPTION
The
ISSI
IS61LPS/VPS25636A, IS61LPS25632A,
FAST ACCESS TIME
Symbol
t
kq
t
kc
Parameter
Clock Access Time
Cycle Time
Frequency
250
2.6
4
250
200
3.1
5
200
166
3.5
6
166
Units
ns
ns
MHz
Copyright © 2014 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no
liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on
any published information and before placing orders for products.
Integrated Silicon Solution, Inc.
Rev.
N
05/25/2015
1

IS61LPS25636A-200TQLI Related Products

IS61LPS25636A-200TQLI IS61LPS51218A-200TQLI IS64LPS25636A-166TQLA3 IS64LPS25636A-166TQLA3-TR IS61LPS25636A-200B3I IS61LPS25636A-200B3LI IS61LPS25636A-200TQ2LI IS61LPS25636A-200TQI-TR IS61LPS51218A-200TQI IS61LPS25636A-200B2I
Description Cache SRAM, 256KX36, 3.1ns, CMOS, PQFP100, LEAD FREE, TQFP-100 Cache SRAM, 512KX18, 3.1ns, CMOS, PQFP100, LEAD FREE, TQFP-100 Cache SRAM, 256KX36, 3.8ns, CMOS, PQFP100, TQFP-100 IC SRAM 9MBIT 166MHZ 100TQFP Cache SRAM, 256KX36, 3.1ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, PLASTIC, BGA-165 Cache SRAM, 256KX36, 3.1ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-165 Cache SRAM, 256KX36, 3.1ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, LQFP-100 256KX36 CACHE SRAM, 3.1ns, PQFP100, TQFP-100 512KX18 CACHE SRAM, 3.1ns, PQFP100, TQFP-100 Cache SRAM, 256KX36, 3.1ns, CMOS, PBGA119, 14 X 22 MM, 1 MM PITCH, PLASTIC, BGA-119
package instruction LQFP, QFP100,.63X.87 LQFP, QFP100,.63X.87 LQFP, QFP100,.63X.87 LQFP, TBGA, BGA165,11X15,40 TBGA, BGA165,11X15,40 LQFP, TQFP-100 TQFP-100 BGA, BGA119,7X17,50
Reach Compliance Code compli compliant compliant unknown compliant compliant compliant compliant compliant compliant
Maximum access time 3.1 ns 3.1 ns 3.8 ns 3.8 ns 3.1 ns 3.1 ns 3.1 ns 3.1 ns 3.1 ns 3.1 ns
JESD-30 code R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PBGA-B165 R-PBGA-B165 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PBGA-B119
length 20 mm 20 mm 20 mm 20 mm 15 mm 15 mm 20 mm 20 mm 20 mm 22 mm
memory density 9437184 bi 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit
Memory IC Type CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM
memory width 36 18 36 36 36 36 36 36 18 36
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of terminals 100 100 100 100 165 165 100 100 100 119
word count 262144 words 524288 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 524288 words 262144 words
character code 256000 512000 256000 256000 256000 256000 256000 256000 512000 256000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 125 °C 125 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 256KX36 512KX18 256KX36 256KX36 256KX36 256KX36 256KX36 256KX36 512KX18 256KX36
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LQFP LQFP LQFP LQFP TBGA TBGA LQFP LQFP LQFP BGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Maximum seat height 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.2 mm 1.2 mm 1.6 mm 1.6 mm 1.6 mm 2.41 mm
Maximum supply voltage (Vsup) 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V
Minimum supply voltage (Vsup) 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.165 V 3.135 V 3.135 V 3.135 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL AUTOMOTIVE AUTOMOTIVE INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING GULL WING GULL WING GULL WING BALL BALL GULL WING GULL WING GULL WING BALL
Terminal pitch 0.65 mm 0.65 mm 0.65 mm 0.65 mm 1 mm 1 mm 0.65 mm 0.65 mm 0.65 mm 1.27 mm
Terminal location QUAD QUAD QUAD QUAD BOTTOM BOTTOM QUAD QUAD QUAD BOTTOM
width 14 mm 14 mm 14 mm 14 mm 13 mm 13 mm 14 mm 14 mm 14 mm 14 mm
Is it lead-free? Lead free Lead free Lead free - Contains lead Lead free - Contains lead Contains lead Contains lead
Is it Rohs certified? conform to conform to conform to - incompatible conform to conform to incompatible incompatible incompatible
Parts packaging code QFP QFP QFP - BGA BGA - QFP QFP BGA
Contacts 100 100 100 - 165 165 - 100 100 119
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A - 3A991.B.2.A 3A991.B.2.A - 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Factory Lead Time 10 weeks 10 weeks 12 weeks 12 weeks - 10 weeks 10 weeks 12 weeks 12 weeks 10 weeks
Other features PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE - PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK) 200 MHz 200 MHz 166 MHz - 200 MHz 200 MHz - - 200 MHz 200 MHz
I/O type COMMON COMMON COMMON - COMMON COMMON - - COMMON COMMON
JESD-609 code e3 e3 e3 - e0 e1 - e0 e0 e0
Output characteristics 3-STATE 3-STATE 3-STATE - 3-STATE 3-STATE - - 3-STATE 3-STATE
Encapsulate equivalent code QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87 - BGA165,11X15,40 BGA165,11X15,40 - - QFP100,.63X.87 BGA119,7X17,50
Peak Reflow Temperature (Celsius) 260 260 260 - NOT SPECIFIED 260 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V - 2.5/3.3,3.3 V 2.5/3.3,3.3 V - - 2.5/3.3,3.3 V 2.5/3.3,3.3 V
Certification status Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified
Maximum standby current 0.105 A 0.105 A 0.13 A - 0.105 A 0.105 A - - 0.105 A 0.105 A
Minimum standby current 3.14 V 3.14 V 3.14 V - 3.14 V 3.14 V - - 3.14 V 3.14 V
Maximum slew rate 0.275 mA 0.275 mA 0.3 mA - 0.275 mA 0.275 mA - - 0.275 mA 0.275 mA
Terminal surface Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed - Tin/Lead (Sn/Pb) Tin/Silver/Copper (Sn/Ag/Cu) - TIN LEAD Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature 10 40 40 - NOT SPECIFIED 40 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Base Number Matches 1 1 1 1 1 1 1 1 - -
Maker - - Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) - Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI )
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