M55342M05U210DSTR datasheet, PDF

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M55342M05U210DSTR: DescriptionFixed Resistor, Metal Glaze/thick Film, 0.225W, 210ohm, 175V, 1% +/-Tol, 300ppm/Cel, Surface Mount, 2208, CHIP; CategoryPassive components The resistor; File Size95KB，1 Pages; ManufacturerState of the Art Inc.

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M55342M05U210DSTR Overview

Fixed Resistor, Metal Glaze/thick Film, 0.225W, 210ohm, 175V, 1% +/-Tol, 300ppm/Cel, Surface Mount, 2208, CHIP

M55342M05U210DSTR Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Objectid	1612384509
package instruction	CHIP
Reach Compliance Code	not_compliant
Country Of Origin	USA
ECCN code	EAR99
YTEOL	6
structure	Chip
JESD-609 code	e4
Manufacturer's serial number	M55342/05
Installation features	SURFACE MOUNT
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-65 °C
Package height	0.71 mm
Package length	5.72 mm
Package shape	RECTANGULAR PACKAGE
Package form	SMT
Package width	1.78 mm
method of packing	TR
Rated power dissipation(P)	0.225 W
Rated temperature	70 °C
Guideline	MIL-PRF-55342
resistance	210 Ω
Resistor type	FIXED RESISTOR
series	M55342/05-THICKFILM
size code	2208
surface mount	YES
technology	METAL GLAZE/THICK FILM
Temperature Coefficient	300 ppm/°C
Terminal surface	Platinum/Gold (Pt/Au)
Terminal shape	WRAPAROUND
Tolerance	1%
Operating Voltage	175 V

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State of the Art, Inc.

Thick Film Chip Resistor

M55342/05 RM2208

GLASS

PASSIVATION

WRAPAROUND

TERMINATIONS

RESISTOR

FILM

96% ALUMINA CHIP

PERFORMANCE

TEMPERATURE RISE (°C)

Resistance Range

Tolerances

Maximum Power

Maximum Voltage

- 22M

1%, 2%, 5%, 10%

225 mW

175 Volts

CHARACTERISTICS*

±100

±0.5%

±0.25%

±0.5%

±300

±0.5%

±0.25%

±0.5%

±2.0%

±1.0%

CURRENT NOISE

POWER DISSIPATION

fiber epoxy board

ceramic board

TESTS

TCR (-55 to +125

C) in ppm/

Thermal Shock

Low Temperature Operation

Short-time Overload

Resistance to Soldering Heat

Moisture Resistance

Life, 2,000 Hours

High Temperature Exposure

POWER DISSIPATION (WATTS)

LIFE TEST

POWER DERATING

*Maximum allowable change per MIL-PRF-55342,

typical change is 10% of these values.

PART NUMBERING

M55342 K 05 B 100D S - TR

PACKAGING CODE: TR = Tape & Reel W= Waffle Pack

PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% S: 0.001% T: Space Level C: Non - ER

RESISTANCE AND TOLERANCE CODE:

Three significant digits, with a letter indicating the

decimal location, the tolerance, and the value range.

D: 1%

E: 1% K

F: 1% M

G: 2%

H: 2% K

T: 2% M

J: 5%

K: 5% K

L: 5% M

M: 10%

N: 10% K

P: 10% M

TERMINATION MATERIALS:

B: Solderable wraparound C: Epoxy bondable palladium/silver wraparound U: Epoxy bondable platinum/gold wraparound

W: Gold wire bondable

G: Gold wraparound

SIZE CODE: /05 = RM2208

TEMPERATURE CHARACTERISTIC: K: ± 100ppm M: ± 300ppm

PERFORMANCE SPECIFICATION MIL-PRF-55342

MECHANICAL

INCHES

MILLIMETERS

.275

MINIMUM

RECOMMENDED

MOUNTING

PADS

(INCHES)

Length

Width

Thickness

Top Term

Bottom Term

Gap

Approx. Weight

.225 (.223 - .237)

.070 (.070 - .080)

.028 (.015 - .033)

.020 (.015 - .025)

.185 (.181 - .189)

.0262 grams

5.72

1.78

0.71

0.51

4.70

(5.66 - 6.02)

(1.78 - 2.03)

(0.38 - 0.84)

(0.38 - 0.64)

(4.60 - 4.80)

.076

.175

.050

State of the Art, Inc.

2470 Fox Hill Road, State College, PA 16803-1797

Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401

“Specifications subject to change without notice.”

www.resistor.com

04/09/08

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