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822202B00000

Description
heatsink stamp 25.4x12.7x30mm
CategoryThermal management products   
File Size358KB,1 Pages
ManufacturerComair Rotron
Environmental Compliance  
Download Datasheet Parametric View All

822202B00000 Overview

heatsink stamp 25.4x12.7x30mm

822202B00000 Parametric

Parameter NameAttribute value
Datasheets
822202B00000
Fans, Blowers, Impellers Catalog
Catalog Drawings
821x02B00000
Standard Package50
CategoryFans, Thermal Manageme
FamilyThermal - Heat Sinks
TypeBoard Level, Vertical
Package CooledTO-220
Attachment MethodBolt On and PC Pi
ShapeRectangular, Fins
Length1.180" (29.97mm)
Width1.000" (25.40mm)
Diamete-
Height Off Base (Height of Fin)0.500" (12.70mm)
Power Dissipation @ Temperature Rise2W @ 30°C
Thermal Resistance @ Forced Air Flow5°C/W @ 500 LFM
Thermal Resistance @ Natural-
MaterialAluminum
Material FinishBlack Anodized
Other Names822202B00000-NDCR474
Board Level
Heat Sinks
P/N: 822202B00000
TO-220
PRODUCT SPECIFICATIONS
Devices: TO-220
Size: 25.4 x 12.7 x 30.0 mm
Material: Aluminum, 1.2 mm Thick
Weight: 4.3 grams
Type: Stamped
PCB Mounting: Solderable Tabs
Finish: Black Anodized
Package: Bulk
Optional Hardware: Thermal Interface
Material
Air Velocity - LFM
0
C
200
400
600
800
1000
10
8
6
4
2
0
Thermal Resistance -
o
C/ Watt
(Mounting Surface to Ambient)
100
80
60
40
20
0
0
2
4
6
8
10
Heat Dissipated - Wattts
FEATURES & BENEFITS
• Hole for Device Attachment
• Vertical Mounting via Solderable Tabs
• RoHS Compliant
CUSTOMIZED HEATSINKS
• Specialized Tabs, Plating
• Specialized Body Configurations
• Contact Applications Engineering
8929 Terman Court, San Diego, CA 92121
Ph (858) 348-6200 Fax (858) 566-4577
E-mail: sales@comairrotron.com,
Web: www.comairrotron.com
Temp Rise Above Ambient -
(Mounting Surface)
o
COMAIR ROTRON, INC

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