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832202B00000

Description
heatsink stamp 20x5x25mm
CategoryThermal management products   
File Size238KB,1 Pages
ManufacturerComair Rotron
Environmental Compliance  
Download Datasheet Parametric View All

832202B00000 Overview

heatsink stamp 20x5x25mm

832202B00000 Parametric

Parameter NameAttribute value
Datasheets
832202B00000
Fans, Blowers, Impellers Catalog
Catalog Drawings
832202B00000
Standard Package50
CategoryFans, Thermal Manageme
FamilyThermal - Heat Sinks
TypeBoard Level
Package CooledTO-220
Attachment MethodCli
ShapeRectangul
Length0.984" (25mm)
Width0.787" (20mm)
Diamete-
Height Off Base (Height of Fin)0.197" (5.00mm)
Power Dissipation @ Temperature Rise1.5W @ 40°C
Thermal Resistance @ Forced Air Flow4°C/W @ 500 LFM
Thermal Resistance @ Natural-
MaterialAluminum
Material FinishBlack Anodized
Other Names832202B00000-NDCR508
Board Level
Heat Sinks
P/N: 832202B00000
TO-220
PRODUCT SPECIFICATIONS
• Devices: TO-220
• Size: 20.0 x 5.0 x 25.0 mm
• Material: Aluminum, 0.8 mm thick
• Type: Stamped
• Finish: Black Anodized
• PCB Mounting: Device Leads
• IC Mounting: Integrated Spring
• Package: Bulk
Air Velocity - LFM
0
100
Temp Rise Above Ambient -
o
C
(Mounting Surface)
80
60
40
20
0
200
400
600
800
1000
20
16
12
8
4
0
0
1
2
3
4
5
Heat Dissipated - Watts
(Mounting Surface to Ambient)
Thermal Resistance -
o
C/ Watt
FEATURES & BENEFITS
No Hardware Device Attachment
Constant Spring Force Tension
Device Alignment Rails
• RoHS Compliant
CUSTOMIZED HEATSINKS
Specialized Plating
Specialized Body Configurations
• Contact Applications Engineering
COMAIR ROTRON, INC
8929 Terman Court, San Diego, CA 92121
Ph (858) 348-6200 Fax (858) 566-4577
E-mail: sales@comairrotron.com,
Web: www.comairrotron.com
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