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831502B00000

Description
heatsink stamp 19x12.8x12.7mm
CategoryThermal management products   
File Size363KB,1 Pages
ManufacturerComair Rotron
Environmental Compliance  
Download Datasheet Parametric View All

831502B00000 Overview

heatsink stamp 19x12.8x12.7mm

831502B00000 Parametric

Parameter NameAttribute value
Datasheets
831502B00000
831502B00000
Fans, Blowers, Impellers Catalog
Product Photos
831502B00000
Catalog Drawings
83(1,3)(5,3)02B0 Series
Standard Package50
CategoryFans, Thermal Manageme
FamilyThermal - Heat Sinks
TypeBoard Level
Package CooledTO-220, TO-262
Attachment MethodCli
ShapeRectangular, Fins
Length0.750" (19.05mm)
Width0.504" (12.80mm)
Diamete-
Height Off Base (Height of Fin)0.500" (12.70mm)
Power Dissipation @ Temperature Rise1W @ 30°C
Thermal Resistance @ Forced Air Flow8°C/W @ 300 LFM
Thermal Resistance @ Natural-
MaterialAluminum
Material FinishBlack Anodized
Other Names831502B00000-NDCR466
Board Level
Heat Sinks
P/N: 831502B00000
TO-220,
TO-262
PRODUCT SPECIFICATIONS
• Devices: TO-220 & TO-262
• Size: 19.0 x 12.8 x 12.7 mm
• Material: Aluminum, 1.2 mm Thick
• Weight: 1.8 grams
• Type: Stamped
• IC Mounting: Integrated Spring
• PCB Mounting: Device Leads
Finish: Black
Anodized
• Package: Bulk
Air Velocity - LFM
0
100
Temp Rise Above Ambient -
0
C
(Mounting Surface)
200
400
600
800
1000
10
8
6
4
2
0
Thermal Resistance -
0
C/Watt
(Mounting Surface to Ambient)
80
60
40
20
0
0
1
2
3
4
5
Heat Dissapated - Watts
FEATURES & BENEFITS
• No Hardware Device Attachment
• Constant Spring Force Tension
• RoHS Compliant
CUSTOMIZED HEATSINKS
• Specialized Tabs, Plating
• Specialized Body Configurations
• Contact Applications Engineering
COMAIR ROTRON, INC
8929 Terman Court, San Diego, CA 92121
Ph (858) 348-6200 Fax (858) 566-4577
E-mail: sales@comairrotron.com,
Web: www.comairrotron.com

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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