Bond-Ply 100
®
Thermally Conductive, Fiberglass Reinforced Pressure Sensitive Adhesive Tape
Features and Benefits
• Thermal impedance:
0.52°C-in
2
/W (@50 psi)
• High bond strength to a variety of surfaces
• Double-sided, pressure sensitive
adhesive tape
• High performance, thermally conductive
acrylic adhesive
• Can be used instead of heat-cure adhesive,
screw mounting or clip mounting
PROPERTY
Color
Reinforcement Carrier
Thickness (inch) / (mm)
Temp. Resistance, 30 sec. (°F) / (°C)
Elongation (%45° to Warp & Fill)
Tensile Strength (psi) / (MPa)
CTE (ppm)
Glass Transition (°F) / (°C)
Continuous Use Temp (°F) / (°C)
ADHESION
Lap Shear @ RT (psi) / (MPa)
Lap Shear after 5 hr @ 100°C
Lap Shear after 2 min @ 200°C
Static Dead Weight Shear (°F) / (°C)
ELECTRICAL
Dielectric Breakdown Voltage - 0.005" (Vac)
Dielectric Breakdown Voltage - 0.008" (Vac)
Dielectric Breakdown Voltage - 0.011" (Vac)
Flame Rating
THERMAL
Thermal Conductivity (W/m-K)
THERMAL PERFORMANCE vs PRESSURE
Initial Assembly Pressure (psi for 5 seconds)
TO-220 Thermal Performance (°C/W) 0.005"
TO-220 Thermal Performance (°C/W) 0.008"
TO-220 Thermal Performance (°C/W) 0.011"
Thermal Impedance (°C-in
2
/W) 0.005" (1)
Thermal Impedance (°C-in /W) 0.008" (1)
2
TYPICAL PROPERTIES OF BOND-PLY 100
IMPERIAL VALUE
White
Fiberglass
0.005, 0.008, 0.011
392
70
900
325
-22
-22 to 248
100
200
200
302
METRIC VALUE
White
Fiberglass
0.127, 0.203, 0.279
200
70
6
325
-30
-30 to 120
0.7
1.4
1.4
150
VALUE
3000
6000
8500
V-O
0.8
10
5.17
5.40
6.59
0.56
0.82
1.03
25
4.87
5.35
6.51
0.54
0.80
1.02
50
4.49
5.28
6.51
0.52
0.78
1.01
TEST METHOD
Visual
—
ASTM D374
—
ASTM D412
ASTM D412
ASTM D3386
ASTM D1356
—
ASTM D1002
ASTM D1002
ASTM D1002
PSTC#7
TEST METHOD
ASTM D149
ASTM D149
ASTM D149
U.L.94
ASTM D5470
100
4.18
5.22
6.50
0.50
0.77
1.00
200
4.10
5.20
6.40
0.50
0.75
0.99
Typical Applications
Include:
• Mount heat sink onto BGA graphic
processor or drive processor
• Mount heat spreader onto power
converter PCB or onto motor control PCB
Configurations Available:
• Sheet form, roll form and die-cut parts
Shelf Life:
The double-sided, pressure
sensitive adhesive used in Bond-Ply products
requires the use of dual liners to protect
the surfaces from contaminants. Bergquist
recommends a 6-month shelf life at a
maximum continuous storage temperature
of 35°C or 3-month shelf life at a maximum
continuous storage temperature of 45°C, for
maintenance of controlled adhesion to the
liner.The shelf life of the Bond-Ply material,
without consideration of liner adhesion
(which is often not critical for manual assembly
processing), is recommended at 12 months
from date of manufacture at a maximum
continuous storage temperature of 60°C.
Thermal Impedance (°C-in /W) 0.011" (1)
2
1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These
values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and
pressure applied.
Building a Part Number
BP100
–
0.008
– 00
– 1112 –
NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
1112 = 11" x 12" sheets,11250 = 11" x 250' rolls
or 00 = custom configuration
00 = No adhesive
Standard thicknesses available: 0.005", 0.008", 0.011"
BP100 = Bond-Ply 100 Material
Section B
Section C
Note: To build a part number, visit our website at www.bergquistcompany.com.
www.bergquistcompany.com
The Bergquist Company -
North American Headquarters
18930 West 78th Street
Chanhassen, MN 55317
Phone: 800-347-4572
Fax: 952-835-0430
The Bergquist Company -
European Headquarters
Netherlands
Phone: 31-35-5380684
Fax: 31-35-5380295
The Bergquist Company -
Asia Headquarters
Hong Kong
Phone: 852-2690-9296
Fax: 852-2690-2344
All statements, technical information and recommendations herein are based on tests we believe to be reliable, and
THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED
WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers’ and manufacturers’ only obligation shall be to
replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product
for its intended use, and the user assumes all risks and liability whatsoever in connection therewith. NEITHER SELLER NOR
MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT,
INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR
THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not
contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.
PDS_BP100_1011
Section D
Section A
Microchip MCU
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