KM23C32100-25 datasheet, PDF - EEWORLD Datasheet

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KM23C32100-25: DescriptionMASK ROM, 2MX16, 250ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42; Categorystorage storage; File Size95KB，5 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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KM23C32100-25 Overview

MASK ROM, 2MX16, 250ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42

KM23C32100-25 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	SAMSUNG
Parts packaging code	DIP
package instruction	DIP, DIP42,.6
Contacts	42
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	250 ns
JESD-30 code	R-PDIP-T42
JESD-609 code	e0
length	52.43 mm
memory density	33554432 bit
Memory IC Type	MASK ROM
memory width	16
Number of functions	1
Number of terminals	42
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2MX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP42,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum standby current	0.0001 A
Maximum slew rate	0.1 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm
Base Number Matches	1

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KM23C32100-25 Related Products

	KM23C32100-25	KM23C32100-20	KM23C32100-15
Description	MASK ROM, 2MX16, 250ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42	MASK ROM, 2MX16, 200ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42	MASK ROM, 2MX16, 150ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42
Is it lead-free?	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible
Maker	SAMSUNG	SAMSUNG	SAMSUNG
Parts packaging code	DIP	DIP	DIP
package instruction	DIP, DIP42,.6	DIP, DIP42,.6	DIP, DIP42,.6
Contacts	42	42	42
Reach Compliance Code	unknown	unknown	unknow
ECCN code	EAR99	EAR99	EAR99
Maximum access time	250 ns	200 ns	150 ns
JESD-30 code	R-PDIP-T42	R-PDIP-T42	R-PDIP-T42
JESD-609 code	e0	e0	e0
length	52.43 mm	52.43 mm	52.43 mm
memory density	33554432 bit	33554432 bit	33554432 bi
Memory IC Type	MASK ROM	MASK ROM	MASK ROM
memory width	16	16	16
Number of functions	1	1	1
Number of terminals	42	42	42
word count	2097152 words	2097152 words	2097152 words
character code	2000000	2000000	2000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C
organize	2MX16	2MX16	2MX16
Output characteristics	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP
Encapsulate equivalent code	DIP42,.6	DIP42,.6	DIP42,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	5.08 mm	5.08 mm
Maximum standby current	0.0001 A	0.0001 A	0.0001 A
Maximum slew rate	0.1 mA	0.1 mA	0.1 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V
surface mount	NO	NO	NO
technology	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	15.24 mm	15.24 mm	15.24 mm
Base Number Matches	1	1	-

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