datasheet
EEWORLDEEWORLDEEWORLD
Datasheet
Part Number

Keyword

Search
Keyword

Part Number

Search
Datasheet> All Categories > Passive components> capacitor> 0603Y331MAXB
PDF
Preview

0603Y331MAXB

Description
Ceramic Capacitor, Ceramic, 50V, 20% +Tol, 20% -Tol, X7R, -/+15ppm/Cel TC, 0.00033uF, 0603,
CategoryPassive components    capacitor   
File Size974KB，3 Pages
ManufacturerSRT Micro Ceramique
Environmental Compliance
Download Datasheet Parametric View All

0603Y331MAXB Overview

Ceramic Capacitor, Ceramic, 50V, 20% +Tol, 20% -Tol, X7R, -/+15ppm/Cel TC, 0.00033uF, 0603,

0603Y331MAXB Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid913752644
package instruction, 0603
Reach Compliance Codecompliant
ECCN codeEAR99
capacitance0.00033 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high0.9 mm
JESD-609 codee3
length1.6 mm
negative tolerance20%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package formSMT
method of packingTR, 7 Inch
positive tolerance20%
Rated (DC) voltage (URdc)50 V
seriesMLCC(X7R)
size code0603
Temperature characteristic codeX7R
Temperature Coefficient15% ppm/°C
Terminal surfaceTin (Sn) - with Nickel (Ni) barrier
width0.8 mm

0603Y331MAXB Preview

MLCC X7R type 2
GENRAL SPECIFICATIONS
Ag/Pd, Ni/Sn and Polymer termination available
Operating Temperature
–55°C, +125°C
Temperature Coefficient
±15% with 0Vdc applied
Pb
Dissipation factor
Un<16V 5% max at 1Vrms and 1kHz
16V<Un<25V 2,5% max at 1Vrms and 1kHz
25V<Un<50V 1% max at 1Vrms and 1kHz
Aging Rate
1% max per decade
Insulation Resistance
(IR)
25°C/Un 100 000 MOhm or 1000 Ohm-Farad whichever is less
125°C/Un 10 000 MOhm or 100 Ohm-Farad whichever is less
ORDERING INFORMATION
0805
SIZE
0402
0603
0805
1206
1210
1812
1825
2220
2225
3640
5440
6660
A
DIELECTRIC
A = COG
Y = X7R
X = BX
U = Z5U
V = Y5V
Q = High Q
220
CAPACITANCE
Expressed in
picofarads
(pF) .
The first two
digits are
significant, the
third digit give
the number of
noughts.
Example :
102= 1000pF
J
TOLERANCE
C = ± 0.25pF
D = ± 0.5 Pf
F = ± 1%
G = ± 2%
J = ± 5%
K = ± 10%
M = ± 20%
Z = -20%,+80%
A
VOLTAGE
J = 16V
X = 25V
A = 50V
B = 100V
C = 200V
P = 250V
D = 300V
E = 500V
G = 1000V
H = 2000V
I = 3000V
K = 4000V
L = 5000V
M = 6000V
p
TERMINATION
F = Palladium-
Silver
X = Nickel with
Tin plated finish
P = polymer
with Tin plated
finish
C = Copper with
Tin plated finish
B
PACKAGING
B = 7" reel
V = Bulk
DIMENSIONS
in millimeters
Designation
L
0402
1.00 ±0.1
0603
1.60±0.1
0805
2.00±0.2
1206
3.20±0.2
1210
3.20±0.2
1812
4.50±0.3
1825
4.50±0.3
2220
5.70±0.4
2225
5.70±0.4
3640
9.2±0.4
5440
13.80±0.5
6660
16.80±0.6
W
0.50±0.1
0.80±0.1
1.25±0.2
1.60±0.2
2.50±0.2
3.20±0.2
6.40±0.3
5.00±0.4
6.40±0.4
10.2±0.4
10.2±0.4
15.20±0.4
T
0.60
0.90
1.40
1.70
1.70
2.20
2.20
2.20
2.20
3.00
3.20
5.50
P min.
0.10
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.5
0.5
P max.
0.40
0.45
0.70
0.70
0.80
0.80
0.80
0.80
0.80
0.80
1.50
2.00
For P termination (Polymer type) add 0.20 mm to all dimensions
Rev : 10-02-12 This document is subject to change without notice.
MLCC X7R type 2
STANDARD SIZES
SIZE
Voltage (Vdc)
101
121
151
181
221
271
331
391
471
561
681
821
102
122
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
274
334
394
474
564
684
824
105
125
155
185
225
275
335
395
475
100pF
120pF
150pF
180pF
220pF
270pF
330pF
390pF
470pF
560pF
680pF
820pF
1nF
1.2nF
1.5nF
1.8nF
2.2nF
2.7nF
3.3nF
3.9nF
4.7nF
5.6nF
6.8nF
8.2nF
10nF
12nF
15nF
18nF
22nF
27nF
33nF
39nF
47nF
56nF
68nF
82nF
100nF
120nF
150nF
180nF
220nF
270nF
330nF
390nF
470nF
560nF
680nF
820nF
1µF
1.2µF
1.5µF
1.8µF
2.2µF
2.7µF
3.3µF
3.9µF
4.7µF
16
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
0402
25
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
50
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
16
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
0603
25
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
50
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
100
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
16
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
0805
25
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
50
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
100
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
16
1206
25
50
100
16
1210
25
50
100
25
1812
50
100
25
1825
50
100
25
2220
50
100
25
2225
50
100
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
Other sizes available on request. Example : 0504,0907, 1808, 3033
Rev : 10-02-12 This document is subject to change without notice.
MLCC X7R type 2
TYPICAL CHARACTERISTICS
X7R Capacitance and dissipation factor vs temperature
BX Capacitance and dissipation factor vs temperature
X7R Voltage coefficient of capacitance
BX Voltage coefficient of capacitance
X7R and BX Aging
X7R and BX Insulation resistance vs temperature
X7R Impedance vs frequency
BX Impedance vs frequency
Rev : 10-02-12 This document is subject to change without notice.
More (Only the first 5 pages are displayed. Please Download Datasheet to view the full content.) >

Recommended Resources

Infrared remote control transmitter/receiver circuit

Low supply voltage diode temperature measurement circuit

AC switch circuit controlled by NAND gate

Voice control light circuit diagram

Computer motherboard circuit diagram 440GX_19

Video amplifier circuit: Video amplifier board-2

Abnormal help
[code] ((CBitmapButton*)GetDlgItem(ctrId))->LoadBitmaps(resId,0,0,0); [/code] If the above code is executed several times, the following exception will appear. First-chance exception in Ad.exe:0x80000...
lixinqing Embedded System
Membrane switch components
Membrane switch is an operating system that integrates key functions, indicating elements, and instrument panels. It consists of four parts: panel, upper circuit, isolation layer, and lower circuit. W...
xiaowai90 Integrated technical exchanges
Problems with using WINDOWS API for serial ports
The code is very simple, as follows: CString sPort = "Com10"; //Open a serial port device HANDLE hCom=CreateFile(sPort, GENERIC_READ | GENERIC_WRITE, 0, NULL, OPEN_EXISTING, FILE_ATTRIBUTE_NORMAL | FI...
sunny2002 Embedded System
EEWORLD University ---- LPC800: Use 32-bit performance to improve your 8-bit application
LPC800: Boost your 8-bit applications with 32-bit performance : https://training.eeworld.com.cn/course/595...
chenyy MCU
EEWORLD University - How to solve the error problem when running PSoC Creator after installation
How to solve the error problem when running after PSoC Creator is installed : https://training.eeworld.com.cn/course/2013This video describes how to resolve register errors when running PSoC Creator a...
chenyy Embedded System
ARM development process.
Personally, I think it’s good!...
小惠19999 ARM Technology
Shortcut:   S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components

  1. TTC03B102G39D1
  2. 1N5688B
  3. 64-25434-44-0300
  4. SIP-4769-01-1962-G
  5. SIT3373AE-1B3-30EG220.123456D
  6. REBS-Z1-G
  7. 135X-27R4-AT601Q
  8. BC050-44C-K0-0200-0160-0250-LE
  9. CM2831GXIM25
  10. 1SMA5921-AU_B1_00001
  11. CR1210F634RP05Z
  12. QR0402J220KP40

Popular Articles

  1. Western Digital's core is open source to further lower the threshold of RISC-V chips
  2. Is it normal to see -dBm in FFT analysis results?
  3. Silan Microelectronics' private placement is completed: many powerful funds participated, and the issue price was discounted by nearly 10%
  4. DRAM prices fall for the first time in 10 months, has the downward cycle begun?
  5. GaN's excitement in the fast charging market has only just begun
  6. In the era of connected cars, how can we ensure the reliability of car antennas?
  7. Improved design of display panel structure of magnetic flap level gauge and its necessity
  8. How to modify the PLC timer setting value
  9. Issues that require attention when using a digital oscilloscope
  10. stc89c52 pin diagram and pin function description

Technical ResourceMore

  1. Design of broadband DC amplifier based on single chip microcomputer MSP430F449
  2. RTD2662 board source code
  3. STM32USART1 serial port receiving program (interrupt mode)
  4. Compressed sensing theory and development
  5. Design of Parallel Execution Model in xPC Real-time Semi-Physical Simulation Platform
  6. Design of remote monitoring system for temperature and humidity based on SHT11
  7. Research on RS485 Bus Network Reliability
  8. Maintenance Essentials and Examples of the Top Ten Movement Color Displays_Volume 3
  9. Design of fingerprint recognition electronic password lock based on single chip microcomputer
  10. Automated brightness non-uniformity measurement of flat panel displays based on VESA306-1

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

About Us Customer Service Contact Information Datasheet Sitemap LatestNews
Index Files: 556  206  2418  2479  626  12  5  49  50  13 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号