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LE75183DDSC

Description
line card lcas 1chiple 20soic
CategoryWireless rf/communication    Telecom circuit   
File Size438KB,26 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Environmental Compliance
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LE75183DDSC Overview

line card lcas 1chiple 20soic

LE75183DDSC Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicrosemi
Parts packaging codeSOIC
package instructionSOP,
Contacts20
Reach Compliance Codecompli
JESD-30 codeR-PDSO-G20
JESD-609 codee3
length12.8 mm
Number of functions1
Number of terminals20
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Certification statusNot Qualified
Maximum seat height2.65 mm
Nominal supply voltage5 V
surface mountYES
Telecom integrated circuit typesTELECOM CIRCUIT
Temperature levelINDUSTRIAL
Terminal surfaceMATTE TIN
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
width7.5 mm
Base Number Matches1
Le75183
A
Voice Solution
Central office
DLC
PBX
DAML
HFC/FITL
Line Card Access Switch
VE750 Series
DESCRIPTION
The VoiceEdge™ family VE750 series of Line Card Access
Switches (LCAS), which includes the Le75181, Le75282 and
Le75183 devices, is a family of monolithic solid-state switches
that is designed to provide both power ringing access and test
access on the analog line card. These devices, while not a pin-
for-pin replacement for the traditional electromechanical relay
(EMR) solution, provide the equivalent switching functionality.
The VE750 series of LCAS is meant as a solid-state alternative
to the EMRs.
The Le75183A/B/C/D devices are pin-for-pin compatible with
Legerity’s L7583A/B/C/D devices.
Legerity also offers a range of compatible SLIC devices and
codec/filters that can be used with the VE750 series LCAS for
complete line card solutions that can be used worldwide in
analog line card applications.
APPLICATIONS
FEATURES
Small size/surface-mount packaging
Monolithic IC reliability
Low impulse noise
Make-before-break, break-before-make operation
Clean, bounce-free switching
Low, matched ON-resistance
Built-in current limiting, thermal shutdown, and SLIC
protection
5-V only operation, very low power consumption
Battery monitor, all OFF state upon loss of battery
No EMI
Latched logic level inputs, no drive circuitry
Only one external protector required
TTL logic control compatible
Default power up state
ORDERING INFORMATION
Device
Le75183ADSC
Le75183BDSC
Le75183CDSC
Le75183DDSC
LE75183AFQC
Le75183BFQC
Le75183CFQC
Le75183DFQC
Le75183AFSC
Le75183BFSC
Le75183CFSC
Le75183CZFSC
Le75183DFSC
1.
The green package meets RoHS Directive 2002/95/EC of the
European Council to minimize the environmental impact of
electrical equipment.
For delivery using a tape and reel packing system, add a "T" suffix
to the OPN (Ordering Part Number) when placing an order.
28-pin SOIC (GULL)
Tube
32-Pin QFN
Tray
20-Pin SOIC (GULL)
Tube
Package Type
1
Packing
2
RELATED LITERATURE
081123 Le75282 Dual Intelligent Line Card Access
Switch Data Sheet
081105 Le75181 Ringing Access Switch Data Sheet
080754 Le58QL061/063 QLSLAC Data Sheet
080676 Le5711 Dual SLIC Data Sheet
081047 Le5712 Dual SLIC Data Sheet
2.
NOTE: On August 3, 2007, Zarlink Semiconductor acquired the products and
technology of Legerity Holdings.
Document ID#
081105
Date:
Rev:
C
Version:
Distribution:
Public Document
Sep 18, 2007
2

LE75183DDSC Related Products

LE75183DDSC LE75183DFQCT LE75183DFQC LE75183DFSC LE75183DFSCT LE75183DDSCT
Description line card lcas 1chiple 20soic line card lcas 1chiple 32qfn line card lcas 1chiple 32qfn line card lcas 1chiple 28soic line card lcas 1chiple 28soic line card lcas 1chiple 20soic
Is it Rohs certified? conform to conform to conform to conform to conform to conform to
Maker Microsemi Microsemi Microsemi Microsemi Microsemi Microsemi
Parts packaging code SOIC QFN QFN SOIC SOIC SOIC
package instruction SOP, HVQCCN, HVQCCN, SOP, SOP28,.4 SOP, SOP28,.4 SOP,
Contacts 20 32 32 28 28 20
Reach Compliance Code compli compliant compliant compliant compliant compliant
JESD-30 code R-PDSO-G20 S-XQCC-N32 S-XQCC-N32 R-PDSO-G28 R-PDSO-G28 R-PDSO-G20
JESD-609 code e3 e3 e3 e3 e3 e3
length 12.8 mm 8 mm 8 mm 17.9 mm 17.9 mm 12.8 mm
Number of functions 1 1 1 1 1 1
Number of terminals 20 32 32 28 28 20
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY UNSPECIFIED UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP HVQCCN HVQCCN SOP SOP SOP
Package shape RECTANGULAR SQUARE SQUARE RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.65 mm 1 mm 1 mm 2.65 mm 2.65 mm 2.65 mm
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES
Telecom integrated circuit types TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface MATTE TIN MATTE TIN MATTE TIN MATTE TIN MATTE TIN MATTE TIN
Terminal form GULL WING NO LEAD NO LEAD GULL WING GULL WING GULL WING
Terminal pitch 1.27 mm 0.8 mm 0.8 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL QUAD QUAD DUAL DUAL DUAL
width 7.5 mm 8 mm 8 mm 7.5 mm 7.5 mm 7.5 mm
Base Number Matches 1 1 1 1 1 1

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