and a true fail-safe receiver, guaranteeing a logic-high
receiver output when inputs are shorted or open. Hot-
swap capability eliminates undesired transitions on the
bus during power-up or hot insertion.
The transceiver draws 1.9mA (typ) supply current when
unloaded or when fully loaded with the drivers disabled
and draws less than 10µA (max) of supply current in low-
power shutdown mode.
The MAX14783E is available in 8-pin µMAX, 8-pin SO,
and small, 8-pin (3mm x 3mm) TDFN-EP packages.
The device in the TDFN-EP package operates over the
-40°C to +125°C temperature range. The MAX14783E in
the µMAX and SO packages operates over the -40°C to
+85°C and -40°C to +125°C temperature ranges.
Benefits and Features
• High ESD Protection
±35kV HBM ESD
● Integrated Protection Increases Robustness
±20kV Air Gap IEC 61000-4-2 ESD
±12kV IEC 61000-4-2 Contact ESD
• Short-Circuit Protected Outputs
• True Fail-Safe Receiver
• Hot-Swap Capability
● 3V to 5.5V Supply Voltage Range
● High-Speed Data Rates up to 42Mbps
● -40°C to +125°C Operating Temperature
● Allows Up to 32 Transceivers on the Bus
● Low 10µA (max) Shutdown Current
● Saves Board Space
• Available in 8-pin µMAX, SO, and TDFN-EP
Packages
Applications
●
●
●
●
Motion Controllers
Field Bus Networks
Encoder Interfaces
Backplane Busses
Ordering Information/Selector Guide
PART
MAX14783EEUA+
MAX14783EESA+
MAX14783EATA+
MAX14783EASA+
MAX14783EAUA+
SUPPLY RANGE
3.0V to 5.5V
3.0V to 5.5V
3.0V to 5.5V
3.0V to 3.6V
3.0V to 5.5V
3.0V to 3.6V
3.0V to 5.5V
DATA RATE (MAX)
30Mbps
40Mbps
42Mbps
42Mbps
16Mbps
42Mbps
6Mbps
TEMP RANGE
-40°C to +85°C
-40°C to +85°C
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
PIN-PACKAGE
8 µMAX
8 SO
8 TDFN-EP*
8 SO
8 µMAX
+Denotes lead(Pb)-free/RoHS-compliant package.
*EP = Exposed paddle.
19-6734; Rev 0; 6/13
MAX14783E
High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection
Absolute Maximum Ratings
(Voltages referenced to GND.)
V
CC
.....................................................................-0.3V to +6.0V
RO ............................................................ -0.3V to (V
CC
+ 0.3V)
RE,
DE, DI
............................................................-0.3V to +6.0V
A, B (V
CC
≥ 3.6V)
.............................................-8.0V to +13.0V
A, B (V
CC
< 3.6V)
.............................................-9.0V to +13.0V
Short-Circuit Duration (RO, A, B) to GND
.................Continuous
Operating Temperature Range
MAX14783EE_ ............................................... -40°C to +85°C
MAX14783EA_ ............................................. -40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range ............................
-65°C
to +150°C
Continuous Power Dissipation (T
A
= +70°C)
µMAX (derate at 4.8mW/°C above +70°C) .................387mW
SO (derate at 7.6mW/°C above +70°C)
......................606mW
TDFN-EP (derate at 24.4mW/°C above +70°C) ........1951mW
Lead Temperature (soldering, 10s)
................................. +300ºC
Soldering Temperature (reflow) ...................................... +260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
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Embedded System
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