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LE57D111BTCT

Description
IC slic 2ch 50db 44tqfp
CategoryWireless rf/communication    Telecom circuit   
File Size192KB,24 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Environmental Compliance
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LE57D111BTCT Overview

IC slic 2ch 50db 44tqfp

LE57D111BTCT Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicrosemi
Parts packaging codeQFP
package instructionHTQFP,
Contacts44
Reach Compliance Codecompli
JESD-30 codeS-PQFP-G44
JESD-609 codee3
length10 mm
Number of functions1
Number of terminals44
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeHTQFP
Package shapeSQUARE
Package formFLATPACK, HEAT SINK/SLUG, THIN PROFILE
Certification statusNot Qualified
Maximum seat height1.2 mm
Nominal supply voltage5 V
surface mountYES
Telecom integrated circuit typesSLIC
Temperature levelINDUSTRIAL
Terminal surfaceMATTE TIN
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationQUAD
width10 mm
Le5711
Dual Subscriber Line Interface Circuit
VE580 Series
Data Sheet
Features
Dual-channel SLIC device with small footprint
On-chip Thermal Management (TMG) feature in
Normal and Reverse Polarity
Control states: Active (Normal and Reverse
Polarity), Standby, and Disconnect
On-hook transmission
Low standby power
–39 to –58 V battery operation
Two-wire impedance set by single external
impedance
Device level thermal shutdown
Set on-chip constant-current feed
Programmable ring-trip detect threshold
Only +5 V and battery supply required
the Zarlink QLSLAC™ device, another member of the
VE580 series, combined with the Le5711 device
provides a programmable line circuit that can be
configured for varying requirements.
2.
1.
Document ID#: 081132
Version 5
June 2011
Ordering Information
Le57D111BTC
44-pin eTQFP (Green)
1
Tray
2
The green package meets RoHS Directive 2002/95/EC of the
European Council to minimize the environmental impact of
electrical equipment.
For delivery using a tape and reel packing system, add a "T"
suffix to the OPN (Ordering Part Number) when placing an
order.
Related Literature
Applications
Ideal for low cost, high performance linecard
applications (CO, DLC)
Meets requirements for countries such as: China,
Korea, Japan, Taiwan, and Australia
Fulfills the following China specifications: GF002-
9002.1
080753 Le58QL02/021/031 QLSLAC™ Data
Sheet
080754 Le58QL061/063 QLSLAC™ Data Sheet
080748 Le5711 Evaluation Board User’s Guide
TMG
2
DET
2
IREF
DET
1
CAS
C2
2
C1
2
C2
1
C1
1
TMG
1
Description
The innovative Le5711 dual-channel SLIC device is
designed for high-density POTS applications requiring
a small footprint SLIC device with significant power
savings. By combining the line interface of two
channels into one SLIC device, the Le5711 device
enables the design of a low cost, high performance,
and fully programmable line interface for multiple
country applications worldwide. The on-chip Thermal
Management (TMG) feature allows for significantly
reduced power dissipation on the device. The Le5711
device is offered in a space-saving package type, 44-
pin eTQFP. The small footprint of the SLIC device
allows designers to save board space, increasing the
density of lines on the board. The Le5711 device is
also designed to significantly reduce the number of
external components required for linecard design.
Zarlink offers a range of compatible codec/filters that
perform the codec function in a line card. In particular
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2007-2011, Zarlink Semiconductor Inc. All Rights Reserved.
A
2
(TIP)
CH2
2-W
Interface
CH2
Input
Decoder
and Control
CH1
Input
Decoder
and Control
A
1
(TIP)
CH1
2-W
Interface
HP
2
Common
Bias
HP
1
B
2
(RING)
B
1
(RING
CH2
CH2
CH2
CH2
CH1
Signal
Transmission
RSN
2
BGND
2
Signal
Transmission
Power Feed
Controller
Power Feed
Controller
VTX
2
CH1
CH1
CH1
VTX
1
Off-Hook
Detector
Ring Trip
Detector
Ring Trip
Detector
Off-Hook
Detector
RSN
1
BGND
1
Figure 1 - Block Diagram
AGND/
DGND
DB
1
CDC
2
VBAT
CDC
1
VCC
DAC
DB
2

LE57D111BTCT Related Products

LE57D111BTCT LE57D111BTC
Description IC slic 2ch 50db 44tqfp IC slic 2ch 50db 44tqfp
Is it Rohs certified? conform to conform to
Maker Microsemi Microsemi
Parts packaging code QFP QFP
package instruction HTQFP, HTQFP,
Contacts 44 44
Reach Compliance Code compli compli
JESD-30 code S-PQFP-G44 S-PQFP-G44
JESD-609 code e3 e3
length 10 mm 10 mm
Number of functions 1 1
Number of terminals 44 44
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HTQFP HTQFP
Package shape SQUARE SQUARE
Package form FLATPACK, HEAT SINK/SLUG, THIN PROFILE FLATPACK, HEAT SINK/SLUG, THIN PROFILE
Certification status Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm
Nominal supply voltage 5 V 5 V
surface mount YES YES
Telecom integrated circuit types SLIC SLIC
Temperature level INDUSTRIAL INDUSTRIAL
Terminal surface MATTE TIN MATTE TIN
Terminal form GULL WING GULL WING
Terminal pitch 0.8 mm 0.8 mm
Terminal location QUAD QUAD
width 10 mm 10 mm

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