LE57D111BTC datasheet, PDF - EEWORLD Datasheet

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LE57D111BTC: DescriptionIC slic 2ch 50db 44tqfp; CategoryWireless rf/communication Telecom circuit; File Size192KB，24 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com; Environmental Compliance

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LE57D111BTC Overview

IC slic 2ch 50db 44tqfp

LE57D111BTC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Microsemi
Parts packaging code	QFP
package instruction	HTQFP,
Contacts	44
Reach Compliance Code	compli
JESD-30 code	S-PQFP-G44
JESD-609 code	e3
length	10 mm
Number of functions	1
Number of terminals	44
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	HTQFP
Package shape	SQUARE
Package form	FLATPACK, HEAT SINK/SLUG, THIN PROFILE
Certification status	Not Qualified
Maximum seat height	1.2 mm
Nominal supply voltage	5 V
surface mount	YES
Telecom integrated circuit types	SLIC
Temperature level	INDUSTRIAL
Terminal surface	MATTE TIN
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	QUAD
width	10 mm

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Le5711

Dual Subscriber Line Interface Circuit

VE580 Series

Data Sheet

Features

•

Dual-channel SLIC device with small footprint

On-chip Thermal Management (TMG) feature in

Normal and Reverse Polarity

Control states: Active (Normal and Reverse

Polarity), Standby, and Disconnect

On-hook transmission

Low standby power

–39 to –58 V battery operation

Two-wire impedance set by single external

impedance

Device level thermal shutdown

Set on-chip constant-current feed

Programmable ring-trip detect threshold

Only +5 V and battery supply required

the Zarlink QLSLAC™ device, another member of the

VE580 series, combined with the Le5711 device

provides a programmable line circuit that can be

configured for varying requirements.

Document ID#: 081132

Version 5

June 2011

Ordering Information

Le57D111BTC

44-pin eTQFP (Green)

Tray

The green package meets RoHS Directive 2002/95/EC of the

European Council to minimize the environmental impact of

electrical equipment.

For delivery using a tape and reel packing system, add a "T"

suffix to the OPN (Ordering Part Number) when placing an

order.

Related Literature

Applications

•

Ideal for low cost, high performance linecard

applications (CO, DLC)

Meets requirements for countries such as: China,

Korea, Japan, Taiwan, and Australia

Fulfills the following China specifications: GF002-

9002.1

•

080753 Le58QL02/021/031 QLSLAC™ Data

Sheet

080754 Le58QL061/063 QLSLAC™ Data Sheet

080748 Le5711 Evaluation Board User’s Guide

TMG

DET

IREF

DET

CAS

TMG

Description

The innovative Le5711 dual-channel SLIC device is

designed for high-density POTS applications requiring

a small footprint SLIC device with significant power

savings. By combining the line interface of two

channels into one SLIC device, the Le5711 device

enables the design of a low cost, high performance,

and fully programmable line interface for multiple

country applications worldwide. The on-chip Thermal

Management (TMG) feature allows for significantly

reduced power dissipation on the device. The Le5711

device is offered in a space-saving package type, 44-

pin eTQFP. The small footprint of the SLIC device

allows designers to save board space, increasing the

density of lines on the board. The Le5711 device is

also designed to significantly reduce the number of

external components required for linecard design.

Zarlink offers a range of compatible codec/filters that

perform the codec function in a line card. In particular

Zarlink Semiconductor Inc.

Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.

(TIP)

CH2

2-W

Interface

CH2

Input

Decoder

and Control

CH1

Input

Decoder

and Control

(TIP)

CH1

2-W

Interface

Common

Bias

(RING)

(RING

CH2

CH1

Signal

Transmission

RSN

BGND

Signal

Transmission

Power Feed

Controller

Power Feed

Controller

VTX

CH1

VTX

Off-Hook

Detector

Ring Trip

Detector

Ring Trip

Detector

Off-Hook

Detector

RSN

BGND

Figure 1 - Block Diagram

AGND/

DGND

CDC

VBAT

CDC

VCC

DAC

Le5711

Table of Contents

Data Sheet

1.0 Product Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.0 Block Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.1 Two-Wire Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.2 Signal Transmission . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.3 Power Feed Controller and Common Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.4 Input Decoder and Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.5 Off-Hook Detector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.6 Ring-Trip Detector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

3.0 Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

4.0 Pin Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

5.0 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

5.1 Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

5.2 Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

6.0 Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

6.1 Transmission Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

6.2 Crosstalk Between Channels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

6.3 Longitudinal Capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

6.4 Insertion Loss . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

6.5 Line Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

6.6 Power Supply Rejection Ratio at the Two-Wire Interface, Active Normal State . . . . . . . . . . . . . . . . . . . . 13

6.7 Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

6.8 Supply Currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

6.9 RFI Rejection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

6.10 Logic Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

6.11 Logic Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

6.12 Ring-Trip Detector Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

6.13 Loop Detector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

6.14 SLIC Device Decoding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

6.15 User-Programmable Components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

6.16 DC Feed Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

6.17 Test Circuits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

7.0 Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

8.0 Line card Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

9.0 Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

9.1 44-Pin eTQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Zarlink Semiconductor Inc.

Le5711

1.0

Product Description

Data Sheet

The Le5711 device is designed for long loop high-density POTS applications requiring a low power, small footprint

SLIC. The Le5711 device increases linecard density by integrating two SLIC devices into a single 32 pin package.

This reduction in board space allows for higher density linecard, which allows for amortizing common hardware

across more channels. The Le5711 device gives linecard designers a simple control interface that supports four

states: Active, Reverse Polarity, Standby, and Disconnect (Ringing). The Le5711 device is low cost and high

performance, providing key features required for POTS markets requiring only loop start. The device includes a

thermal management resistor for reducing power dissipation.

2.0

2.1

Block Descriptions

Two-Wire Interface

The two-wire interfaces provide DC current and send voice signals to a telephone apparatus connected to the

linecard with a two-wire line. The two-wire interface also receives the returning voice signals from the telephone

transmitter.

2.2

Signal Transmission

The RSN input current controls the receive current sent to the two-wire interface. The AC line voltage is sensed by

a differential amplifier between the A

(TIP) and HP

leads.* The output of this amplifier is equal to the AC metallic

components of the line voltages and is output at VTX

. The transmission circuit also contains a longitudinal

feedback circuit to shunt longitudinal signals to a DC bias voltage. The longitudinal feedback does not affect

metallic signals.

*Note:

"i" denotes channel number

2.3

Power Feed Controller and Common Bias

The power feed controllers have three sections: (1) the battery feed circuit, (2) the reverse polarity circuit, and (3)

the common bias circuit. The battery feed circuit regulates the amount of DC current and voltage supplied to the

telephone over a wide range of loop resistance. The reverse polarity circuit provides the capability to reverse the

loop current for pay telephone key pad disable and other applications. The bias circuit provides a filtered reference

voltage, which is offset from the subscriber line voltage, and a signal which sets the current limit.

2.4

Input Decoder and Control

The input decoder and control block provides a means for a microprocessor or SLAC IC to control such system

states as Active, Standby, Disconnect (Ringing), and Reverse Polarity. The input decoder and control block has

TTL-compatible inputs, which set the operating states of the SLIC device. It also provides the supervision signal

sent back to the controller.

2.5

Off-Hook Detector

The most important loop monitoring function is off-hook detection. Loop current is programmed for both channels

by a single resistor. Loop detect threshold is typically 1/3 of the programmed Loop current in the Active and

Reverse Polarity states.

2.6

Ring-Trip Detector

In the Disconnect state, the ring-trip detector is active. While the DB

pin is more negative than the DAC pin, the

DET pin will be high to indicate on hook. When an off hook condition occurs, the DB

pin becomes more positive

than the DAC pin, and the DET pin will go low to indicate off hook during ringing (ring-trip) has been detected. The

system implements the Ringing state using external control of a ring relay in combination with the Disconnect SLIC

state, which enables the ring-trip detector.

Zarlink Semiconductor Inc.

LE57D111BTC Related Products

	LE57D111BTC	LE57D111BTCT
Description	IC slic 2ch 50db 44tqfp	IC slic 2ch 50db 44tqfp
Is it Rohs certified?	conform to	conform to
Maker	Microsemi	Microsemi
Parts packaging code	QFP	QFP
package instruction	HTQFP,	HTQFP,
Contacts	44	44
Reach Compliance Code	compli	compli
JESD-30 code	S-PQFP-G44	S-PQFP-G44
JESD-609 code	e3	e3
length	10 mm	10 mm
Number of functions	1	1
Number of terminals	44	44
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HTQFP	HTQFP
Package shape	SQUARE	SQUARE
Package form	FLATPACK, HEAT SINK/SLUG, THIN PROFILE	FLATPACK, HEAT SINK/SLUG, THIN PROFILE
Certification status	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm
Nominal supply voltage	5 V	5 V
surface mount	YES	YES
Telecom integrated circuit types	SLIC	SLIC
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal surface	MATTE TIN	MATTE TIN
Terminal form	GULL WING	GULL WING
Terminal pitch	0.8 mm	0.8 mm
Terminal location	QUAD	QUAD
width	10 mm	10 mm

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