DSPIC30F5015T-20I/PT datasheet, PDF

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DSPIC30F5015T-20I/PT: DescriptionIC dsc 16bit 66kb flash 64tqfp; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，66 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com; Environmental Compliance

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DSPIC30F5015T-20I/PT Overview

IC dsc 16bit 66kb flash 64tqfp

DSPIC30F5015T-20I/PT Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Microchip
Parts packaging code	QFP
package instruction	10 X 10 MM, 1 MM HEIGHT, PLASTIC, MS-026, TQFP-64
Contacts	64
Reach Compliance Code	compli
ECCN code	3A991.A.2
Has ADC	YES
Other features	ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 7.5 MHZ
Address bus width
bit size	16
maximum clock frequency	40 MHz
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	S-PQFP-G64
JESD-609 code	e3
length	10 mm
Humidity sensitivity level	3
Number of I/O lines	52
Number of terminals	64
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	TFQFP
Package shape	SQUARE
Package form	FLATPACK, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
ROM programmability	FLASH
Maximum seat height	1.2 mm
speed	20 MHz
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

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dsPIC30F

dsPIC30F Flash Programming Specification

1.0

OVERVIEW AND SCOPE

This document defines the programming specification

for the dsPIC30F family of Digital Signal Controllers

(DSCs). The programming specification is required

only for the developers of third-party tools that are used

to program dsPIC30F devices. Customers using

dsPIC30F devices should use development tools that

already provide support for device programming.

This document includes programming specifications

for the following devices:

•

dsPIC30F2010/2011/2012

dsPIC30F3010/3011/3012/3013/ 3014

dsPIC30F4011/4012/4013

dsPIC30F5011/5013/5015/5016

dsPIC30F6010/6011/6012/6013/6014/6015

dsPIC30F6010A/6011A/6012A/6013A/6014A

Two different methods are used to program the chip in

the user’s system. One method uses the Enhanced In-

Circuit Serial Programming™ (Enhanced ICSP™)

protocol and works with the programming executive.

The other method uses In-Circuit Serial Programming

(ICSP) protocol and does not use the programming

executive.

The Enhanced ICSP protocol uses the faster, high-

voltage method that takes advantage of the

programming executive. The programming executive

provides all the necessary functionality to erase,

program and verify the chip through a small command

set. The command set allows the programmer to

program the dsPIC30F without having to deal with the

low-level programming protocols of the chip.

The ICSP programming method does not use the

programming executive. It provides native, low-level

programming capability to erase, program and verify

the chip. This method is significantly slower because it

uses control codes to serially execute instructions on

the dsPIC30F device.

This specification describes the ICSP and Enhanced

ICSP

programming

methods.

Section 3.0

“Programming Executive Application”

describes

the

programming

executive

application

and

Section 5.0 “Device Programming”

describes its

application programmer’s interface for the host

Section 11.0

“ICSP™

Mode”

programmer.

describes the ICSP programming method.

2.0

PROGRAMMING OVERVIEW

OF THE dsPIC30F

The dsPIC30F family of DSCs contains a region of on-

chip memory used to simplify device programming.

This region of memory can store a programming

executive, which allows the dsPIC30F to be

programmed faster than the traditional means. Once

the programming executive is stored to memory by an

external programmer (such as Microchip’s MPLAB

ICD 2, MPLAB PM3, PRO MATE

II, or MPLAB REAL

ICE™), it can then interact with the external

programmer to efficiently program devices.

The programmer and programming executive have a

master-slave relationship, where the programmer is

the master programming device and the programming

executive is the slave, as illustrated in

Figure 2-1.

2.1

Hardware Requirements

FIGURE 2-1:

OVERVIEW OF dsPIC30F

PROGRAMMING

Programmer

Programming

Executive

On-chip Memory

dsPIC30F Device

In ICSP or Enhanced ICSP mode, the dsPIC30F

requires two programmable power supplies: one for

and one for MCLR. For Bulk Erase programming,

which is required for erasing code protection bits, V

must be greater than 4.5 volts. Refer to

Section 13.0

“AC/DC Characteristics and Timing Requirements”

for additional hardware parameters.

2010 Microchip Technology Inc.

DS70102K-page 1

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