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KMPC8313EVRAFFB

Description
IC mpu powerquicc II 516-pbga
Categorysemiconductor    The embedded processor and controller   
File Size693KB,99 Pages
ManufacturerFREESCALE (NXP)
Environmental Compliance  
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IC mpu powerquicc II 516-pbga

KMPC8313EVRAFFB Parametric

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Datasheets
MPC8313E Hrdw Specifications
Product Photos
516-PBGAPGE (27x27)
Standard Package2
CategoryIntegrated Circuits (ICs)
FamilyEmbedded - Microprocessors
PackagingTray
Core ProcessPowerPC e300c3
Number of Cores/Bus Width1 Core, 32-Bi
Speed333MHz
Co-Processors/DSPSecurity
SEC 2.2
RAM ControllersDDR, DDR2
Graphics AcceleratiN
Display & Interface Controllers-
Etherne10/100/1000 Mbps (2)
SATA-
USBUSB 2.0 + PHY (1)
Voltage - I/O1.8V, 2.5V, 3.3V
Operating Temperature0°C ~ 105°C
Security FeaturesCryptography
Package / Case516-BBGA Exposed Pad
Supplier Device Package516-PBGAPGE (27x27)
Additional InterfacesDUART, HSSI, I²C, PCI, SPI
Freescale Semiconductor
Datasheet: Technical Data
Document Number: MPC8313EEC
Rev. 4, 11/2011
MPC8313E
PowerQUICC II Pro Processor
Hardware Specifications
This document provides an overview of the MPC8313E
PowerQUICC™ II Pro processor features, including a block
diagram showing the major functional components. The
MPC8313E is a cost-effective, low-power, highly integrated
host processor that addresses the requirements of several
printing and imaging, consumer, and industrial applications,
including main CPUs and I/O processors in printing systems,
networking switches and line cards, wireless LANs
(WLANs), network access servers (NAS), VPN routers,
intelligent NIC, and industrial controllers. The MPC8313E
extends the PowerQUICC™ family, adding higher CPU
performance, additional functionality, and faster interfaces
while addressing the requirements related to time-to-market,
price, power consumption, and package size.
NOTE
The information in this document is accurate for
revisions 1.0, 2.x, and later. See
Section 23.1, “Part
Numbers Fully Addressed by this Document.”
Contents
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 6
Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 11
Clock Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 12
RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 13
DDR and DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . . 14
DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Ethernet: Three-Speed Ethernet, MII Management . 21
High-Speed Serial Interfaces (HSSI) . . . . . . . . . . . . 36
USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Enhanced Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . 47
JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
I
2
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
IPIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . 63
Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
System Design Information . . . . . . . . . . . . . . . . . . . 87
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 93
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
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© Freescale Semiconductor, Inc., 2007–2011. All rights reserved.

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