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DSPIC30F5016T-20E/PT

Description
IC dsc 16bit 66kb flash 80tqfp
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,66 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
Download Datasheet Parametric View All

DSPIC30F5016T-20E/PT Overview

IC dsc 16bit 66kb flash 80tqfp

DSPIC30F5016T-20E/PT Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicrochip
Parts packaging codeQFP
package instructionTQFP-80
Contacts80
Reach Compliance Codecompli
ECCN code3A991.A.2
Has ADCYES
Other featuresALSO OPERATES AT 3V MINIMUM SUPPLY AT 15 MHZ
Address bus width
bit size16
maximum clock frequency40 MHz
DAC channelNO
DMA channelNO
External data bus width
FormatFIXED POINT
JESD-30 codeS-PQFP-G80
JESD-609 codee3
length12 mm
Humidity sensitivity level3
Number of I/O lines68
Number of terminals80
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeTFQFP
Encapsulate equivalent codeTQFP80,.55SQ
Package shapeSQUARE
Package formFLATPACK, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)260
power supply3/5 V
Certification statusNot Qualified
RAM (number of words)2048
ROM programmabilityFLASH
Maximum seat height1.2 mm
speed20 MHz
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature40
width12 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER, RISC
dsPIC30F
dsPIC30F Flash Programming Specification
1.0
OVERVIEW AND SCOPE
This document defines the programming specification
for the dsPIC30F family of Digital Signal Controllers
(DSCs). The programming specification is required
only for the developers of third-party tools that are used
to program dsPIC30F devices. Customers using
dsPIC30F devices should use development tools that
already provide support for device programming.
This document includes programming specifications
for the following devices:
dsPIC30F2010/2011/2012
dsPIC30F3010/3011/3012/3013/ 3014
dsPIC30F4011/4012/4013
dsPIC30F5011/5013/5015/5016
dsPIC30F6010/6011/6012/6013/6014/6015
dsPIC30F6010A/6011A/6012A/6013A/6014A
Two different methods are used to program the chip in
the user’s system. One method uses the Enhanced In-
Circuit Serial Programming™ (Enhanced ICSP™)
protocol and works with the programming executive.
The other method uses In-Circuit Serial Programming
(ICSP) protocol and does not use the programming
executive.
The Enhanced ICSP protocol uses the faster, high-
voltage method that takes advantage of the
programming executive. The programming executive
provides all the necessary functionality to erase,
program and verify the chip through a small command
set. The command set allows the programmer to
program the dsPIC30F without having to deal with the
low-level programming protocols of the chip.
The ICSP programming method does not use the
programming executive. It provides native, low-level
programming capability to erase, program and verify
the chip. This method is significantly slower because it
uses control codes to serially execute instructions on
the dsPIC30F device.
This specification describes the ICSP and Enhanced
ICSP
programming
methods.
Section 3.0
“Programming Executive Application”
describes
the
programming
executive
application
and
Section 5.0 “Device Programming”
describes its
application programmer’s interface for the host
Section 11.0
“ICSP™
Mode”
programmer.
describes the ICSP programming method.
2.0
PROGRAMMING OVERVIEW
OF THE dsPIC30F
The dsPIC30F family of DSCs contains a region of on-
chip memory used to simplify device programming.
This region of memory can store a programming
executive, which allows the dsPIC30F to be
programmed faster than the traditional means. Once
the programming executive is stored to memory by an
external programmer (such as Microchip’s MPLAB
®
ICD 2, MPLAB PM3, PRO MATE
®
II, or MPLAB REAL
ICE™), it can then interact with the external
programmer to efficiently program devices.
The programmer and programming executive have a
master-slave relationship, where the programmer is
the master programming device and the programming
executive is the slave, as illustrated in
Figure 2-1.
2.1
Hardware Requirements
FIGURE 2-1:
OVERVIEW OF dsPIC30F
PROGRAMMING
Programmer
2
Programming
Executive
On-chip Memory
dsPIC30F Device
In ICSP or Enhanced ICSP mode, the dsPIC30F
requires two programmable power supplies: one for
V
DD
and one for MCLR. For Bulk Erase programming,
which is required for erasing code protection bits, V
DD
must be greater than 4.5 volts. Refer to
Section 13.0
“AC/DC Characteristics and Timing Requirements”
for additional hardware parameters.
©
2010 Microchip Technology Inc.
DS70102K-page 1
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