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DS1609S-50+

Description
IC sram 2kbit 50ns 24soic
Categorystorage    storage   
File Size82KB,7 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
Environmental Compliance
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DS1609S-50+ Overview

IC sram 2kbit 50ns 24soic

DS1609S-50+ Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMaxim
package instructionSOP, SOP24,.4
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum access time50 ns
I/O typeCOMMON
JESD-30 codeR-PDSO-G24
JESD-609 codee3
memory density2048 bi
Memory IC TypeMULTI-PORT SRAM
memory width8
Number of ports2, (MUXED)
Number of terminals24
word count256 words
character code256
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256X8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP24,.4
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Maximum standby current0.0003 A
Minimum standby current4.5 V
Maximum slew rate0.03 mA
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
DS1609
DS1609
Dual Port RAM
FEATURES
PIN ASSIGNMENT
PORT A
AD7
A
AD6
A
AD5
A
AD4
A
AD3
A
AD2
A
AD1
A
AD0
A
WE
A
CE
A
OE
A
GND
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
PORT B
V
CC
OE
B
CE
B
WE
B
AD0
B
AD1
B
AD2
B
AD3
B
AD4
B
AD5
B
AD6
B
AD7
B
Totally asynchronous 256–byte dual port memory
Multiplexed address
low
and data bus keeps pin count
Dual
port memory cell allows random access with
minimum arbitration
nals
Each port has standard independent RAM control sig-
Fast access time
Low power CMOS design
24–pin DIP or 24–pin SOIC surface mount package
Both CMOS and TTL compatible
Operating temperature of –40°C to +85°C
Standby current of 100 nA @ 25°C makes the device
ideal for battery backup or battery operate applica-
tions.
DS1609
24–PIN DIP (600 MIL)
See Mech. Drawings
Section
PORT A
AD7
A
AD6
A
AD5
A
AD4
A
AD3
A
AD2
A
AD1
A
AD0
A
WE
A
CE
A
OE
A
GND
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
PORT B
V
CC
OE
B
CE
B
WE
B
AD0
B
AD1
B
AD2
B
AD3
B
AD4
B
AD5
B
AD6
B
AD7
B
DS1609S
24–PIN SOIC (300 MIL)
See Mech. Drawings
Section
PIN DESCRIPTION
AD0–AD7
CE
WE
OE
V
CC
GND
Port address/data
Port enable
Write enable
Output enable
+5 volt supply
Ground
DESCRIPTION
The DS1609 is a random access 256–byte dual port
memory designed to connect two asyncronous ad-
dress/data buses together with a common memory ele-
ment. Both ports have unrestricted access to all
256 bytes of memory, and with modest system disci-
pline no arbitration is required. Each port is controlled
by three control signals: output enable, write enable,
and port enable. The device is packaged in plastic
24–pin DIP and 24–pin SOIC. Output enable access
time of 50 ns is available when operating at 5 volts.
020499 1/7

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