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DS1222

Description
IC bankswitch cmos 14-dip
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size45KB,4 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
Download Datasheet Parametric Compare View All

DS1222 Overview

IC bankswitch cmos 14-dip

DS1222 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMaxim
Parts packaging codeDIP
package instruction0.300 INCH, DIP-14
Contacts14
Reach Compliance Code_compli
JESD-30 codeR-PDIP-T14
JESD-609 codee0
length19.05 mm
Humidity sensitivity level1
Number of terminals14
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP14,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)240
Certification statusNot Qualified
Maximum seat height4.572 mm
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperature20
width7.62 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR CIRCUIT
DS1222
BankSwitch Chip
www.dalsemi.com
FEATURES
Provides bank switching for 16 banks of
memory
Bank switching is software-controlled by a
pattern recognition sequence on four address
inputs
Automatically sets all 16 banks off on
power-up
Bank switching logic allows only one bank on
at a time
Custom recognition patterns are available to
prevent unauthorized access
Full
±10%
operating range
Low-power CMOS circuitry
Can be used to expand the address range of
microprocessors and decoders
Optional 16-pin SOIC surface mount package
PIN ASSIGNMENT
CEI
PFI
AW
AX
AY
AZ
GND
1
2
3
4
5
6
7
14
13
12
11
10
9
8
V
CC
CEO
BS1
BS2
BS3
BS4
NC
CEI
NC
PFI
AW
AX
AY
AZ
GND
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
CC
CEO
NC
BS1
BS2
BS3
NC
BS4
DS1222 14-Pin DIP
(300-mil)
See Mech. Drawings
Section
DS1222S 16-Pin SOIC
(300-mil)
See Mech. Drawings
Section
PIN DESCRIPTION
A
W
-A
Z
CEI
CEO
NC
BS1,BS2,
BS3,BS4
PFI
V
CC
GND
- Address Inputs
- Chip Enable Input
- Chip Enable Output
- No Connection
- Bank Select Outputs
- Bank Select Outputs
- Power Fail Input
- +5 Volts
- Ground
DESCRIPTION
The DS1222 BankSwitch Chip is a CMOS circuit designed to select one of 16 memory banks under
software control. Memory bank switching allows for an increase in memory capacity without additional
address lines. Continuous blocks of memory are enabled by selecting proper memory bank through a
pattern recognition sequence on four address inputs. Custom patterns from Dallas Semiconductor can
provide security through uniqueness and prevent unauthorized access. By combining the DS1222 with
the DS1212 Nonvolatile Controller x16 Chip, up to 16 banks of static RAMs can be selected.
1 of 4
111899

DS1222 Related Products

DS1222 DS1222+ DS1222S+ DS1222N
Description IC bankswitch cmos 14-dip IC bankswitch cmos 14-dip IC bankswitch cmos 16-soic IC bankswitch cmos ind 14-dip
Standard Package - 25 45 25
Category - Integrated Circuits (ICs) Integrated Circuits (ICs) Integrated Circuits (ICs)
Family - Memory - Controllers Memory - Controllers Memory - Controllers
Packaging - Tube Tube Tube
Controller Type - Static RAM (SRAM) Static RAM (SRAM) Static RAM (SRAM)
Voltage - Supply - 4.5 V ~ 5.5 V 4.5 V ~ 5.5 V 4.5 V ~ 5.5 V
Operating Temperature - 0°C ~ 70°C 0°C ~ 70°C 0°C ~ 70°C
Package / Case - 14-DIP (0.300", 7.62mm) 16-SOIC (0.295", 7.50mm Width) 14-DIP (0.300", 7.62mm)
Supplier Device Package - 14-PDIP 16-SOIC W 14-PDIP
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