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CY7C1020BN-12ZXC

Description
IC sram 512kbit 12ns 44tsop
Categorystorage    storage   
File Size406KB,8 Pages
ManufacturerCypress Semiconductor
Environmental Compliance
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CY7C1020BN-12ZXC Overview

IC sram 512kbit 12ns 44tsop

CY7C1020BN-12ZXC Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerCypress Semiconductor
Parts packaging codeTSOP2
package instructionLEAD FREE, TSOP2-44
Contacts44
Reach Compliance Codeunknown
ECCN code3A991.B.2.B
Factory Lead Time1 week
Maximum access time12 ns
I/O typeCOMMON
JESD-30 codeR-PDSO-G44
JESD-609 codee4
length18.415 mm
memory density524288 bit
Memory IC TypeSTANDARD SRAM
memory width16
Humidity sensitivity level3
Number of functions1
Number of terminals44
word count32768 words
character code32000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize32KX16
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP2
Encapsulate equivalent codeTSOP44,.46,32
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply5 V
Certification statusNot Qualified
Maximum seat height1.194 mm
Maximum standby current0.02 A
Minimum standby current4.5 V
Maximum slew rate0.14 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationDUAL
Maximum time at peak reflow temperature20
width10.16 mm
Base Number Matches1
CY7C1020BN
32K x 16 Static RAM
Features
• High speed
— t
AA
= 12, 15 ns
• CMOS for optimum speed/power
• Low active power
— 825 mW (max.)
• Low CMOS standby power (L version only)
— 2.75 mW (max.)
• Automatic power-down when deselected
• Independent control of upper and lower bits
• Available in 44-pin TSOP II and 400-mil SOJ
Functional Description
The CY7C1020BN is a high-performance CMOS static RAM
organized as 32,768 words by 16 bits. This device has an
automatic power-down feature that significantly reduces
power consumption when deselected.
Writing to the device is accomplished by taking Chip Enable
(CE) and Write Enable (WE) inputs LOW. If Byte Low Enable
(BLE) is LOW, then data from I/O pins (I/O
1
through I/O
8
), is
written into the location specified on the address pins (A
0
through A
15
). If Byte High Enable (BHE) is LOW, then data
from I/O pins (I/O
9
through I/O
16
) is written into the location
specified on the address pins (A
0
through A
15
).
Reading from the device is accomplished by taking Chip
Enable (CE) and Output Enable (OE) LOW while forcing the
Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW,
then data from the memory location specified by the address
pins will appear on I/O
1
to I/O
8
. If Byte High Enable (BHE) is
LOW, then data from memory will appear on I/O
9
to I/O
16
. See
the truth table at the back of this data sheet for a complete
description of read and write modes.
The input/output pins (I/O
1
through I/O
16
) are placed in a
high-impedance state when the device is deselected (CE
HIGH), the outputs are disabled (OE HIGH), the BHE and BLE
are disabled (BHE, BLE HIGH), or during a write operation (CE
LOW, and WE LOW).
The CY7C1020BN is available in standard 44-pin TSOP Type
II and 400-mil-wide SOJ packages.
Logic Block Diagram
DATA IN DRIVERS
Pin Configuration
SOJ / TSOP II
Top View
NC
A
3
A
2
A
1
A
0
CE
I/O
1
I/O
2
I/O
3
I/O
4
V
CC
V
SS
I/O
5
I/O
6
I/O
7
I/O
8
WE
A
15
A
14
A
13
A
12
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
32K x 16
RAM Array
I/O
1
–I/O
8
I/O
9
–I/O
16
COLUMN DECODER
BHE
WE
CE
OE
BLE
A
5
A
6
A
7
OE
BHE
BLE
I/O
16
I/O
15
I/O
14
I/O
13
V
SS
V
CC
I/O
12
I/O
11
I/O
10
I/O
9
NC
A
8
A
9
A
10
A
11
NC
ROW DECODER
A
8
A
9
A
10
A
11
A
12
A
13
A
14
SENSE AMPS
Cypress Semiconductor Corporation
Document #: 001-06443 Rev. **
198 Champion Court
San Jose
,
CA 95134-1709
408-943-2600
Revised February 1, 2006
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CY7C1020BN-12ZXC Related Products

CY7C1020BN-12ZXC CY7C1020BN-12ZXCT CY7C1020BN-15ZXCT CY7C1020BN-12VXCT
Description IC sram 512kbit 12ns 44tsop IC sram 512kbit 12ns 44tsop IC sram 512kbit 15ns 44tsop IC sram 512kbit 12ns 44soj
Maker Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor
Parts packaging code TSOP2 TSOP2 TSOP2 SOJ
package instruction LEAD FREE, TSOP2-44 TSOP2, TSOP2, 0.400 INCH, LEAD FREE, SOJ-44
Contacts 44 44 44 44
Reach Compliance Code unknown unknown unknown unknown
ECCN code 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B
Maximum access time 12 ns 12 ns 15 ns 12 ns
JESD-30 code R-PDSO-G44 R-PDSO-G44 R-PDSO-G44 R-PDSO-J44
JESD-609 code e4 e3 e3 e4
length 18.415 mm 18.415 mm 18.415 mm 28.575 mm
memory density 524288 bit 524288 bit 524288 bit 524288 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 16 16 16 16
Number of functions 1 1 1 1
Number of terminals 44 44 44 44
word count 32768 words 32768 words 32768 words 32768 words
character code 32000 32000 32000 32000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
organize 32KX16 32KX16 32KX16 32KX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP2 TSOP2 TSOP2 SOJ
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.194 mm 1.194 mm 1.194 mm 3.7592 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) TIN TIN Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form GULL WING GULL WING GULL WING J BEND
Terminal pitch 0.8 mm 0.8 mm 0.8 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL
width 10.16 mm 10.16 mm 10.16 mm 10.16 mm
Base Number Matches 1 1 1 1
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