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DPS2ME16MKI335C

Description
4MX8 MULTI DEVICE SRAM MODULE, 35ns, CQIP52, 0.545 INCH HEIGHT, STRAIGHT, STACK, HERMETIC SEALED, CERAMIC, SLCC-52
Categorystorage    storage   
File Size498KB,8 Pages
ManufacturerB&B Electronics Manufacturing Company
Download Datasheet Parametric View All

DPS2ME16MKI335C Overview

4MX8 MULTI DEVICE SRAM MODULE, 35ns, CQIP52, 0.545 INCH HEIGHT, STRAIGHT, STACK, HERMETIC SEALED, CERAMIC, SLCC-52

DPS2ME16MKI335C Parametric

Parameter NameAttribute value
MakerB&B Electronics Manufacturing Company
Parts packaging codeQIP
package instructionQIP,
Contacts52
Reach Compliance Codeunknown
Maximum access time35 ns
Other featuresUSER CONFIGURABLE AS 2M X 16
JESD-30 codeR-CQIP-T52
length24.892 mm
memory density33554432 bit
Memory IC TypeSRAM MODULE
memory width8
Number of functions1
Number of terminals52
word count4194304 words
character code4000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize4MX8
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQIP
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height15.113 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formTHROUGH-HOLE
Terminal pitch1.27 mm
Terminal locationQUAD
width14.224 mm
Base Number Matches1
2Mx16, 20 - 45ns, STACK
30A129-28
B
32 Megabit High Speed CMOS SRAM
DESCRIPTION:
The DPS2ME16MKn3 High Speed SRAM ‘’STACK’’ modules are a
revolutionary new memory subsystem using Dense-Pac
Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC).
Available in straight leaded, ‘’J’’ leaded or gullwing leaded
packages. The module packs 32-Megabits of low-power CMOS
static RAM in an area as small as 0.549 in
2
, while maintaining a
total height as low as 0.545 inches.
The DPS2ME16MKn3 STACK modules contain eight individual
512K x 8 SRAMs, each packaged in a hermetically sealed SLCC,
making the modules suitable for commercial, industrial and military
applications.
By using SLCCs, the ‘’Stack’’ family of modules offer a higher board
density of memory than available with conventional through-hole,
surface mount or hybrid techniques.
SLCC Stack
DPS2ME16MKn3
Straight
Leaded
Stack
FEATURES:
Organizations Available:
2 Meg x 16 or 4 Meg x 8
Access Times:
20*, 25, 30, 35, 45ns
Fully Static Operation - No clock or refresh required
Single +5V Power Supply,
±
10% Tolerance
TTL Compatible
Common Data Inputs and Outputs
Low Data Retention Voltage:
2.0V min.
Packages Available:
SLCC Stack
Straight Leaded Stack
‘’J’’ Leaded Stack
Gullwing Leaded Stack
‘’J’’ Leaded
Stack
*
Commercial and Industrial Grade only.
Gullwing
Leaded
Stack
FUNCTIONAL BLOCK DIAGRAM
PIN NAMES
A0 - A18
I/O0 - I/O15
CE0 - CE3
WE0, WE1
OE0, OE1
V
DD
V
SS
N.C.
30A129-28
REV. B
This document contains information on a product presently under
development at Dense-Pac Microsystems, Inc. Dense-Pac reserves the right
to change products or specifications herein without prior notice.
Address Inputs
Data Input/Output
Low Chip Enables
Write Enables
Output Enables
Power (+5V)
Ground
No Connect
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