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MT8HTF12864AZ-667H1

Description
module ddr2 sdram 1gb 240udimm
Categorystorage   
File Size385KB,17 Pages
ManufacturerMicron
Websitehttp://www.micron.com/
Environmental Compliance  
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MT8HTF12864AZ-667H1 Overview

module ddr2 sdram 1gb 240udimm

MT8HTF12864AZ-667H1 Parametric

Parameter NameAttribute value
Datasheets
MT8HTFxx(x)64AZ
Product Photos
MT8HTF12864AZ-667H1
PCN Obsolescence/ EOL
Multiple Devices 04/Feb/2014
Updated LTB Date Revision 17/Jun/2014
Standard Package100
CategoryMemory Cards, Modules
FamilyMemory - Modules
Memory TypeDDR2 SDRAM
Memory Size1GB
Speed667MT/s
Package / Case240-UDIMM
Dynamic CatalogModules
Other Names557-1479MT8HTF12864AZ-667H1-NDMT8HTF12864AZ667H1
512MB, 1GB, 2GB (x64, SR) 240-Pin DDR2 UDIMM
Features
DDR2 SDRAM UDIMM
MT8HTF6464AZ – 512MB
MT8HTF12864AZ – 1GB
MT8HTF25664AZ – 2GB
Features
• 240-pin, unbuffered dual in-line memory module
• Fast data transfer rates: PC2-3200, PC2-4200,
PC2-5300, PC2-6400, or PC2-8500
• 512MB (54 Meg x 64), 1GB (128 Meg x 64), or 2GB
(256 Meg x 64)
• V
DD
= V
DDQ
= 1.8V
• V
DDSPD
= 1.7–3.6V
• JEDEC-standard 1.8V I/O (SSTL_18-compatible)
• Differential data strobe (DQS, DQS#) option
• 4n-bit prefetch architecture
• Multiple internal device banks for concurrent
operation
• Programmable CAS latency (CL)
• Posted CAS additive latency (AL)
• WRITE latency = READ latency - 1
t
CK
• Programmable burst lengths (BL): 4 or 8
• Adjustable data-output drive strength
• 64ms, 8192-cycle refresh
• On-die termination (ODT)
• Serial presence detect (SPD) with EEPROM
• Halogen-free
• Gold edge contacts
• Single rank
Table 1: Key Timing Parameters
Speed
Grade
-1GA
-80E
-800
-667
-53E
-40E
Industry
Nomenclature
PC2-8500
PC2-6400
PC2-6400
PC2-5300
PC2-4200
PC2-3200
Data Rate (MT/s)
CL = 7
1066
CL = 6
800
800
800
CL = 5
667
800
667
667
CL = 4
533
533
533
553
553
400
CL = 3
400
400
400
400
400
400
t
RCD
t
RP
t
RC
Figure 1: 240-Pin UDIMM (MO-237 R/C D)
Module height: 30mm (1.181 in)
*
*
Alternate EEPROM Placement
Options
• Operating
– Commercial (0°C
T
A
+70°C)
– Industrial (–40°C
T
A
+85°C)
• Package
– 240-pin DIMM (halogen-free)
• Frequency/CL
2
– 1.875ns @ CL = 7 (DDR2-1066)
– 2.5ns @ CL = 5 (DDR2-800)
– 2.5ns @ CL = 6 (DDR2-800)
– 3.0ns @ CL = 5 (DDR2-667)
Notes:
temperature
1
Marking
None
I
Z
-1GA
-80E
-800
-667
1. Contact Micron for industrial temperature
module offerings.
2. CL = CAS (READ) latency.
(ns)
13.125
12.5
15
15
15
15
(ns)
13.125
12.5
15
15
15
15
(ns)
58.125
57.5
60
60
55
55
PDF: 09005aef83b94f21
htf8c64_128_256x64az.pdf - Rev. E 4/14 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2009 Micron Technology, Inc. All rights reserved.

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