|
5962-8601506ZA |
5962-8601503ZA |
5962-8601505ZA |
5962-8601501ZA |
5962-8601504ZA |
5962-8601508ZA |
5962-8601507ZA |
| Description |
LCC-22, Tube |
LCC-22, Tube |
LCC-22, Tube |
LCC-22, Tube |
LCC-22, Tube |
LCC-22, Tube |
LCC-22, Tube |
| Brand Name |
Integrated Device Technology |
Integrated Device Technology |
Integrated Device Technology |
Integrated Device Technology |
Integrated Device Technology |
Integrated Device Technology |
Integrated Device Technology |
| Is it lead-free? |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
| Parts packaging code |
LCC |
LCC |
LCC |
LCC |
LCC |
LCC |
LCC |
| package instruction |
QCCN, LCC22,.3X.5 |
QCCN, LCC22,.3X.5 |
QCCN, LCC22,.3X.5 |
LCC-22 |
LCC-22 |
QCCN, LCC22,.3X.5 |
QCCN, LCC22,.3X.5 |
| Contacts |
22 |
22 |
22 |
22 |
22 |
22 |
22 |
| Manufacturer packaging code |
LC22 |
LC22 |
LC22 |
LC22 |
LC22 |
LC22 |
LC22 |
| Reach Compliance Code |
_compli |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
| ECCN code |
3A001.A.2.C |
3A001.A.2.C |
3A001.A.2.C |
3A001.A.2.C |
3A001.A.2.C |
3A001.A.2.C |
3A001.A.2.C |
| Maximum access time |
55 ns |
45 ns |
55 ns |
35 ns |
45 ns |
70 ns |
70 ns |
| I/O type |
SEPARATE |
SEPARATE |
SEPARATE |
SEPARATE |
SEPARATE |
SEPARATE |
SEPARATE |
| JESD-30 code |
R-CQCC-N22 |
R-CQCC-N22 |
R-CQCC-N22 |
R-CQCC-N22 |
R-CQCC-N22 |
R-CQCC-N22 |
R-CQCC-N22 |
| JESD-609 code |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
| length |
12.3952 mm |
12.3952 mm |
12.3952 mm |
12.3952 mm |
12.3952 mm |
12.3952 mm |
12.3952 mm |
| memory density |
65536 bi |
65536 bit |
65536 bit |
65536 bit |
65536 bit |
65536 bit |
65536 bit |
| Memory IC Type |
STANDARD SRAM |
STANDARD SRAM |
STANDARD SRAM |
STANDARD SRAM |
STANDARD SRAM |
STANDARD SRAM |
STANDARD SRAM |
| memory width |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
| Humidity sensitivity level |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
| Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
| Number of ports |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
| Number of terminals |
22 |
22 |
22 |
22 |
22 |
22 |
22 |
| word count |
65536 words |
65536 words |
65536 words |
65536 words |
65536 words |
65536 words |
65536 words |
| character code |
64000 |
64000 |
64000 |
64000 |
64000 |
64000 |
64000 |
| Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
| Maximum operating temperature |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
| Minimum operating temperature |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
| organize |
64KX1 |
64KX1 |
64KX1 |
64KX1 |
64KX1 |
64KX1 |
64KX1 |
| Output characteristics |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
| Exportable |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
| Package body material |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
| encapsulated code |
QCCN |
QCCN |
QCCN |
QCCN |
QCCN |
QCCN |
QCCN |
| Encapsulate equivalent code |
LCC22,.3X.5 |
LCC22,.3X.5 |
LCC22,.3X.5 |
LCC22,.3X.5 |
LCC22,.3X.5 |
LCC22,.3X.5 |
LCC22,.3X.5 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
CHIP CARRIER |
CHIP CARRIER |
CHIP CARRIER |
CHIP CARRIER |
CHIP CARRIER |
CHIP CARRIER |
CHIP CARRIER |
| Parallel/Serial |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
260 |
260 |
260 |
| power supply |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Filter level |
38535Q/M;38534H;883B |
38535Q/M;38534H;883B |
38535Q/M;38534H;883B |
38535Q/M;38534H;883B |
38535Q/M;38534H;883B |
38535Q/M;38534H;883B |
38535Q/M;38534H;883B |
| Maximum seat height |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
| Maximum standby current |
0.001 A |
0.02 A |
0.02 A |
0.02 A |
0.001 A |
0.001 A |
0.02 A |
| Minimum standby current |
2 V |
4.5 V |
4.5 V |
4.5 V |
2 V |
2 V |
4.5 V |
| Maximum slew rate |
0.09 mA |
0.105 mA |
0.105 mA |
0.09 mA |
0.09 mA |
0.095 mA |
0.12 mA |
| Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
| Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
| Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
| surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
TIN LEAD |
TIN LEAD |
| Terminal form |
NO LEAD |
NO LEAD |
NO LEAD |
NO LEAD |
NO LEAD |
NO LEAD |
NO LEAD |
| Terminal pitch |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
| Terminal location |
QUAD |
QUAD |
QUAD |
QUAD |
QUAD |
QUAD |
QUAD |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
7.366 mm |
7.366 mm |
7.366 mm |
7.366 mm |
7.366 mm |
7.366 mm |
7.366 mm |
| Base Number Matches |
1 |
1 |
1 |
1 |
1 |
1 |
1 |