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IDT77V252L155PG

Description
ATM Segmentation and Reassembly Device, 1-Func, CMOS, PQFP208, 28 X 28 MM, PLASTIC, QFP-208
CategoryWireless rf/communication    Telecom circuit   
File Size163KB,24 Pages
ManufacturerIDT (Integrated Device Technology)
Download Datasheet Parametric Compare View All

IDT77V252L155PG Overview

ATM Segmentation and Reassembly Device, 1-Func, CMOS, PQFP208, 28 X 28 MM, PLASTIC, QFP-208

IDT77V252L155PG Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeQFP
package instructionFQFP, QFP208,1.2SQ,20
Contacts208
Reach Compliance Codenot_compliant
appATM
JESD-30 codeS-PQFP-G208
JESD-609 codee0
length28 mm
Number of functions1
Number of terminals208
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeFQFP
Encapsulate equivalent codeQFP208,1.2SQ,20
Package shapeSQUARE
Package formFLATPACK, FINE PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
Maximum seat height3.86 mm
Maximum slew rate0.3 mA
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Telecom integrated circuit typesATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width28 mm
Base Number Matches1
3.3V 155 Mbps ATM SAR CONTROLLER
WITH ABR SUPPORT FOR PCI-BASED
NETWORKING APPLICATIONS
Integrated Device Technology, Inc.
IDT77V252
KEY FEATURES
• Full-duplex Segmentation and Reassembly (SAR) at
155 Mbps "wire-speed" (310 Mbps aggregate speed)
• Operates with ATM Networks up to 155.52 Mbps
• Stand-alone Controller: Embedded Processor not required
• Performs ATM Layer Protocol Functions
• Supports AAL5, AAL3/4, AAL0 and Raw Cell Formats
• Supports Constant Bit Rate (CBR), Variable Bit Rate
(VBR), and Unassigned Bit Rate (UBR), and Available Bit
Rate (ABR) Service Classes
• Segments and Reassembles CS-PDUs into Host Memory
• Up to 16K Open Transmit Connections
• Up to 16K Simultaneous Receive Connections
• ABR, VBR, UBR Selectable per VC Time-out
• Automatic AAL5 Padding
• Four Buffer Pools for Independent or Chained Reassembly
• Buffer Management Options for MPEG Operation
• Supports Any Buffer Alignment Condition
• Free Bufffer Queues Mapped Into PCI Memory Space
• Rx FIFO Size (Configurable to 1024 Kbytes)
• Configurable Transmit FIFO Depth for Reduced Latency
• Supports Big and Little Endian Data Transfers
• UTOPIA Master/Slave Mode
Null Cell Disable Option During Transmit
RM Cell Handling
Option to Select ITU or ATM Null Cell Format
NAND, Scan, and Output Test Modes
UTOPIA Level 1 Interface to PHY
Utility Bus Interface for PHY Management
Serial EEPROM Interface
EPROM Interface
PCI 2.1 Compliant
Compact PCI R1.0 Hot Swap Friendly Compliant
UNI 3.1, TM 4.0 Compliant
Meets PCI Bus Power Management and Interface Specifi-
cation Revision 1.1
Pin Compatible with IDT 77211/77252 SAR
Software Compatible with the IDT 77252
Commercial and Industrial Temprature Ranges
208-Lead PQFP Package (28 x 28mm)
Software Drivers:
SARWIN 2 Demonstration Program
NDIS Driver
Vx Works (3rd party)
Linux (3rd party)
SYSTEM-LEVEL FUNCTIONAL BLOCK DIAGRAM
16K x 32 to 512K x 32
SR A M
PCI BUS
8
PROM
32
Rx U TO PIA Bus
PCI Interface
8
33M H Z
32
IDT77V252
155Mbps
P C I AT M
ABR SAR
155Mbps
P HY
2
2
Tx UTO PIA Bus
8
U tility B us
8
80.0M HZ OSC.
EEPROM
5350 drw 01
NICStAR is a trademark and the IDT logo is a registered trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGE
©2001 Integrated Device Technology, Inc.
DSC-5350/8
JANUARY 2001
1

IDT77V252L155PG Related Products

IDT77V252L155PG IDT77V252L155PGI
Description ATM Segmentation and Reassembly Device, 1-Func, CMOS, PQFP208, 28 X 28 MM, PLASTIC, QFP-208 ATM Segmentation and Reassembly Device, 1-Func, CMOS, PQFP208, 28 X 28 MM, PLASTIC, QFP-208
Is it Rohs certified? incompatible incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code QFP QFP
package instruction FQFP, QFP208,1.2SQ,20 FQFP, QFP208,1.2SQ,20
Contacts 208 208
Reach Compliance Code not_compliant not_compliant
app ATM ATM
JESD-30 code S-PQFP-G208 S-PQFP-G208
JESD-609 code e0 e0
length 28 mm 28 mm
Number of functions 1 1
Number of terminals 208 208
Maximum operating temperature 70 °C 85 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code FQFP FQFP
Encapsulate equivalent code QFP208,1.2SQ,20 QFP208,1.2SQ,20
Package shape SQUARE SQUARE
Package form FLATPACK, FINE PITCH FLATPACK, FINE PITCH
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED
power supply 3.3 V 3.3 V
Certification status Not Qualified Not Qualified
Maximum seat height 3.86 mm 3.86 mm
Maximum slew rate 0.3 mA 0.3 mA
Nominal supply voltage 3.3 V 3.3 V
surface mount YES YES
technology CMOS CMOS
Telecom integrated circuit types ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE
Temperature level COMMERCIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING
Terminal pitch 0.5 mm 0.5 mm
Terminal location QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
width 28 mm 28 mm
Base Number Matches 1 1

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