|
5962-8969001LA |
5962-8969002LA |
| Description |
Standard SRAM, 2KX8, 25ns, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24 |
Standard SRAM, 2KX8, 20ns, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24 |
| Is it lead-free? |
Contains lead |
Contains lead |
| Is it Rohs certified? |
incompatible |
incompatible |
| Maker |
Pyramid Semiconductor Corporation |
Pyramid Semiconductor Corporation |
| Parts packaging code |
DIP |
DIP |
| package instruction |
DIP, DIP24,.3 |
DIP, DIP24,.3 |
| Contacts |
24 |
24 |
| Reach Compliance Code |
compliant |
compliant |
| ECCN code |
3A001.A.2.C |
3A001.A.2.C |
| Maximum access time |
25 ns |
20 ns |
| I/O type |
COMMON |
COMMON |
| JESD-30 code |
R-GDIP-T24 |
R-GDIP-T24 |
| JESD-609 code |
e0 |
e0 |
| length |
31.75 mm |
31.75 mm |
| memory density |
16384 bit |
16384 bit |
| Memory IC Type |
STANDARD SRAM |
STANDARD SRAM |
| memory width |
8 |
8 |
| Number of functions |
1 |
1 |
| Number of terminals |
24 |
24 |
| word count |
2048 words |
2048 words |
| character code |
2000 |
2000 |
| Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
| Maximum operating temperature |
125 °C |
125 °C |
| Minimum operating temperature |
-55 °C |
-55 °C |
| organize |
2KX8 |
2KX8 |
| Output characteristics |
3-STATE |
3-STATE |
| Package body material |
CERAMIC, GLASS-SEALED |
CERAMIC, GLASS-SEALED |
| encapsulated code |
DIP |
DIP |
| Encapsulate equivalent code |
DIP24,.3 |
DIP24,.3 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
| Package form |
IN-LINE |
IN-LINE |
| Parallel/Serial |
PARALLEL |
PARALLEL |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
| power supply |
5 V |
5 V |
| Certification status |
Qualified |
Qualified |
| Filter level |
38535Q/M;38534H;883B |
38535Q/M;38534H;883B |
| Maximum seat height |
5.08 mm |
5.08 mm |
| Maximum standby current |
0.02 A |
0.02 A |
| Minimum standby current |
4.5 V |
4.5 V |
| Maximum slew rate |
0.135 mA |
0.15 mA |
| Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
| Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
| Nominal supply voltage (Vsup) |
5 V |
5 V |
| surface mount |
NO |
NO |
| technology |
CMOS |
CMOS |
| Temperature level |
MILITARY |
MILITARY |
| Terminal surface |
TIN LEAD |
TIN LEAD |
| Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
| Terminal pitch |
2.54 mm |
2.54 mm |
| Terminal location |
DUAL |
DUAL |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
7.62 mm |
7.62 mm |
| Base Number Matches |
1 |
1 |
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