FX10B-120P/12-SV1(82) datasheet, PDF

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FX10B-120P/12-SV1(82): Descriptionconn hdr 120pos W/O post smd; CategoryThe connector The connector; File Size632KB，20 Pages; ManufacturerHirose; Websitehttp://www.hirose-connectors.com/; Environmental Compliance

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FX10B-120P/12-SV1(82) Overview

conn hdr 120pos W/O post smd

FX10B-120P/12-SV1(82) Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Hirose
Reach Compliance Code	unknow
body width	0.232 inch
subject depth	0.138 inch
body length	1.697 inch
Body/casing type	PLUG
Connector type	BOARD CONNECTOR
Contact to complete cooperation	AU
Contact completed and terminated	TIN
Contact point gender	MALE
Contact material	PHOSPHOR BRONZE
contact mode	RECTANGULAR
Contact resistance	60 mΩ
Contact style	CENTRONIC
Dielectric withstand voltage	150VAC V
Durability	50 Cycles
Insulation resistance	100000000 Ω
Insulator color	BEIGE
insulator material	LIQUID CRYSTAL POLYMER (LCP)
Manufacturer's serial number	FX10
Plug contact pitch	0.02 inch
Installation option 1	LOCKING
Installation method	STRAIGHT
Installation type	BOARD
Number of connectors	ONE
PCB row number	2
Number of rows loaded	2
Maximum operating temperature	85 °C
Minimum operating temperature	-55 °C
PCB contact pattern	RECTANGULAR
PCB contact row spacing	5.207 mm
polarization key	POLARIZED HOUSING
Rated current (signal)	0.3 A
Guideline	UL
reliability	COMMERCIAL
Terminal pitch	0.508 mm
Termination type	SURFACE MOUNT
Total number of contacts	120

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Gbps 0.5mm pitch Stacking Connectors

FX10 Series

Electrical Interface for the OIF 100G Long-Haul DWDM Transmission Module (MSA-100GLH)

sMechanical

Features

0.5mm Pitch

Stacking Height : 4 ~ 8mm

Number of Contacts

With ground plate type : 80 / 100 / 120 / 140

Without ground plate type : 96 / 120 / 144 / 168

Improved Transmission Efficiency

Between Boards

sWith

GND Plate Type

Transmission characteristics have been improved through a

design that fixes ground plates to both sides of the header

and receptacle.

10 Signal:1 Ground Arrangement

Signal and ground are arranged in a ratio of 10:1 with the

ground plate SMT connected to the board. The ground

stability achieved serves to reduce noise.

Ground

plate

Signal contact

Housing

Metal Fittings for Added Solder Weld

Strength

Metal fittings provide greater adhesion to the board,

protecting against peeling. The unique connector design

provides a connection between the fitting and the ground

plate for a stronger ground.

.75

0.5

.75

Metal fitting

Ground plate and metal

fitting make contact

Suited to High-Density Applications

The signal contact pitch of 0.5 mm produces a smaller

connector utilizing less board area for mounting.

qCut

Section

High contact reliability

Effective mating length is 1.1 mm for signal contacts.

Optional Ground Plate

An alternate style without the ground plate is available. The

space provided by the ground plate removal has been filled

with additional signal contacts.

sSignal

Integrity Features

qInsertion-Loss-to-Crosstalk-Ratio(ICR)

The insertion-loss-to-crosstalk-ratio (ICR) with five-

aggressor differential FEXT meets the extrapolated

IEEE 802.3ap specification for 10

Gbps.

ICR (dB)

ICR

ICR spec

Frequency (GHz)

Z (Ohm)

115

110

105

100

S(3,3)

200

400

600

Time (ps)

800

1000

qDifferential

Impedance

The differential impedance is within 100 +/- 10 ohms

at 30ps rise time (20% to 80%).

sStack

Height

qWith

ground plate

Headers

Receptacles

FX10#-*S/*-SV

FX10#-*P/*-SV FX10#–*P/*–SV1

( )

4mm

5mm

qWithout

ground plate

Headers

Receptacles

FX10#-*S-SV

FX10#-*P-SV FX10–*P–SV1 FX10#-168P-SV2 FX10#-168P-SV3 FX10#-168P-SV4

4mm

5mm

6mm

7mm

8mm

(H):Reference dimension

2011.01

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