EEWORLDEEWORLDEEWORLD

Part Number

Search

D55342M07W17D4P-W

Description
RESISTOR, METAL GLAZE/THICK FILM, 0.25 W, 1 %, 300 ppm, 17.4 ohm, SURFACE MOUNT, 1206, CHIP
CategoryPassive components    The resistor   
File Size100KB,1 Pages
ManufacturerState of the Art Inc.
Environmental Compliance
Download Datasheet Parametric View All

D55342M07W17D4P-W Overview

RESISTOR, METAL GLAZE/THICK FILM, 0.25 W, 1 %, 300 ppm, 17.4 ohm, SURFACE MOUNT, 1206, CHIP

D55342M07W17D4P-W Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid7024505467
package instructionCHIP
Reach Compliance Codecompliant
Country Of OriginUSA
ECCN codeEAR99
YTEOL7.55
structureChip
JESD-609 codee4
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package height0.46 mm
Package length3.2 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width1.55 mm
method of packingWAFFLE PACK
Rated power dissipation(P)0.25 W
Rated temperature70 °C
GuidelineMIL-PRF-55342
resistance17.4 Ω
Resistor typeFIXED RESISTOR
size code1206
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient300 ppm/°C
Terminal surfaceGold (Au)
Terminal shapeWRAPAROUND
Tolerance1%
Operating Voltage100 V
State of the Art, Inc.
Thick Film Chip Resistor
D55342/07 RM1206
GLASS
PASSIVATION
WRAPAROUND
TERMINATIONS
RESISTOR
FILM
96% ALUMINA CHIP
PERFORMANCE
TEMPERATURE RISE (°C)
Resistance Range
Tolerances
Maximum Power
Maximum Voltage
1
W
- 22M
W
1%, 2%, 5%, 10%
250 mW
100 Volts
CHARACTERISTICS*
M
K
±100
±0.5%
±0.25%
±0.25%
±0.25%
±0.5%
±0.5%
±0.5%
±300
±0.5%
±0.5%
±0.5%
±0.25%
±0.5%
±2.0%
±1.0%
CURRENT NOISE
POWER DISSIPATION
fiber epoxy board
ceramic board
TESTS
TCR (-55 to +125
°
C) in ppm/
°
C
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Soldering Heat
Moisture Resistance
Life, 2,000 Hours
High Temperature Exposure
POWER DISSIPATION (WATTS)
LIFE TEST
POWER DERATING
*Maximum allowable change per MIL-PRF-55342,
typical change is 10% of these values.
PART NUMBERING
D55342 K 07 B 100D S - TR
PACKAGING CODE: TR = Tape & Reel W= Waffle Pack
PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% S: 0.001% T: Space Level C: Non - ER
RESISTANCE AND TOLERANCE CODE:
Three significant digits, with a letter indicating the
decimal location, the tolerance, and the value range.
D: 1%
W
E: 1% K
W
F: 1% M
W
G: 2%
W
H: 2% K
W
T: 2% M
W
J: 5%
W
K: 5% K
W
L: 5% M
W
M: 10%
W
N: 10% K
W
P: 10% M
W
TERMINATION MATERIALS:
B: Solderable wraparound C: Epoxy bondable palladium/silver wraparound U: Epoxy bondable platinum/gold wraparound
W: Gold wire bondable
G: Gold wraparound
SIZE CODE: /07* = RM1206
TEMPERATURE CHARACTERISTIC: K: ± 100ppm M: ± 300ppm
PERFORMANCE SPECIFICATION MIL-PRF-55342
*RM1206 is specified in MIL-PRF-55342 as D55342 /07 rather than M55342 /07.
MECHANICAL
INCHES
MILLIMETERS
.156
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
.126 (.118 - .134)
.061 (.058 - .068)
.018 (.015 - .033)
.016 (.010 - .025)
.018 (.010 - .025)
.090 (.086 - .094)
.0084 grams
3.20
1.55
0.46
0.41
0.46
2.29
(3.00 - 3.40)
(1.47 - 1.73)
(0.38 - 0.84)
(0.25 - 0.64)
(0.25 - 0.64)
(2.18 - 2.39)
.067
.084
.036
State of the Art, Inc.
2470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401
“Specifications subject to change without notice.”
www.resistor.com
04/09/08
[Repost] Current situation of MEMS in China
The current situation of MEMS in China (zz) Today I saw an article online that summarized the current situation of MEMS development in China. I personally feel that his summary is quite comprehensive,...
zhuxl Robotics Development
Hardware engineers please take a look!
I would like to ask all the experts, especially hardware engineers, when you use FPGA, especially Xilinx 7 series, do you draw the package yourself or download it from somewhere? I don't see it on the...
廖欧亚大陆 FPGA/CPLD
There is a large gap in FPGA talent, and the domestic FPGA industry is facing challenges!
Alibaba's semiconductor company "Pingtou Ge" has released the Xuantie 9 10 chip and will open it to developers. Developers around the world can download the FPGA code of the processor for free and qui...
小柳叶 FPGA/CPLD
1. Development board unpacking test
1. After the application was confirmed, I was looking forward to receiving the development board. After waiting for a day, I finally got it. The picture below is the actual picture of the development ...
我有一个梦想221 GD32 MCU
TI Electronic Design Contest---TI High-Performance Analog Product Brochure
[b][size=5][color=red][/color][/size][/b]...
qwqwqw2088 Analogue and Mixed Signal
TI Wireless LED Lighting System Design Application
Short-distance wireless communication technology is an emerging communication network technology. Its application effectively overcomes the drawbacks of traditional wired control and makes the system ...
qwqwqw2088 Analogue and Mixed Signal

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 417  2496  2047  954  1968  9  51  42  20  40 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号