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3SMAJ5933BHE3-TP

Description
Zener Diode,
CategoryDiscrete semiconductor    diode   
File Size215KB,4 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance
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3SMAJ5933BHE3-TP Overview

Zener Diode,

3SMAJ5933BHE3-TP Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
package instructionR-PDSO-C2
Reach Compliance Code_compli
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance17.5 Ω
Maximum forward voltage (VF)1.5 V
JEDEC-95 codeDO-214AC
JESD-30 codeR-PDSO-C2
Maximum knee impedance650 Ω
Humidity sensitivity level1
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
polarityUNIDIRECTIONAL
Maximum power dissipation3 W
GuidelineAEC-Q101
Nominal reference voltage22 V
Maximum reverse current1 µA
Reverse test voltage16.7 V
surface mountYES
technologyZENER
Terminal formC BEND
Terminal locationDUAL
Maximum time at peak reflow temperature10
Maximum voltage tolerance5%
Working test current17 mA
Base Number Matches1
MCC
Micro Commercial Components
R
  omponents
20736 Marilla Street Chatsworth

  !"#
$ %    !"#
3SMAJ5925BHE3
THRU
3SMAJ5956BHE3
3.0 Watt
Surface Mount
Silicon
Zener Diodes

Features
AEC-Q101
Qualified
Low Inductance, Low Profile Mounting
Glasss Passivated Junction
High specified maximum current(IZM)when adequately heat sinking
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
Halogen
free
Surface Mount Application
Mechanical Data
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Terminals solderable per MIL-STD-750, Method 2026
Polarity is indicated by cathode band.
Packaging: Standard 12mm Tape (see EIA 481)
Maximum temperature for soldering: 260 C for 10 seconds.
0
DO-214AC

(SMA) (LEAD FRAME)



J
H
Maximum Ratings @ 25
o
C Unless Otherwise Specified
A
C
Junction
to
Lead
Junction
to
Ambient
Maximum
Forward
Voltage
Steady State
Power
Dissipation
Operation and
Storage
Temperature
Thermal
Resistance
Thermal
Resistance
V
F
P
d
T
J
,
T
STG
1.5V
3.0W
-55
o
C to
+150
o
C
(Note:
2)
(Note:
3)
E
F
G
DIMENSIONS
INCHES
MIN
.079
.050
.002
---
.030
.065
.189
.157
.090
MM
MIN
2.00
1.27
.05
---
.76
1.65
4.80
4.00
2.25
D
B
R
thJL
R
thJA
25
/W
135
/W
DIM
A
B
C
D
E
F
G
H
J
MAX
.096
.064
.008
.02
.060
.091
.220
.181
.115
MAX
2.44
1.63
.20
.51
1.52
2.32
5.59
4.60
2.92
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.090"
0.085"
Note:
1.
2.
3.
High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
Forward Current @ 200mA.
Mounted on 5.0mm2 (1oz thick) Iand areas.
Lead temperature at TL=75
o
C
Lead temperature at T
A
=15
O
C
0.070"
Revision:
A
www.mccsemi.com
1 of 4
2015/06/11
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