Micro PGA 700 Position
Socket
DESCRIPTION
700 position, Micro Pin Grid Array (PGA)
SMT ZIF socket on a 1.27mmx1.27mm con-
tact pitch. The socket utilizes a standard
m2.5 Hex Allen wrench and cam actuation
method for mating and unmating the micro-
processor package.
05/02
1654000
new product
APPLICATION
This socket is for the next generation IA-64
(Intel Architecture – 64 bit) Itanium
(McKinley) servers and workstations.
KEY FEATURES
•
1.27mm x 1.27mm contact spacing.
•
Zero Insertion Force for device socketing.
•
Positive stop cam actuation requires standard
m2.5 Hex Allen wrench.
•
Availiable with or without visual Open/Close indicator.
•
Reliable dual point of contact.
•
Solder ball SMT for PCB attachment.
•
Compliant contact geometry minimizes effects of
thermal expansion.
•
Nickel plating barrier prevents solder wicking.
•
High temperature thermoplastic housing material.
PART NUMBER
•
1364657-2 (with visual Open/Close indicator)
•
1489644-2 (without visual Open/Close indicator)
•
1364649-2 Restricted to Intel (with visual Open/Close indicator)
TECHNICAL DOCUMENTS
• Product Specification: 108-1947
• Application Specification: 114-13022
• Instruction Sheet: 408-8409
FOR MORE INFORMATION
•
Kim Whitman, Business Development Mgr.
Phone: 717-592-3376
Fax: 717-592-6222
E-mail: kbwhitma@tycoelectronics.com
•
Darrell Wertz, Development Engineer
Phone: 717-592-6544
Fax: 717-985-2833
E-mail: dlwertz@tycoelectronics.com
Micro PGA 700 Position Socket
METRIC
Dimensions are millimeters
PRODUCT DIMENSIONS
Cover
Cam Pin
Wear Plate (2)
Locking Plate
Open/Close
Indicator
Housing
Technical Support Center/AMP FAX Service
1-800-522-6752 717-986-7777
Specifications subject to change.
Dimensions are in millimeters
www.tycoelectronics.com
1654000-PDF only-05/02
©2002 by Tyco Electronics. All Rights Reserved. Tyco, AMP, and AMP FAX are trademarks.
Intel and Itanium are trademark of Intel Corporation.
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