FH34(S)Series●0.5 mm Pitch, 1.0 mm above the board Top and Top Bottom Contact, Back-Flip actuator Flexible Printed Circuit & Flexible Flat Cable ZIF Connectors
■Specifications
Current rating 0.5 A (Note 1)
Ratings
Voltage rating 50 Vrms AC
Recommended FPC/FFC
Operating temperature range:
-55 to +85°C (Note 1)
Operating humidity range:
Relative humidity 90% max. (No condensation)
Storage temperature range:
-10 to +50°C (Note 2)
Storage humidity range:
Relative humidity 90% max. (No condensation)
Thickness: 0.3 ± 0.03 mm, Gold plated contact pads
Item
Specification
1. Insulation resistance 500 Mø min.
2. Withstanding voltage No flashover or insulation breakdown
100 mø max.
3. Contact resistance
* Including FPC and FFC conductor resistance
Contact resistance: 100 mø max.
4. Durability
No damage, cracks, or parts dislocation
No electrical discontinuity of 1μs or longer
5. Vibration
Contact resistance: 100 mø max.
No damage, cracks, or parts dislocation
No electrical discontinuity of 1μs or longer
6. Shock
Contact resistance: 100 mø max.
No damage, cracks, or parts dislocation
Contact resistance: 100 mø max.
7. Humidity (Steady state) Insulation resistance: 50 Mø min.
No damage, cracks, or parts dislocation
Contact resistance: 100 mø max.
8. Temperature cycle Insulation resistance: 50 Mø min.
No damage, cracks, or parts dislocation
Conditions
100 V DC
250 Vrms AC / one minute
1 mA, AC / DC 20mV max (AC: 1kHz)
20 cycles
Frequency: 10 to 55 Hz, single amplitude of 0.75
mm, 10 cycles in each of the 3 axis
Acceleration of 981m/s
2
, 6 ms duration, sine half-
wave, 3 cycles in each of the 3 axis
96 hours at 40°C and humidity of 90 to 95%
Temperature : -55°C
/
+15°C to +35°C/+85°C
/
+15°C to +35°C
Time:
30
/
2 to 3
/
30
/
2 to 3 minutes
5 cycles
Reflow: At the recommended temperature profile
9. Resistance to soldering heat No deformation of components affecting performance
Manual soldering: 350°C ±5°C for 5 seconds (Note 3)
Note1: When passing the current through all of the contacts, use 70% of the rated current.
Note2: Includes temperature rise caused by current flow.
Note3: The term "storage" refers to products stored for a long period prior to mounting and use.
The operating temperature and humidity range covers the non-conducting condition of installed connectors in storage,
shipment or during transportation after board mounting.
■Materials
Part
Material
LCP
Insulator
PA
LCP(8pos.)
Phosphor bronze
Phosphor bronze
Finish
FH34S series
Color:Beige
FH34SRJ series
Color:Gray
FH34S series
Color:Black
FH34SRJ series
FH34SRJ series
Color:Black
Gold plating with nickel barrier
Pure tin reflow plating
Remarks
UL94V-0
UL94V-0
-------
-------
Contacts
Metalfittings
■Ordering
information
FH 34S RJ - 30S - 0.5 SH (50)
1
1
Series name : FH
2
Series No.
: 34S
3
Blank : Top contact
: Top and Bottom contact, halogen-free
(Flame retardance UL94V-0).
4
Number of positions : 4 to 40
5
Contact pitch : 0.5mm
RJ
2
3
4
5
6
6
Termination type
7
Specifications
7
SH : SMT horizontal mounting type
(50)…Standard product 5,000 pieces/reel
(99)…500 pieces/reel
2
FH34(S)Series●0.5 mm Pitch, 1.0 mm above the board Top and Top Bottom Contact, Back-Flip actuator Flexible Printed Circuit & Flexible Flat Cable ZIF Connectors
■Connector
Dimensions
A±0.15
B
0.5
∞Number of contacts
(0.15)
0.15 H
H
Number of contacts indicator
Cav No.
(1.95)
(3.2)
(3.8)
2.9
1±0.1
(1.75)
1
HRS mark
Note 1 : The coplanarity of each terminal lead within specified dimension is 0.1 mm Max.
Note 2 : Packaged on tape and reel only. Check packaging specification.
Note 3 : Slight variations in color of the plastic compounds do not affect form, fit or function of the connector.
Note 4 : After reflow, the terminal plating may change color, however this does not represent a quality issue.
All dimensions: mm
Part Number
FH34S-7S-0.5SH(50)
FH34S-23S-0.5SH(50)
FH34S-32S-0.5SH(50)
FH34SRJ-4S-0.5SH(50)
FH34SRJ-6S-0.5SH(50)
FH34SRJ-8S-0.5SH(50)
FH34SRJ-10S-0.5SH(50)
FH34SRJ-11S-0.5SH(50)
FH34SRJ-12S-0.5SH(50)
FH34SRJ-14S-0.5SH(50)
FH34SRJ-16S-0.5SH(50)
FH34SRJ-18S-0.5SH(50)
FH34SRJ-20S-0.5SH(50)
FH34SRJ-22S-0.5SH(50)
FH34SRJ-24S-0.5SH(50)
FH34SRJ-26S-0.5SH(50)
FH34SRJ-30S-0.5SH(50)
FH34SRJ-34S-0.5SH(50)
FH34SRJ-40S-0.5SH(50)
CL No.
CL580-1224-2-50
CL580-1228-3-50
CL580-1208-6-50
CL580-1238-7-50
CL580-1236-1-50
CL580-1231-8-50
CL580-1251-5-50
CL580-1258-4-50
CL580-1253-0-50
CL580-1252-8-50
CL580-1259-7-50
CL580-1248-0-50
CL580-1256-9-50
CL580-1254-3-50
CL580-1255-6-50
CL580-1247-8-50
CL580-1232-0-50
CL580-1261-9-50
CL580-1260-9-50
Number of Contacts
7
23
32
4
6
8
10
11
12
14
16
18
20
22
24
26
30
34
40
A
5.5
13.5
18
4
5
6
7
7.5
8
9
10
11
12
13
14
15
17
19
22
B
3
11
15.5
1.5
2.5
3.5
4.5
5
5.5
6.5
7.5
8.5
9.5
10.5
11.5
12.5
14.5
16.5
19.5
C
4.03
12.07
16.53
2.53
3.53
4.53
5.53
6.03
6.53
7.53
8.57
9.57
10.57
11.57
12.57
13.57
15.57
17.53
20.53
D
4.88
12.88
17.38
3.38
4.38
5.38
6.38
6.88
7.38
8.38
9.38
10.38
11.38
12.38
13.38
14.38
16.38
18.38
21.38
Tape and reel packaging (5,000 pieces/reel, 500 pieces/reel).
Order by number of reels.
A **
(0.15)
(C)
D±0.1
0.5
2.9
0.1
0.3
3
FH34(S)Series●0.5 mm Pitch, 1.0 mm above the board Top and Top Bottom Contact, Back-Flip actuator Flexible Printed Circuit & Flexible Flat Cable ZIF Connectors
■Recommended
PCB mounting pattern and metal mask dimensions
Recommended metal mask thickness: t=0.1
0.65±0.03
(Metal mask)
B
J
(0.25)
(0.25)
(0.15)
(2.9)
0.5
∞Number of contacts
0.3±0.05
0.1 J
0.25±0.03
(Metal mask)
0.8±0.05
3.3±0.05
0.8±0.05
(0.065)
(0.185)
E±0.1
F±0.1
(A)
■Recommended
FPC/FFC Dimensions
G±0.05
0.5±0.07
0.5±0.03
0.
2
B±0.03
0.3±0.03
R
0.3±0.03
2-
(Uncover area)
Note 1 : Stiffener dimension should be 2.5mm min., and H dimension should be 0.5mm for improved flexibility of FPC.
Note 2 : When using the FPC/FFC in FH34S or FH19SC connectors, the exposed area inserted in either connector is 2.5mm ±
0.3mm and the stiffener is 3.5mm min.
All dimensions: mm
F
G
4
5.4
12
13.4
16.5
17.9
2.5
3.9
3.5
4.9
4.5
5.9
5.5
6.9
6
7.4
6.5
7.9
7.5
8.9
8.5
9.9
9.5
10.9
10.5
11.9
11.5
12.9
12.5
13.9
13.5
14.9
15.5
16.9
17.5
18.9
20.5
21.9
Part Number
FH34S-7S-0.5SH(50)
FH34S-23S-0.5SH(50)
FH34S-32S-0.5SH(50)
FH34SRJ-4S-0.5SH(50)
FH34SRJ-6S-0.5SH(50)
FH34SRJ-8S-0.5SH(50)
FH34SRJ-10S-0.5SH(50)
FH34SRJ-11S-0.5SH(50)
FH34SRJ-12S-0.5SH(50)
FH34SRJ-14S-0.5SH(50)
FH34SRJ-16S-0.5SH(50)
FH34SRJ-18S-0.5SH(50)
FH34SRJ-20S-0.5SH(50)
FH34SRJ-22S-0.5SH(50)
FH34SRJ-24S-0.5SH(50)
FH34SRJ-26S-0.5SH(50)
FH34SRJ-30S-0.5SH(50)
FH34SRJ-34S-0.5SH(50)
FH34SRJ-40S-0.5SH(50)
1.5±0.3
CL No.
CL580-1224-2-50
CL580-1228-3-50
CL580-1208-6-50
CL580-1238-7-50
CL580-1236-1-50
CL580-1231-8-50
CL580-1251-5-50
CL580-1258-4-50
CL580-1253-0-50
CL580-1252-8-50
CL580-1259-7-50
CL580-1248-0-50
CL580-1256-9-50
CL580-1254-3-50
CL580-1255-6-50
CL580-1247-8-50
CL580-1232-0-50
CL580-1261-9-50
CL580-1260-9-50
Number of Contacts
7
23
32
4
6
8
10
11
12
14
16
18
20
22
24
26
30
34
40
A
5.5
13.5
18
4
5
6
7
7.5
8
9
10
11
12
13
14
15
17
19
22
B
3
11
15.5
1.5
2.5
3.5
4.5
5
5.5
6.5
7.5
8.5
9.5
10.5
11.5
12.5
14.5
16.5
19.5
E
4.6
12.6
17.1
3.1
4.1
5.1
6.1
6.6
7.1
8.1
9.1
10.1
11.1
12.1
13.1
14.1
16.1
18.1
21.1
4
2.5MIN(Stiffener)
H
(0.15)
FH34(S)Series●0.5 mm Pitch, 1.0 mm above the board Top and Top Bottom Contact, Back-Flip actuator Flexible Printed Circuit & Flexible Flat Cable ZIF Connectors
■Recommended
FPC construction
●
Contact FPC manufacturer for specific details.
1. Using Single-sided FPC
FPC : Flexible Printed Circuit
Material Name
Covering film layer
Cover adhesive
Surface treatment
Copper foil
Base adhesive
Base film
0.2μm thick gold plated over 1
to 5μm thick nickel underplating
Cu
1oz
Polyimide
Material
1 mil thick
Material Thickness
(μm)
(25)
(25)
3
35
25
25
35
175
298
Thermosetting adhesive
Polyimide
1 mil thick
Reinforcement material adhesive Thermosetting adhesive
Stiffener
Polyimide
Total
7 mil thick
2. Using Double-sided FPC
FPC : Flexible Printed Circuit
Material Name
Covering layer film
Cover adhesive
Surface treatment
Through-hole copper
Copper foil
Base adhesive
Base film
Base adhesive
Copper foil
Cover adhesive
Covering film layer
Cu
1/2oz
0.2μm thick gold plated over 1
to 5μm thick nickel underplating
Cu
Cu
1/2oz
Polyimide
Material
1 mil thick
Material Thickness
(μm)
(25)
(25)
3
15
18
18
25
18
(18)
25
25
50
100
297
Thermosetting adhesive
Polyimide
1 mil thick
Thermosetting adhesive
Polyimide
1 mil thick
Reinforcement material adhesive Thermosetting adhesive
Stiffener
Polyimide
Total
4 mil thick
* To prevent release of the FPC due to its bending, use of the double sided FPC with copper foil on the back
side is not recommended.
3. Using FFC
FFC : Flexible Flat Cable
Material Name
Polyester film
Adhesive
Gold plated annealed copper foil
Adhesive
Polyester
Adhesive
Stiffener
Polyester
Polyester
Total
Polyester
Thermoplastic polyester
Material
Material Thickness
(μm)
(12)
(30)
35
30
12
30
188
295
4. Precautions
1. This specification is a recommendation for the construction of the FH34S Series FPC and FFC (t=0.3 ± 0.03).
2. For details about the construction, please contact the FPC/FFC manufacturers.
[size=3]Have you ever encountered this situation at work? You wanted to use a serial port tool, but you downloaded several at the same time and found that none of them were very useful. Have you ever ...
[i=s]This post was last edited by flyriz on 2020-11-26 16:20[/i]Hello everyone, I encountered a very strange problem: As shown in the figure above, the two upper pins of STM32F767 are configured as th...
In general, resistor networks are tested using one of three measurement methods:Standard four-wire Kelvin measurementSix-wire guarded ohm or delta resistance measurement“ Y ” type or buried node resis...
Let's talk about the application process of TI samples first. 1. Open the TI official website and find the link to request samples. 2. New users need to register. You can register after selecting the ...
In early 2002, I started to write a working program for an IC card prepaid electricity meter. The meter used Philips' 8-bit 51-expanded single-chip microcomputer
87LPC764
, and wa...[Details]
introduction
my country has a vast territory and a large population. The scale of housing construction is huge, and the amount of residential construction is large and wide. It is still on t...[Details]
Today, with the increasing integration of functions, mobile phones can also be used as portable media players (PMP), digital cameras, handheld computers (PDAs), and even global positioning systems ...[Details]
0 Introduction
With the development of my country's economy, the number of motor vehicles continues to increase. The growth of existing roads and other hardware facilities can no longer meet t...[Details]
introduction
Throughout the history of automotive lighting, power has always played an important role. Initially, cars only needed headlights to see the road in the dark. Later, other light so...[Details]
Nippon Electric Works and Volvo Technology Japan have developed a wireless power supply system for electric vehicles (EVs). Using this system, the two companies have successfully conducted an exper...[Details]
I've been studying dot matrix recently. It looks simple, but it takes a while to master it completely! The 8*8 dot matrix hardware circuit I'm making now is like this. The row is driven by 74HC138 + t...[Details]
Since AC mains power may experience power outages, voltage sags and surges, continuous undervoltage and overvoltage, and frequency fluctuations during supply, these factors will affect the continuous ...[Details]
Introduction
Nowadays, people pay more and more attention to the security alarm system, and people have higher and higher requirements for the functions and performance of the alarm. This paper prop...[Details]
Key Points
1. Now, in addition to high-end smartphones and tablets, users also expect to use touch screens in other applications, and they are gradually appearing in cars and instruments.
...[Details]
0 Introduction
Wireless Sensor Network (WSN) monitors the target by deploying a large number of sensor nodes in the target area. WSN realizes the positioning and tracking of the target, determi...[Details]
Distributed Wireless Communication System (DWCS) uses distributed antennas, distributed processing control, joint signal processing and other technologies to improve the system's spectrum efficie...[Details]
This article discusses the six design steps of LED lighting system design in detail: (1) determine the lighting requirements; (2) determine the design goals and estimate the optics; (3) the efficie...[Details]
For battery-powered portable devices, in addition to breaking through the limitations of processing power, the performance of portable system power supplies also needs to be continuously improved. ...[Details]
The future energy storage hotspot is not coal or iron ore, but lithium. This lightest metal in nature may be the heaviest resource in the future energy landscape. China launched an ambitious electr...[Details]