EEWORLDEEWORLDEEWORLD

Part Number

Search

B0202AA-02-2643-B

Description
Fixed Resistor, Thin Film, 0.25W, 264000ohm, 100V, 0.1% +/-Tol, 50ppm/Cel, Surface Mount, 0202, CHIP
CategoryPassive components    The resistor   
File Size381KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Download Datasheet Parametric View All

B0202AA-02-2643-B Overview

Fixed Resistor, Thin Film, 0.25W, 264000ohm, 100V, 0.1% +/-Tol, 50ppm/Cel, Surface Mount, 0202, CHIP

B0202AA-02-2643-B Parametric

Parameter NameAttribute value
Objectid1579348888
package instructionCHIP
Reach Compliance Codecompliant
ECCN codeEAR99
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTRAY
Rated power dissipation(P)0.25 W
Rated temperature70 °C
resistance264000 Ω
Resistor typeFIXED RESISTOR
size code0202
surface mountYES
technologyTHIN FILM
Temperature Coefficient50 ppm/°C
Terminal shapeONE SURFACE
Tolerance0.1%
Operating Voltage100 V
Wire Bondable
Chip Resistors
WBC Series
Discrete or tapped schematics
MIL inspection available
High resistor density
IRC’s WBC series wire bondable chip resistors are ideally suited for
the most demanding hybrid application. The WBC combines IRC’s
TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to produce an extremely small
footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
(0.508mm ±0.025)
0.020˝ ±0.001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
(0.508mm ±0.025)
0.020˝ ±0.001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
R0202 and
T0303
B0202
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
(0.762mm ±0.025)
0.030˝ ±0.001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
WBC Series Issue January 2009 Sheet 1 of 3
What do you think about the popular ESP32 chip-level bug?
Everyone should have heard of Espressif's ESP8266 wifi chip. It has been very popular in the past two years and many people are researching and applying it. Last year, Espressif launched a ESP32 serie...
bobde163 DIY/Open Source Hardware
Can you share your experience in learning layout design?
As title...
香蕉香蕉香蕉 RF/Wirelessly
Tektronix TDS 320 Oscilloscope Chinese User Manual
Does anyone have the Chinese user manual for the Tektronix TDS 320 oscilloscope, or tell me where to download it? I need to use this instrument recently, but I don't know how to use it. Please help me...
censtar_qjc Embedded System
I took some photos of emergency light accessories in the rain. Let's take a look.
Entrusted by Blue Eyed Fox, I went to explore the related accessories of DIY emergency lights. If you have any questions, please ask here.The devices we provide include: Li+ battery pack (12V/1.3AH, b...
soso DIY/Open Source Hardware
Voltage Conversion
The ADC12 module integrated inside the MSP430F1611 chip measures the positive voltage level of the power supply, and obtains the conversion data NADC by comparing the measured voltage level with the r...
kdliang031220 Microcontroller MCU
【Signal Processing】Application of FPGA in high-speed digital signal processing system
Due to cost, system power consumption and time to market, many communication, video and image systems can no longer be simply implemented with existing DSP processors. Field Programmable Gate Arrays (...
hangsky FPGA/CPLD

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1156  1027  2417  2066  2194  24  21  49  42  45 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号