5962-8601503XX datasheet, PDF - EEWORLD Datasheet

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5962-8601503XX: DescriptionStandard SRAM, 64KX1, 45ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22; Categorystorage storage; File Size189KB，8 Pages; ManufacturerMicross; Websitehttps://www.micross.com

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5962-8601503XX Overview

Standard SRAM, 64KX1, 45ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22

5962-8601503XX Parametric

Parameter Name	Attribute value
Parts packaging code	DIP
package instruction	DIP,
Contacts	22
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	45 ns
JESD-30 code	R-CDIP-T22
length	27.94 mm
memory density	65536 bit
Memory IC Type	STANDARD SRAM
memory width	1
Number of functions	1
Number of terminals	22
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	64KX1
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	SERIAL
Certification status	Not Qualified
Maximum seat height	3.89 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm
Base Number Matches	1

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5962-8601503XX Related Products

	5962-8601503XX	5962-8601505XX	5962-8601502XX	5962-8601506XX	5962-8601504XX	5962-8601501XX	5962-8601506XC	5962-8601502XC	5962-8601504XC
Description	Standard SRAM, 64KX1, 45ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22	Standard SRAM, 64KX1, 55ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22	Standard SRAM, 64KX1, 35ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22	Standard SRAM, 64KX1, 55ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22	Standard SRAM, 64KX1, 45ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22	Standard SRAM, 64KX1, 35ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22	Standard SRAM, 64KX1, 55ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22	Standard SRAM, 64KX1, 35ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22	Standard SRAM, 64KX1, 45ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22
Parts packaging code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
package instruction	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,
Contacts	22	22	22	22	22	22	22	22	22
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Maximum access time	45 ns	55 ns	35 ns	55 ns	45 ns	35 ns	55 ns	35 ns	45 ns
JESD-30 code	R-CDIP-T22	R-CDIP-T22	R-CDIP-T22	R-CDIP-T22	R-CDIP-T22	R-CDIP-T22	R-CDIP-T22	R-CDIP-T22	R-CDIP-T22
length	27.94 mm	27.94 mm	27.94 mm	27.94 mm	27.94 mm	27.94 mm	27.94 mm	27.94 mm	27.94 mm
memory density	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	1	1	1	1	1	1	1	1	1
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	22	22	22	22	22	22	22	22	22
word count	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
character code	64000	64000	64000	64000	64000	64000	64000	64000	64000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	64KX1	64KX1	64KX1	64KX1	64KX1	64KX1	64KX1	64KX1	64KX1
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	SERIAL	SERIAL	PARALLEL	PARALLEL	PARALLEL	SERIAL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3.89 mm	3.89 mm	3.89 mm	3.89 mm	3.89 mm	3.89 mm	3.89 mm	3.89 mm	3.89 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm
Base Number Matches	1	1	1	1	1	1	1	1	-

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Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

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