|
SN74LVC1GU04YEPR |
SN74LVC1GU04YZAR |
SN74LVC1GU04YEAR |
| Description |
Inverters SINGLE INVERTER GATE |
Inverters Single |
Inverters Single. |
| Is it Rohs certified? |
incompatible |
conform to |
incompatible |
| Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Parts packaging code |
BGA |
DSBGA |
DSBGA |
| package instruction |
VFBGA, BGA6,2X3,20 |
VFBGA, BGA5,2X3,20 |
VFBGA, BGA5,2X3,20 |
| Contacts |
5 |
5 |
5 |
| Reach Compliance Code |
not_compliant |
compliant |
not_compliant |
| series |
LVC/LCX/Z |
LVC/LCX/Z |
LVC/LCX/Z |
| JESD-30 code |
R-PBGA-B5 |
R-PBGA-B5 |
R-PBGA-B5 |
| length |
1.4 mm |
1.4 mm |
1.4 mm |
| Load capacitance (CL) |
50 pF |
50 pF |
50 pF |
| Logic integrated circuit type |
INVERTER |
INVERTER |
INVERTER |
| MaximumI(ol) |
0.024 A |
0.024 A |
0.024 A |
| Number of functions |
1 |
1 |
1 |
| Number of entries |
1 |
1 |
1 |
| Number of terminals |
5 |
5 |
5 |
| Maximum operating temperature |
85 °C |
85 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
VFBGA |
VFBGA |
VFBGA |
| Encapsulate equivalent code |
BGA6,2X3,20 |
BGA5,2X3,20 |
BGA5,2X3,20 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| method of packing |
TAPE AND REEL |
TAPE AND REEL |
TAPE AND REEL |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| power supply |
3.3 V |
3.3 V |
3.3 V |
| propagation delay (tpd) |
5 ns |
5 ns |
5 ns |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
| Schmitt trigger |
NO |
NO |
NO |
| Maximum seat height |
0.5 mm |
0.5 mm |
0.5 mm |
| Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
| Minimum supply voltage (Vsup) |
1.65 V |
1.65 V |
1.65 V |
| Nominal supply voltage (Vsup) |
1.8 V |
1.8 V |
1.8 V |
| surface mount |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
| Terminal form |
BALL |
BALL |
BALL |
| Terminal pitch |
0.5 mm |
0.5 mm |
0.5 mm |
| Terminal location |
BOTTOM |
BOTTOM |
BOTTOM |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
0.9 mm |
0.9 mm |
0.9 mm |