33C108RPFI-25 datasheet, PDF - EEWORLD Datasheet

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33C108RPFI-25: DescriptionStandard SRAM, 128KX8, 25ns, CMOS, RAD-PAK, DFP-32; Categorystorage storage; File Size244KB，14 Pages; ManufacturerMaxwell Technologies Inc.

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33C108RPFI-25 Overview

Standard SRAM, 128KX8, 25ns, CMOS, RAD-PAK, DFP-32

33C108RPFI-25 Parametric

Parameter Name	Attribute value
Parts packaging code	DFP
package instruction	DFP,
Contacts	32
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	25 ns
JESD-30 code	R-XDFP-F32
length	23.622 mm
memory density	1048576 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	128KX8
Package body material	UNSPECIFIED
encapsulated code	DFP
Package shape	RECTANGULAR
Package form	FLATPACK
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	3.937 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
width	16.383 mm
Base Number Matches	1

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33C108

1 Megabit (128K x 8-Bit) CMOS

SRAM

Memory

Functional Block Diagram

EATURES

• R

-P

® Technology radiation-hardened against natural

space radiation

• 128K x 8 bit organization

• Total dose hardness:

- > 100 krad (Si)

- dependent upon space mission

• Excellent Single Event Effects:

- SEL

: No LU > 68 MeV/mg/cm

- SEU

: < 3 MeV/mg/cm

• Package:

- 32-Pin R

-P

® flat pack

• Fast access time:

- 20, 25 and 30 ns maximum times available

• Single 5V + 10% power supply

• Fully static operation

- No clock or refresh required

• Three state outputs

• TTL compatible inputs and outputs

• Low power:

- Standby: 60mA (TTL) and 10mA (CMOS)

- Operation: 180mA (20ns), 170mA (25ns) and

160mA (30ns)

ESCRIPTION

Maxwell Technologies’ 33C108 high-density 1 Megabit SRAM

microcircuit features a greater than 100 krad (Si) total dose

tolerance. Using Maxwell’s radiation-hardened R

-P

packaging technology, the 33C108 realizes a higher density,

higher performance, and lower power consumption. Its fully

static design eliminates the need for external clocks, while the

CMOS circuitry reduces power consumption and provides

higher reliability. The 33C108 is equipped with eight common

input/output lines, chip select and output enable, allowing for

greater system flexibility and eliminating bus contention. The

33C108 features the same advanced 128K x 8 SRAM, high-

speed, and low-power demand as the commercial counter-

part.

Maxwell Technologies' patented R

-P

packaging technol-

ogy incorporates radiation shielding in the microcircuit pack-

age. It eliminates the need for box shielding while providing

the required radiation shielding for a lifetime in orbit or space

mission. In a GEO orbit, R

-P

provides greater than 100

krad (Si) radiation dose tolerance. This product is available

with screening up to Class S.

06.14.02 Rev 2

All data sheets are subject to change without notice

(619) 503-3300- Fax: (619) 503-3301 - www.maxwell.com

33C108RPFI-25 Related Products

	33C108RPFI-25	33C108RPFS-25	33C108RPFI-20	33C108RPFS-30	33C108RPFB-25	33C108RPFB-20	33C108RPFB-30	33C108RPFS-20	33C108RPFI-30
Description	Standard SRAM, 128KX8, 25ns, CMOS, RAD-PAK, DFP-32	Standard SRAM, 128KX8, 25ns, CMOS, RAD-PAK, DFP-32	Standard SRAM, 128KX8, 20ns, CMOS, RAD-PAK, DFP-32	Standard SRAM, 128KX8, 30ns, CMOS, RAD-PAK, DFP-32	Standard SRAM, 128KX8, 25ns, CMOS, RAD-PAK, DFP-32	Standard SRAM, 128KX8, 20ns, CMOS, RAD-PAK, DFP-32	Standard SRAM, 128KX8, 30ns, CMOS, RAD-PAK, DFP-32	Standard SRAM, 128KX8, 20ns, CMOS, RAD-PAK, DFP-32	Standard SRAM, 128KX8, 30ns, CMOS, RAD-PAK, DFP-32
Parts packaging code	DFP	DFP	DFP	DFP	DFP	DFP	DFP	DFP	DFP
package instruction	DFP,	DFP,	DFP,	DFP,	DFP,	DFP,	DFP,	DFP,	DFP,
Contacts	32	32	32	32	32	32	32	32	32
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Maximum access time	25 ns	25 ns	20 ns	30 ns	25 ns	20 ns	30 ns	20 ns	30 ns
JESD-30 code	R-XDFP-F32	R-XDFP-F32	R-XDFP-F32	R-XDFP-F32	R-XDFP-F32	R-XDFP-F32	R-XDFP-F32	R-XDFP-F32	R-XDFP-F32
length	23.622 mm	23.622 mm	23.622 mm	23.622 mm	23.622 mm	23.622 mm	23.622 mm	23.622 mm	23.622 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	8	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32	32	32	32
word count	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DFP	DFP	DFP	DFP	DFP	DFP	DFP	DFP	DFP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3.937 mm	3.937 mm	3.937 mm	3.937 mm	3.937 mm	3.937 mm	3.937 mm	3.937 mm	3.937 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	FLAT	FLAT	FLAT	FLAT	FLAT	FLAT	FLAT	FLAT	FLAT
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	16.383 mm	16.383 mm	16.383 mm	16.383 mm	16.383 mm	16.383 mm	16.383 mm	16.383 mm	16.383 mm
Base Number Matches	1	1	1	1	1	1	-	-	-
Maker	-	-	-	-	Maxwell Technologies Inc.	Maxwell Technologies Inc.	Maxwell Technologies Inc.	Maxwell Technologies Inc.	Maxwell Technologies Inc.

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