Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300°C
1. Do not apply voltages higher than V
DD
or less than GND
potential on any terminal except V
REF
and R
FB
.
2. The digital control inputs are Zener-protected; however,
permanent damage may occur on unprotected units from
high energy electrostatic fields. Keep units in conductive
foam at all times until ready to use.
3. Do not insert this device into powered sockets; remove
power before insertion or removal.
4. Use proper antistatic handling procedures.
5. Devices can suffer permanent damage and/or reliability deg-
radation if stressed above the limits listed under Absolute
Maximum Ratings for extended periods. This is a stress rat-
ing only and functional operation at or above this specifica-
tion is not implied.
ORDERING GUIDE
1
Model
DAC8248AW
2
DAC8248EW
DAC8248GP
DAC8248FW
DAC8248HP
DAC8248FP
DAC8248HS
3
Relative
Accuracy
(+5 V or +15 V)
±
1/2 LSB
±
1/2 LSB
±
1/2 LSB
±
1 LSB
±
1 LSB
±
1 LSB
±
1 LSB
Gain Error
(+5 V or +15 V)
±
1 LSB
±
1 LSB
±
2 LSB
±
4 LSB
±
4 LSB
±
4 LSB
±
4 LSB
Temperature
Range
–55°C to +125°C
–40°C to +85°C
0°C to +70°C
–40°C to +85°C
0°C to +70°C
–40°C to +85°C
0°C to +70°C
Package
Description
24-Pin Cerdip
24-Pin Cerdip
24-Pin Plastic DIP
24-Pin Cerdip
24-Pin Plastic DIP
24-Pin Plastic DIP
24-Pin SOL
NOTES
1
Burn-in is available on commercial and industrial temperature range parts in cerdip, plastic DIP, and TO-can packages.
2
For devices processed in total compliance to MIL-STD-883, add/883 after part number. Consult factory for 883 data sheet.
3
For availability and burn-in information on SO and PLCC packages, contact your local sales office.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the DAC8248 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
–4–
REV. B
DAC8248
DICE CHARACTERISTICS
11.
12.
13.
14.
15.
16.
17.
18.
19.
10.
11.
12.
AGND
I
OUTA
R
FB A
V
REF A
DGND
DB7(MSB)
DB6
DB5
DB4
DB3
DB2
NC
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
NC
DB1
DB0(LSB)
RESET
LSB/MSB
DAC A/DAC
B
LDAC
WR
V
DD
V
REF B
R
FB B
I
OUT B
SUBSTRATE (DIE BACKSIDE) IS INTERNALLY
CONNECTED TO V
DD
.
Die Size 0.124
×
0.132 inch, 16,368 sq. mils
(3.15
×
3.55 mm, 10.56 sq. mm)
WAFER TEST LIMITS
@ V
Parameter
Relative Accuracy
Differential Nonlinearity
Full-Scale Gain Error
1
Output Leakage
(I
OUT A
, I
OUT B
)
Input Resistance
(V
REF A
, V
REF B
)
V
REF A
, V
REF B
Input
Resistance Match
Digital Input High
Digital Input Low
Digital Input Current
Supply Current
DC Supply Rejection
(∆Gain/∆V
DD
)
DD
= +5 V or +15 V, V
REF A
= V
REF B
= +10 V, V
OUT A
= V
OUT B
= 0 V; AGND = DGND = 0 V; T
A
= 25 C.
Conditions
Endpoint Linearity Error
All Grades are Guaranteed Monotonic
Digital Inputs = 1111 1111 1111
Digital Inputs = 0000 0000 0000
Pads 2 and 24
Pads 4 and 22
DAC8248G
Limit
±
1
±
1
±
4
±
50
8/15
±
1
2.4
13.5
0.8
1.5
±
1
2
0.1
0.002
Units
LSB max
LSB max
LSB max
nA max
kΩ min/kΩ max
% max
V min
V min
V max
V max
µA
max
mA max
mA max
%/% max
Symbol
INL
DNL
G
FSE
I
LKG
R
REF
∆R
REF
R
REF
V
INH
V
INL
I
IN
I
DD
PSR
V
DD
= +5 V
V
DD
= +15 V
V
DD
= +5 V
V
DD
= +15 V
V
IN
= 0 V or V
DD
; V
INL
or V
INH
All Digital Inputs V
INL
or V
INH
All Digital Inputs 0 V or V
DD
∆V
DD
=
±
5%
NOTES
1
Measured using internal R
FB A
and R
FB B
.
Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed
for standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing.
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Embedded System
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