LM102202-Q-B-301-W datasheet, PDF

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LM102202-Q-B-301-W: DescriptionLimiter; CategoryWireless rf/communication Radio frequency and microwave; File Size477KB，10 Pages; ManufacturerCobham Semiconductor Solutions

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LM102202-Q-B-301-W Overview

Limiter

LM102202-Q-B-301-W Parametric

Parameter Name	Attribute value
Objectid	1217035413
Reach Compliance Code	unknown
RF/Microwave Device Types	LIMITER

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Surface Mount PIN Diode Limiter

LM102202-Q-x-301

Data Sheet

Features

•

Surface Mount Limiter in Compact Package:

•

8 mm L x 5 mm W x 2.5 mm H

Incorporates PIN Limiter Diodes, DC Blocks, Schottky Diode & DC Return

Wide Frequency Range (1 to 2 GHz)

Higher Average Power Handling than Plastic-Packaged Limiters (100 W CW )

Higher Peak Power Handling than Plastic-Packaged Limiters (1000 W CW)

Very Low Insertion Loss (0.35 dB) & Low Flat Leakage Power (17 dBm)

Ultra-Thin Au Termination Plating to Combat Embrittlement

RoHS Compliant

Receiver protection

Applications

Description

The LM102202-Q-x-301 Surface Mount Silicon PIN Diode Limiter is a surface mount, passive two-stage

power limiter which can operate over the frequency range of 1 to 2 GHz. It is manufactured using Aeroflex-

Metelics proven hybrid manufacturing process incorporating PIN Diodes and passive devices integrated

onto a ceramic substrate. This low profile, compact, (8 mm L x 5 mm W x 2.5 mm H) surface mount

component offers outstanding small and large signal performance. The package has a ultra-thin Au

termination plating to combat embrittlement. This product is designed for optimal small signal insertion loss

for very low receiver noise figure and excellent large-input-signal flat leakage power for effective receiver

protection from 1 to 2 GHz.

The very low thermal resistance (20 ºC/W, junction to bottom surface of package) of the PIN diodes in this

device and the presence of a Schottky detector bias current source enables it to reliably handle RF incident

power levels up to 50 dBm CW and RF peak incident power levels up to 60 dBm (25 µs pulse width, 5% duty

cycle) at T

CASE

= 85 ºC. The I layer thickness of the output stage and the design of the internal Schottky

detector current source combine to produce flat leakage of 17 dBm typical and spike leakage energy of 0.5

ergs, typical. No external control signals are required. This limiter module includes internal DC blocking

capacitors in the RF signal path, as well as an internal DC return path.

Environmental Capabilities

The LM102202-Q-x-301 limiter is compatible with high volume, surface mount, solder re-flow manufacturing

methods. This product is durable and capable of reliably operating in military, commercial, and industrial

environments The device is RoHS compliant and is available in tube or tape-reel. The LM102202-Q-x-301

limiter is capable of meeting the environmental requirements of MIL-STD-750 and MIL-STD-202.

ESD and Moisture Sensitivity Level Rating

As are all semiconductor devices, PIN diode limiters are susceptible to damage from ESD events. The ESD

rating for this device is Class 0 (HBM). The moisture sensitivity level rating for this device is MSL 1.

Document No. DS 13814 Rev.J, ECN 13784

Revision Date: 05/29/2014

PIN Diode Limiter

Criteria for Proper Mounting on PCB

When a large signal is incident upon the input of the LM102202-Q-x-301, the impedance of the coarse

limiter diodes is forced to a low value by the charge which is injected into these diodes by the combination

of the current from the internal detector stage and the large RF voltage initially present across these diodes.

As the impedance of these diodes decreases, an increasingly large impedance mismatch with the

impedance of the transmission line to which the limiter is connected is created. Ultimately, the impedance

of the coarse limiter diodes is reduced to a few ohms or less. This mismatch creates a standing wave, with

a current maximum and voltage minimum located at the position of the coarse limiter diodes. While the large

majority of the input signal power is reflected back to its source due to the impedance mismatch, the

significant RF current that flows at the current maximum causes Joule heating to occur in the coarse limiter

diodes. In order to maintain the junction temperature of these diodes below their maximum rated value,

there must be a path with minimal thermal resistance from the coarse diodes to the external system heat

sink. Also, there must be a minimal electrical resistance and inductance between the underside of the

limiter module package and the system ground in order to achieve maximum RF isolation between the input

and the output of the limiter module.

For these reasons, it is imperative that there are no voids in the electrical and thermal paths directly under

the coarse limiter diodes. Care must be taken when mounting the LM102202-Q-x-301 to avoid voids in the

solder joint in the area along the lengthwise axis of the package, under and between the filled vias in the

AlN substrate of the module which are shown in the diagram (above). It is also important to ensure no solder

voids exist between the limiter module RF ports and the PCB to which the limiter module is attached.

No greater than 50% of the remaining metalized area on the bottom of the package may contain solder

voids.

603-641-3800 • 888-641-SEMI (7364) • metelics-sales@aeroflex.com • www.aeroflex.com/metelics

Document No. DS 13814 Rev.J, ECN 13784

Revision Date: 05/29/2014

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