Cal-Chip
Electronics, Incorporated
TC S
ERIES
TC Series Tantalum Solid Electrolytic Capacitors -
Resin Molded Chip Type, Standard Type
TC S
ERIES
:
The TC Series is designed for hybrid circuit
and low profile printed circuit board applications where
inductance is to be minimized, or where substrate space is
at a premium. They can be attached to substrates or circuit
boards by dipsoldering, welding, re-flow soldering or other
conventional methods. These units have the further advan-
tage of being compatible with automatic assembly equip-
ment-minus the problems associated with flexible terminal
lead wires. Our chip tantalums meet all EIA sizes.
R
ATINGS
Capacitance Range:
Tolerance Range:
Rated Voltage:
0.1µF to 220µF
M(±20%), K(±10%)
4V to 50V
I
TEMS
Operating Temperature Range
Maximum Working Temperature
Rated Voltage Range
Capacitance Range
Standard Capacitance Tolerance
Dissipation factor (tan
δ)
Leakage Current
Temperature
Stability
-55°C
+125°C
Temp.
S
PECIFICATIONS
, P
ERFORMANCE
-55°C~+85°C(+125°C)
+85°C (+125°C with derating)
4 VDC ~ 50 VCD
0.1µF ~ 220µF
±20% (M) ±10%(K)
0.1~1.0µF
1.5~100µF
4.0%
6.0%
T
EST
C
ONDITIONS
See Table of Standard Ratings
JIS-C-5102 20°C 120Hz
JIS-C-5102 20°C 120Hz
JIS-C-5102 20°C (5 minutes)
(after rated voltage applied)
Max. Leakage Current
NA
0.125CV or 6.25µA
whichever is greater
Procedure:
1. 20±2°C
2. -55+0 °C Stabilized
-3
3. 20±2°C 15 min.
4. +125+3 °C 2 hrs.
-0
JIS-C-5140 and 5102 85°C
Not more than 0.01CV or
0.5µA, whichever is greater
∆
C
Max
±12%
Max.
±15%
Max. tan
δ
0.1 ~ 1.0µF 6.0%
1.5 ~ 100µF 8.0%
0.1 ~ 1.0µF 6.0%
1.5 ~ 100µF 8.0%
Less than ±5%
Less than
specified value
Surge Voltage
Solder Heat Resistance
Humidity Test
Capacitance Change
Dissipation Factor
Leakage Current
Surge voltage applied, 1000 times with series
resistance of 1000Ω for 30 seconds at intermittent
intervals of 5 minutes
Withstand solder immersion 5 seconds at
260°C or reflow 10 seconds at 260°C
High Temperature Test
Failure Rate at 85°C
Capacitance Change
Dissipation Factor
Leakage Current
Capacitance Change
Dissipation Factor
Leakage Current
Less than ±5%
Less than initial
specified value
Less than ±10%
Less than initial
specified value
JIS-C-5102
at 60°C humidity 90% ~ 95% RH,
500 Hours
JIS-C-5102
85°C, Rated voltage 2000 hours or 125°C
Derating voltage 1000 hours with circuit
resistance of 1Ω/V
1% per 1,000 hours
MTBF 5 X 10
4
Hr.
31
Cal-Chip
Electronics, Incorporated
TC S
ERIES
TC Series Tantalum Solid Electrolytic Capacitors -
Resin Molded Chip Type, Standard Type
Ordering Information & Marking
Ordering Information Example: 1 MFD 16 volt 20%
TC
Series Destination
Capacitance Tolerance
Rated Voltage
Capacitance
M
IC
105
A
T
Size
Taping & Packaging
Capacitance Tolerance
Code
±20%
M
±10%
K
Rated Voltage
Code
2
OD
4
OG
6.3
OJ
10
IA
16
IC
20
ID
25
IE
35
IV
50
IX
Capacitance (ex)
Code
0.1 ~ 0.68µF
104 ~ 684
1.0 ~ 6.8µF
105 ~ 685
10 ~
470µF
106 ~
477
R: Decimal Point - First two digits represent significant figures and the third digit specifies number of zeros
to follow. Capacitance unit is µF.
M
ARKING
A - Size
ex) 6.3V-2.2µF
F
REQUENCY
C
HARACTERISTIC
C
URVES
(TC S
ERIES
)
Capacitance: First two digits represent capacitance and the third digit speci-
fies number of zeros to follow.
ex) 10V-22µF
Capacitance unit is µF.
B, C, D - Size
Note:
See back cover for low ESR information
32
Cal-Chip
S
TANDARD
R
ATINGS
Electronics, Incorporated
C
ASE
S
IZE
D
ISTRIBUTION
*
4
5.2
2.7
3.4
STD/EXT
6.3
8
4
5
STD/EXT
10
13
7
9
STD/EXT
16
20
10
12
STD/EXT
20
26
13
16
STD/EXT
25
32
17
22
STD/EXT
TC S
ERIES
TC Series Tantalum Solid Electrolytic Capacitors -
Resin Molded Chip Type, Standard Type
AND
Rated Voltage @ +85°C
Surge Voltage @ +85°C
Derated Voltage @ 125°C
Derated Surge Voltage @ +125°C
Capacitance µF
0.1
0.15
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
6.8
10
15
22
33
47
68
100
150
220
35
46
23
28
STD/EXT
A
A
A
A
B/A
B/A
B/A
C/B
C/B
C
D/C
D/
D
D/E
/E
50
65
33
40
STD/EXT
A
B/A
B
B
C/B
C
C
/C
D/C
D/
D
D/E
A
A
A
A
B/A
B/A
C/B
C/B
C/B
D/C
D/
D/
E
A
A
A
/A
B/A
B/A
A/C/B
A/C/B
B/C
D/C/B
D/
D/C
D/E
D/E
A
A
A
/A
B/A
B/A
C/B/A
D/C/B
D/C/B
D/C/B
D/C
/D
E/D
D/E
D/E
A
A
A
A
B/A
B/A
C/B/A
C/B
C/B
C/B
D/C/B
D/C/B
/D
E/D
E/D
A
A
A
/A
B/A
C/B
C/B
C/B
D/C/B
D/C
D/C
/D
D/E
/E
A
A
A
B/A
B/A
C/B
C/B
C/B
D/C
D/C
D/C
D/C
E/D
E
*Letter code after / indicates new extended range. Please indicate size code on ordering.
N
OTES
1. Be sure polarity. Positive (+) side has white belt.
2. For cleaning, freon
®
TE, TES and TMS are recommended at a temperature less than 50°C for a period less than 5 minutes.
3. When ultrasonic cleaning is necessary, fixing capacitor body by epoxy adhesive before soldering is recommended.
Establish adequate cleaning conditions by experiment to avoid damaging capacitor terminations.
4. Limit reverse voltage to 1.0V or less than 5% of rated voltage whichever is smaller.
5. In case of low impedance circuit use (Less than 3
Ω/V),
adequate voltage derating is recommended to improve M.T.B.F.
6. In case of automatic mounting, the tweezer pressure shall be less than 500 grams and should not exceed 5 seconds.
33
Cal-Chip
VW (VC)
CAP (µF)
Electronics, Incorporated
TC S
ERIES
TC Series Tantalum Solid Electrolytic Capacitors -
Resin Molded Chip Type, Standard Type
MAX ESR (Ω) @ 100kHz, +25°C / BY VALUE AND CASE SIZE
MAX RIPPLE CURRENT (Arms) @ 100kHz, +25°C / BY VALUE AND CASE SIZE
4.0
6.3
10
16
20
25
35
A 24.0
A 21.0
A 18.0
A 15.0
50
A 22.0
A 20.0
B 17.0
B 14.0
B 12.0
B 10.0
C 8.0
C 7.5
C 5.5
C 4.0
C 3.5
D 2.5
D 2.0
D 1.4
E 1.2
VW (VC)
CAP (µF)
4.0
6.3
10
16
20
25
35
A0.054
A0.058
A0.062
50
A0.056
A0.059
B0.069
B0.076
0.1
0.15
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
6.8
10
15
22
33
47
68
100
150
220
A 9.0
A 7.5
A 6.5
A 6.0
B 4.0
B 3.5
B 3.2
C 2.5
B 2.4
C 2.2
C 1.8
C 1.6
D 1.1
D 0.9
D 0.7
E 0.6
A 9.0
A 7.5
A 6.5
A 6.0
B 4.0
B 3.5
B 3.2
C 2.5
B 2.4
C 2.2
B 2.0
C 1.8
C 1.6
D 1.1
D 0.9
D 0.8
D 0.6
E 0.6
D 0.7
E 0.6
A 10.0
A 7.5
A 6.5
A 6.0
B 4.0
B 3.5
B 3.2
C 2.5
B 2.4
C 2.2
B 2.5
C 1.8
C 1.6
D 1.1
C 1.6
D 0.9
D 0.8
D 0.7
E 0.7
D 0.8
E 0.6
D0.9
E 0.6
A 11.0
A 8.0
A 7.0
B 5.5
A 6.2
B 4.4
B 3.6
B 3.3
C 2.6
B 2.4
C 2.2
C 1.8
B 2.3
C 1.6
D 1.1
0.1
0.15
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
6.8
10
15
22
33
47
68
100
150
220
A0.088
A0.097
A0.104
A0.108
B0.141
B0.151
B0.158
C0.210
B0.183
C0.224
C0.247
C0.262
D0.369
D0.408
A0.088
A0.097
A0.104
A0.108
B0.141
B0.151
B0.158
C0.210
B0.183
C0.224
BO.208
C0.247
C0.262
D0.369
D0.408
D0.8
A0.084
A0.097
A0.104
A0.108
B0.141
B0.151
A0.080
A0.094
B0.100
B0.121
A0.106
B0.135
B0.149
A0.076
A0.084
A0.097
B0.126
B0.145
B0.151
C0.198
C0.214
A 14.0
A 12.0
A 10.0
A 7.5
B 5.0
B 3.8
B 3.5
C 2.8
C 2.4
C 2.0
D 1.3
C 1.7
D 1.1
C 1.5
D 0.9
D 0.8
D 0.7
E 0.9
E 0.6
A 10.0
A 9.0
B 7.0
B 5.5
B 4.5
B 3.6
C 2.8
C 2.4
C 2.0
D 1.4
C 1.8
D 1.2
D 1.0
D 0.8
E 0.7
E 0.9
A 12.0
B 10.0
A 9.0
B 8.0
B 6.5
B 5.2
C 4.5
C 3.5
C 2.5
C 2.2
D 1.5
D 1.3
D 1.0
E 0.8
E 0.7
C 1.2
D 0.9
D 0.8
D 0.7
E 0.8
D 0.7
E 0.7
D0.463 DO.486
E0.524
E0.524 E0.524
D0.486
B0.156
C 0.206
B0.158 B 0.183 C0.235
C0.210 C 0.224 D0.340
B0.183 C0.247 C0.254
C0.224
D0.369
B0.35
BO.208
C0.262
CO.277 D0.433
C0.247
D0.369
D0.408
C0.262 CO.277 D0.433 E0.486
D0.369 D0.408
CO.277 D0.433 D0.486 EO.524
D0.408
EO.454
D0.433 D0.463 E0.486
E0.454
D0.462 DO.463
E0.486 E0.486
DO.524
E0.524
E0.524
D0.524
A 0.068 B0.076
B0.082
A0.071 A0.076 B0.089
B0.089 C0.117
A0.084 A0.088 C0.121
B0.100
A0.088 B0.111 C0.141
B0.107
B0.121 B0.124 C0.166
C0.156
C0.177
B0.133
C0.177 D0.249
B0.149 C0.210 D0.274
C0.198
C0.214 C0.224 D0.327
D 0.316
C0.235 D0.340 E0.371
D0.327
C 0.247 D0.387
D0.354
D0.387 E0.454
E0.486
Dimensions in mm
EIA
Case Code
A(3216)
B(3528)
C(6032)
D(7343
E(7343H)
L
±0.2
3.2
3.5
6.0
7.3
7.3
W
±0.2
1.6
2.8
3.2
4.3
4.3
H
±0.2
1.7
1.9
2.5
2.9
4.0
P
±0.3
0.8
0.8
1.3
1.3
1.3
a
±0.2
1.2
2.2
2.2
2.4
2.4
h(min)
0.7
0.7
1.0
1.0
1.0
34
Cal-Chip
Electronics, Incorporated
TC S
ERIES
Frequency Dependence of the
Permissible Superimposed
AC Voltage
TC Series Tantalum Solid Electrolytic Capacitors -
Resin Molded Chip Type, Standard Type
C
HARACTERISTIC
D
ATA
& C
URVES
Effect of Circuit Impedance
on the Failure Rate
L
OAD
L
IFE
C
HARACTERISTIC
C
URVES
(TC S
ERIES
)
Effect of the Applied Voltage
and Ambient Temperature on
the Failure Rate
T
EMPERATURE
C
HARACTERISTIC
C
URVES
(TC S
ERIES
)
Immersion Method
Reflow Method
35
Microcontroller MCU
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