EMK33
Series
•
Utilizes a MEMS Silicon Resonator
•
RoHS Compliant (Pb-Free)
•
2.5mm x 3.2mm Surface Mount Package
•
LVHCMOS Output
•
3.3V Supply Voltage
•
Stability to ±50ppm
• 30,000 G Shock Resistance
•
Available on Tape & Reel
•
Tri-State and Power Down Options
H
L
W
EMK33
0.85
3.2
2.5
OSCILLATOR
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Operating Temperature Range
Storage Temperature Range
Supply Voltage (V
DD
)
Input Current
Frequency Tolerance / Stability
1.000MHz to 125MHz
-40°C to 85°C
-55°C to 125°C
3.3V
DC
±10%
20mA Maximum
25mA Maximum
±50ppm or ±100ppm Maximum
Output Voltage Logic High (V
OH
)
Output Voltage Logic Low (V
OL
)
Rise Time / Fall Time
Duty Cycle
Load Drive Capability
Output Control Function
Output Control Input Voltage
< 25.000MHz
> 25.000MHz
Inclusive of All Conditions: Calibration Tolerance at 25°C ,
Frequency Stability over the Operating Temperature Range,
Supply Voltage Change, Output Load Change, 1st Year
Aging at 25°C, 260°C Reflow, Shock, and Vibration
I
OH
= -8mA
I
OL
= +8mA
20% to 80% of waveform
at 50% of waveform
V
IH
of 70% of V
DD
Minimum or No Connection
V
IL
of 30% of V
DD
Maximum
Standby Current
Peak to Peak Jitter (tPK)
Aging
Start Up Time
MANUFACTURER
CATEGORY
1.000MHz to 12.287999MHz
12.288MHz to 125.000MHz
First Year at 25°C
90% of V
DD
Minimum
10% of V
DD
Maximum
2nSeconds Maximum
50 ±5(%)
15pF HCMOS Load Maximum
Tri-State or Power Down
Enables Output
Disables Output: High Impedance State
for Tri-state, Logic Low for Power Down
50µA Maximum
500pSec Maximum, 200pSec Typical
250pSec Maximum, 100pSec Typical
±1ppm Maximum
50mSec Maximum
CLASS
REV
.
DATE
SERIES
PACKAGE
VOLTAGE
ECLIPTEK CORP.
OSCILLATOR
EMK33
PLASTIC
3.3V
OS5K
11/07
800-ECLIPTEK www.ecliptek.com for latest revision
Specifications subject to change without notice.
PART NUMBERING GUIDE
EMK33 H 2 H - 50.000M TR
FREQUENCY TOLERANCE & STABILITY/
OPERATING TEMPERATURE RANGE
G=±100ppm Maximum over -40°C to +85°C
H=±50ppm Maximum over -40°C to +85°C
DUTY CYCLE
2=50% ±5%
LOGIC CONTROL
H=Tri-State (High Impedance)
J=Power Down (Logic Low)
AVAILABLE OPTIONS
Blank=Bulk
TR=Tape and Reel (Standard)
FREQUENCY
MECHANICAL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
SUGGESTED SOLDER PAD LAYOUT
ALL DIMENSIONS IN MILLIMETERS
2.50
±0.15
0.85
±0.15
0.08
MAX
2
2.10
±0.10
1
0.80 ±0.10 (x4)
3
R0.45
±0.10
0.90
±0.10
(x4)
1.20
(x4)
3.20
±0.15
0.80
1.40
(x4)
R0.35
±0.10
0.90 ±0.15
0.20 ±0.10
*Solder connection to the bottom pads of the package only.
4
0.50
TAPE AND REEL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
Pin 1: Tri-State or Power Down Pin 3: Output
Pin 4: Supply Voltage
Pin 2: Case Ground
Tolerances= +0.1
PLASTIC
A
12.0 ±0.3
B
G
A0*
C
H
J
B0*
D
4.0 ±0.1
E
2.0 ±0.1
F
REEL
M
1.5 MIN
N
50 MIN
O
U
180 MAX
P
V
12.4 +2/-0
Q
40 MIN
QTY/REEL
1,000
5.5 ±0.05 4.75 ±.05
1.5 +.1/-0
20.2 MIN 13.0 ±0.2
F
4.0 ±0.2
K
0.3 ±0.05
L
K0*
R
2.5 MIN
S
10 MIN
T
18.4 MAX
*Compliant to EIA 481C
ENVIRONMENTAL/MECHANICAL SPECIFICATIONS
Characteristic
ESD Susceptibility
Flammability
Mechanical Shock
Moisture Resistance
Moisture Sensitivity Level
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Thermal Shock
Vibration
Specification
MIL-STD-883, Method 3015, Class 2, HBM: 2000V
UL94-V0
MIL-STD-883, Method 2002, Condition G, 30,000G
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003 (Four I/O Pads on
bottom of package only)
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 1011, Condition B
MIL-STD-883, Method 2007, Condition A, 20G
MARKING SPECIFICATIONS
Line 1: XXXX
Ecliptek Manufacturing Lot Code
MANUFACTURER
CATEGORY
SERIES
PACKAGE
VOLTAGE
CLASS
REV
.
DATE
ECLIPTEK CORP.
OSCILLATOR
EMK33
PLASTIC
3.3V
OS5K
11/07
800-ECLIPTEK www.ecliptek.com for latest revision
Specifications subject to change without notice.
MCU
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