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SMC1503010FLF13

Description
Fixed Resistor, Metal Glaze/thick Film, 1W, 301ohm, 350V, 1% +/-Tol, 50ppm/Cel, Surface Mount, 2512, CHIP, ROHS COMPLIANT
CategoryPassive components    The resistor   
File Size275KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Environmental Compliance
Download Datasheet Parametric View All

SMC1503010FLF13 Overview

Fixed Resistor, Metal Glaze/thick Film, 1W, 301ohm, 350V, 1% +/-Tol, 50ppm/Cel, Surface Mount, 2512, CHIP, ROHS COMPLIANT

SMC1503010FLF13 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid1726611990
package instructionCHIP, ROHS COMPLIANT
Reach Compliance Codecompliant
ECCN codeEAR99
JESD-609 codee3
Installation featuresSURFACE MOUNT
Number of terminals2
Package shapeRECTANGULAR PACKAGE
method of packingTR, 13 INCH
Rated power dissipation(P)1 W
Rated temperature70 °C
resistance301 Ω
Resistor typeFIXED RESISTOR
size code2512
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient50 ppm/°C
Terminal surfaceMatte Tin (Sn)
Terminal shapeWRAPAROUND
Tolerance1%
Operating Voltage350 V
SMC SERIES
METAL GLAZETM GENERAL PURPOSE
SURFACE MOUNT, COMPLIANT TERMINAL
·
Capped terminals provide mechanical compliance – relief from
·
board vs component TCE mismatch
Applications – Ideal for automotive and other
harsh thermal applications
Uncompromising MetalGlazeTM performance gives
excellent surge performance
Lead-free, RoHS compliant
Use standard IRC 2512, 3610 solder pads
·
·
·
SMC SPECIFICATIONS:
Size
Code
F
H
Industry
Footprint
2512
3610
IRC
Type
SMC-1
SMC-2
Maximum
Power Rating
1W @ 70°C
2W @ 70°C
Working
Voltage
350
500
Maximum
Voltage
650
1000
Resistance
Range (Ω)
0.1 to 0.99
1.0 to 2.0M
20 to 348K
0.1 to 0.99
1 to 2.0M
Tolerance
(±%)
1,2,5
1,2,5
0.5,1,2,5
1,2,5
1,2,5
TCR
(ppm/°C)
100
50,100
50, 100
100
50,100
Product
Category
Low range
Standard
Tight Tolerance
Low Range
Standard
SMC PERFORMANCE CHARACTERISTICS
Characteristics
Temperature Coefficient
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding
Solderability
Moisture Resistance
Life Test
Terminal Adhesion Strength
Resistance to Board Bending
Maximum Change
As specified
±0.5% +0.01 ohm
±0.25% +0.01 ohm
Test Method
MIL-PRF-55342E Par 4.7.9 (-55°C +125°C)
MIL-PRF-55342E Par 4.7.3 (-65°C +150°C, 5 cycles)
MIL-PRF-55342E Par 4.7.4 (-65°C @ working voltage)
±0.25%+0.01ohm(R</-100K Ohm
±1%+0.01ohm(R</-100K Ohm MIL-PRF-55342E Par 4.7.5 (2.5 x SQRT (PXR) FOR 5 seconds)
+0.5 +0.01 ohm
MIL-PRF-55342E Par 4.7.6 (+150°C for 100 hours)
±0.25% 0.01 ohm
MIL-PRF-55342E Par 4.7.7
(Reflow soldered to board at 260°C for 10 seconds)
MIL-STD-202, Method 208 (245°C for 5 seconds)
95% minimum coverage
±0.5% +0.01 ohm
±0.5% +0.01 ohm
±1% +0.01 ohm
no mechanical damage
±1% + 0.01 ohm
no mechanical damage
MIL-PRF-55342E Par 4.7.8 (10 cycles, total 240 hours)
MIL-PRF-55342E Par 4.7.10 (2000 hour at 70°C intermittent)
1200 gram push from underside of mounted chip for 60 seconds
Chip mounted in center of 90mm long board, deflected 5mm so as to
exert pull on chip contacts for 10 seconds
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
A subsidiary of
TT electronics plc
WIREWOUND AND FILM TECHNOLOGIES DIVISION
736 Greenway Road
Boone, North Carolina 28607-1860
Tel: 828-264-8861
Fax: 828-264-8866
www.irctt.com
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