PIC16C710/711
PIC16C71
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PIC16C710/711 Data Sheet Errata
The PIC16C710/711 parts you have received conform
functionally to the Device Data Sheet (DS40032B),
except for the anomalies described below.
None.
2003 Microchip Technology Inc.
DS80154A-page 1
PIC16C710/711
Clarifications/Corrections to the Data
Sheet:
1.
Module: Packaging
The package information contained in the data
sheet is incorrect. Please refer to the following
tables for correct package data.
18-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
A1
B1
c
β
eB
Units
Dimension Limits
n
p
B
p
MIN
Number of Pins
Pitch
Top to Seating Plane
A
.140
.170
Molded Package Thickness
A2
.115
.145
Base to Seating Plane
A1
.015
Shoulder to Shoulder Width
E
.300
.313
.325
Molded Package Width
E1
.240
.250
.260
Overall Length
D
.890
.898
.905
Tip to Seating Plane
L
.125
.130
.135
c
Lead Thickness
.008
.012
.015
Upper Lead Width
B1
.045
.058
.070
Lower Lead Width
B
.014
.018
.022
eB
Overall Row Spacing
§
.310
.370
.430
α
Mold Draft Angle Top
5
10
15
β
Mold Draft Angle Bottom
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-007
INCHES*
NOM
18
.100
.155
.130
MAX
MIN
MILLIMETERS
NOM
18
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
22.61
22.80
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MAX
4.32
3.68
8.26
6.60
22.99
3.43
0.38
1.78
0.56
10.92
15
15
DS80154A-page 2
2003 Microchip Technology Inc.
PIC16C710/711
18-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC)
E
p
E1
D
2
B
n
1
h
α
45°
c
A
A2
β
φ
L
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Units
Dimension Limits
n
p
A
A2
A1
E
E1
D
h
L
φ
c
B
α
β
MIN
.093
.088
.004
.394
.291
.446
.010
.016
0
.009
.014
0
0
INCHES*
NOM
18
.050
.099
.091
.008
.407
.295
.454
.020
.033
4
.011
.017
12
12
MAX
MIN
.104
.094
.012
.420
.299
.462
.029
.050
8
.012
.020
15
15
MILLIMETERS
NOM
18
1.27
2.36
2.50
2.24
2.31
0.10
0.20
10.01
10.34
7.39
7.49
11.33
11.53
0.25
0.50
0.41
0.84
0
4
0.23
0.27
0.36
0.42
0
12
0
12
MAX
2.64
2.39
0.30
10.67
7.59
11.73
0.74
1.27
8
0.30
0.51
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-051
2003 Microchip Technology Inc.
DS80154A-page 3
PIC16C710/711
18-Lead Ceramic Dual In-line with Window (JW) – 300 mil (CERDIP)
E1
W2
D
2
n
W1
E
1
A
c
eB
A1
B1
B
Units
Dimension Limits
n
p
A
A2
A1
E
E1
D
L
c
B1
B
eB
W1
W2
INCHES*
NOM
18
.100
.183
.160
.023
.313
.290
.900
.138
.010
.055
.019
.385
.140
.200
p
A2
L
MIN
MAX
MIN
Number of Pins
Pitch
Top to Seating Plane
Ceramic Package Height
Standoff
Shoulder to Shoulder Width
Ceramic Pkg. Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
§
Window Width
Window Length
* Controlling Parameter
§ Significant Characteristic
JEDEC Equivalent: MO-036
Drawing No. C04-010
.170
.155
.015
.300
.285
.880
.125
.008
.050
.016
.345
.130
.190
.195
.165
.030
.325
.295
.920
.150
.012
.060
.021
.425
.150
.210
MILLIMETERS
NOM
18
2.54
4.32
4.64
3.94
4.06
0.38
0.57
7.62
7.94
7.24
7.37
22.35
22.86
3.18
3.49
0.20
0.25
1.27
1.40
0.41
0.47
8.76
9.78
3.30
3.56
4.83
5.08
MAX
4.95
4.19
0.76
8.26
7.49
23.37
3.81
0.30
1.52
0.53
10.80
3.81
5.33
DS80154A-page 4
2003 Microchip Technology Inc.
PIC16C710/711
APPENDIX A:
REVISION HISTORY
Rev. A Document (3/2003)
Under Clarifications/Corrections to the Data Sheet,
Item 1, Packaging: correct package data was added.
2003 Microchip Technology Inc.
DS80154A-page 5
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