EEWORLDEEWORLDEEWORLD

Part Number

Search

D55342K07W21E5P-W

Description
Fixed Resistor, Metal Glaze/thick Film, 0.25W, 21500ohm, 100V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1206, CHIP
CategoryPassive components    The resistor   
File Size100KB,1 Pages
ManufacturerState of the Art Inc.
Environmental Compliance  
Download Datasheet Parametric View All

D55342K07W21E5P-W Overview

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 21500ohm, 100V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1206, CHIP

D55342K07W21E5P-W Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Objectid1871976198
package instructionCHIP
Reach Compliance Codecompliant
Country Of OriginUSA
ECCN codeEAR99
YTEOL7.85
structureChip
JESD-609 codee4
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package height0.46 mm
Package length3.2 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width1.55 mm
method of packingWAFFLE PACK
Rated power dissipation(P)0.25 W
Rated temperature70 °C
GuidelineMIL-PRF-55342
resistance21500 Ω
Resistor typeFIXED RESISTOR
size code1206
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceGold (Au)
Terminal shapeWRAPAROUND
Tolerance1%
Operating Voltage100 V
State of the Art, Inc.
Thick Film Chip Resistor
D55342/07 RM1206
GLASS
PASSIVATION
WRAPAROUND
TERMINATIONS
RESISTOR
FILM
96% ALUMINA CHIP
PERFORMANCE
TEMPERATURE RISE (°C)
Resistance Range
Tolerances
Maximum Power
Maximum Voltage
1
W
- 22M
W
1%, 2%, 5%, 10%
250 mW
100 Volts
CHARACTERISTICS*
M
K
±100
±0.5%
±0.25%
±0.25%
±0.25%
±0.5%
±0.5%
±0.5%
±300
±0.5%
±0.5%
±0.5%
±0.25%
±0.5%
±2.0%
±1.0%
CURRENT NOISE
POWER DISSIPATION
fiber epoxy board
ceramic board
TESTS
TCR (-55 to +125
°
C) in ppm/
°
C
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Soldering Heat
Moisture Resistance
Life, 2,000 Hours
High Temperature Exposure
POWER DISSIPATION (WATTS)
LIFE TEST
POWER DERATING
*Maximum allowable change per MIL-PRF-55342,
typical change is 10% of these values.
PART NUMBERING
D55342 K 07 B 100D S - TR
PACKAGING CODE: TR = Tape & Reel W= Waffle Pack
PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% S: 0.001% T: Space Level C: Non - ER
RESISTANCE AND TOLERANCE CODE:
Three significant digits, with a letter indicating the
decimal location, the tolerance, and the value range.
D: 1%
W
E: 1% K
W
F: 1% M
W
G: 2%
W
H: 2% K
W
T: 2% M
W
J: 5%
W
K: 5% K
W
L: 5% M
W
M: 10%
W
N: 10% K
W
P: 10% M
W
TERMINATION MATERIALS:
B: Solderable wraparound C: Epoxy bondable palladium/silver wraparound U: Epoxy bondable platinum/gold wraparound
W: Gold wire bondable
G: Gold wraparound
SIZE CODE: /07* = RM1206
TEMPERATURE CHARACTERISTIC: K: ± 100ppm M: ± 300ppm
PERFORMANCE SPECIFICATION MIL-PRF-55342
*RM1206 is specified in MIL-PRF-55342 as D55342 /07 rather than M55342 /07.
MECHANICAL
INCHES
MILLIMETERS
.156
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
.126 (.118 - .134)
.061 (.058 - .068)
.018 (.015 - .033)
.016 (.010 - .025)
.018 (.010 - .025)
.090 (.086 - .094)
.0084 grams
3.20
1.55
0.46
0.41
0.46
2.29
(3.00 - 3.40)
(1.47 - 1.73)
(0.38 - 0.84)
(0.25 - 0.64)
(0.25 - 0.64)
(2.18 - 2.39)
.067
.084
.036
State of the Art, Inc.
2470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401
“Specifications subject to change without notice.”
www.resistor.com
04/09/08
tffs problem.
I want to create a TFFS file system on FLASH. The size of FLASH is 16M. The first 7M is free to put bootrom.bin, and the last 9M is used to create TFFS. The base address of FLASH is FE000000, and the ...
t63056 Embedded System
【Contribute to C2000】Introduction to TI's real-time operating system DSP BIOS
Introduction to TI's real-time operating system DSP BIOS Some value There is also a video, but it is too large to upload....
vvv9876 Microcontroller MCU
TFDU4300 reception problem?
[color=rgb(0, 0, 0)][font=Verdana, Arial, Helvetica, sans-serif][size=12px] Hello everyone, I would like to ask if the seniors have used the TFDU4300 component. I used the following link On the ninth ...
kenny0531 Integrated technical exchanges
Fake news and exaggerated hype are hurting China's IC industry. Silence is not the solution (Reprinted)
Author: Pan Jiutang Recently, I participated in the warm-up and promotion activities of the "2006 International Mobile Phone Industry Exhibition and Forum" to be held in Tianjin from May 18th to 20th....
1234 FPGA/CPLD
PIC microcontroller serial port basics (I)
Off topic: I just wrote a software serial port debugging notes, and there is a problem that I want to raise. The program for multi-machine communication has problems. The problem is that in multi-mach...
jamieyang Microchip MCU
The journey of becoming an MCU engineer: entering the workplace
[align=left]It can be said that going from campus to the workplace and starting a life path of your own requires a transformation. For most people, this is often a difficult or even painful baptism. S...
chunyang Talking about work

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1075  1424  280  1327  1659  22  29  6  27  34 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号