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PCF8574AT

Description
8 I/O, PIA-GENERAL PURPOSE, PDSO16
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size122KB,24 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Download Datasheet Parametric Compare View All

PCF8574AT Overview

8 I/O, PIA-GENERAL PURPOSE, PDSO16

PCF8574AT Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionSOP, SOP16,.4
Reach Compliance Code_compli
JESD-30 codeR-PDSO-G16
JESD-609 codee0
Humidity sensitivity level1
Number of digits8
Number of terminals16
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP16,.4
Package shapeRECTANGULAR
Package formSMALL OUTLINE
power supply3/5 V
Certification statusNot Qualified
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
INTEGRATED CIRCUITS
DATA SHEET
PCF8574
Remote 8-bit I/O expander for
I
2
C-bus
Product specification
Supersedes data of September 1994
File under Integrated Circuits, IC12
1997 Apr 02

PCF8574AT Related Products

PCF8574AT PCF8574AP PCF8574
Description 8 I/O, PIA-GENERAL PURPOSE, PDSO16 8 I/O, PIA-GENERAL PURPOSE, PDSO20 8 I/O, PIA-GENERAL PURPOSE, PDSO20
Number of terminals 16 16 20
Maximum operating temperature 85 °C 85 °C 85 Cel
Minimum operating temperature -40 °C -40 °C -40 Cel
surface mount YES NO Yes
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING THROUGH-HOLE GULL WING
Terminal location DUAL DUAL pair
Is it Rohs certified? incompatible conform to -
Maker Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) -
package instruction SOP, SOP16,.4 DIP, DIP16,.3 -
Reach Compliance Code _compli unknow -
JESD-30 code R-PDSO-G16 R-PDIP-T16 -
JESD-609 code e0 e4 -
Number of digits 8 8 -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code SOP DIP -
Encapsulate equivalent code SOP16,.4 DIP16,.3 -
Package shape RECTANGULAR RECTANGULAR -
Package form SMALL OUTLINE IN-LINE -
power supply 3/5 V 3/5 V -
Certification status Not Qualified Not Qualified -
technology CMOS CMOS -
Terminal surface Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au) -
Terminal pitch 1.27 mm 2.54 mm -
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