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PCF8574

Description
8 I/O, PIA-GENERAL PURPOSE, PDSO20
Categorysemiconductor    The embedded processor and controller   
File Size122KB,24 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Download Datasheet Parametric Compare View All

PCF8574 Overview

8 I/O, PIA-GENERAL PURPOSE, PDSO20

PCF8574 Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals20
Maximum operating temperature85 Cel
Minimum operating temperature-40 Cel
Maximum supply/operating voltage6 V
Minimum supply/operating voltage2.5 V
Rated supply voltage5 V
Number of input and output buses8
Processing package description4.40 MM, plastic, MO-152, SOT-266-1, SSOP-20
Lead-freeYes
EU RoHS regulationsYes
stateACTIVE
CraftsmanshipCMOS
packaging shapeRectangle
Package SizeSMALL OUTLINE, 低 PROFILE, SHRINK PITCH
surface mountYes
Terminal formGULL WING
Terminal spacing0.6500 mm
terminal coatingNickel Palladium
Terminal locationpair
Packaging MaterialsPlastic/Epoxy
Temperature levelINDUSTRIAL
Microprocessor typeUniversal PIA
Number of ports1
INTEGRATED CIRCUITS
DATA SHEET
PCF8574
Remote 8-bit I/O expander for
I
2
C-bus
Product specification
Supersedes data of September 1994
File under Integrated Circuits, IC12
1997 Apr 02

PCF8574 Related Products

PCF8574 PCF8574AP PCF8574AT
Description 8 I/O, PIA-GENERAL PURPOSE, PDSO20 8 I/O, PIA-GENERAL PURPOSE, PDSO20 8 I/O, PIA-GENERAL PURPOSE, PDSO16
Number of terminals 20 16 16
Maximum operating temperature 85 Cel 85 °C 85 °C
Minimum operating temperature -40 Cel -40 °C -40 °C
surface mount Yes NO YES
Terminal form GULL WING THROUGH-HOLE GULL WING
Terminal location pair DUAL DUAL
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Is it Rohs certified? - conform to incompatible
Maker - Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.)
package instruction - DIP, DIP16,.3 SOP, SOP16,.4
Reach Compliance Code - unknow _compli
JESD-30 code - R-PDIP-T16 R-PDSO-G16
JESD-609 code - e4 e0
Number of digits - 8 8
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - DIP SOP
Encapsulate equivalent code - DIP16,.3 SOP16,.4
Package shape - RECTANGULAR RECTANGULAR
Package form - IN-LINE SMALL OUTLINE
power supply - 3/5 V 3/5 V
Certification status - Not Qualified Not Qualified
technology - CMOS CMOS
Terminal surface - Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb)
Terminal pitch - 2.54 mm 1.27 mm

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