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PCD5041

Description
DECT burst mode controller
CategoryWireless rf/communication    Telecom circuit   
File Size132KB,28 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Download Datasheet Parametric Compare View All

PCD5041 Overview

DECT burst mode controller

PCD5041 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionQFP, QFP64,.7X.95,40
Reach Compliance Codeunknown
JESD-30 codeR-PQFP-G64
JESD-609 codee0
Number of terminals64
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeQFP
Encapsulate equivalent codeQFP64,.7X.95,40
Package shapeRECTANGULAR
Package formFLATPACK
power supply3/5 V
Certification statusNot Qualified
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1 mm
Terminal locationQUAD
INTEGRATED CIRCUITS
DATA SHEET
PCD5041
DECT burst mode controller
Objective specification
Supersedes data of October 1992
File under Integrated Circuits, IC17
1996 Oct 31

PCD5041 Related Products

PCD5041 PCD5041H PCD5041HZ
Description DECT burst mode controller DECT burst mode controller DECT burst mode controller
Is it Rohs certified? incompatible incompatible incompatible
Maker Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.)
package instruction QFP, QFP64,.7X.95,40 QFP, QFP64,.7X.95,40 QFP, QFP80,.55SQ,20
Reach Compliance Code unknown unknown unknow
JESD-30 code R-PQFP-G64 R-PQFP-G64 S-PQFP-G80
JESD-609 code e0 e0 e0
Number of terminals 64 64 80
Maximum operating temperature 70 °C 70 °C 70 °C
Minimum operating temperature - -25 °C -25 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QFP QFP QFP
Encapsulate equivalent code QFP64,.7X.95,40 QFP64,.7X.95,40 QFP80,.55SQ,20
Package shape RECTANGULAR RECTANGULAR SQUARE
Package form FLATPACK FLATPACK FLATPACK
power supply 3/5 V 3/5 V 3/5 V
Certification status Not Qualified Not Qualified Not Qualified
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level COMMERCIAL OTHER OTHER
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING GULL WING
Terminal pitch 1 mm 1 mm 0.5 mm
Terminal location QUAD QUAD QUAD
Maximum slew rate - 12 mA 12 mA
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